日本东京精密

日本东京精密 东京精密株式会社 公司简介 东京精密株式会社是日本著名半导体制造设备之一,公司总部设在日本东京都三 鹰市, 在美国,欧洲,新加坡,中国等地设有分公司,研发基地或生产厂等. We develop our businesses in two key areas: semiconductor manufacturing equipment and precision measuring systems. Our philosophy is to generate long-term growth through the creation of "WIN-WIN," or mutually beneficial, relationships, with all our stakeholders - customers, business partners, shareholders and employees.(公司网站原文) 东京精密主要从事半导体加工设备及精密测量仪器制造及开发. 半导体加工设 备有硅片加工用地倒角机、内圆切片机, 半导体加工前道工序用的光刻机 (LEEPL)、CMP、晶片表面综合检查设备及测试封装用的探针台、划片机、 硅片背面抛光机等. 过去，东京精密简称“TSK”，在国内半导体行业享有盛誉。现在东京精密 采用了新的商标“ACCRETECH”，她是由英文成长ACCRETE和技术 TECHNOLOGY的合成词，是融合公司”以WIN-WIN精神工作，创世界一流产 品“经营理念的新标志。 参展产品:硅片材料的内圆切片机、硅片倒角机，光刻机，CMP，硅片表 面检查系统，探针台背面减薄抛光机，划片机。 网址: Semiconductor Manufacturing Equipment:Product list Wafer Manufacturing System Variety of products line for wafer manufacturers including Wafer Slicing Machine and Wafer Edge Grinding Machine. Sliced Wafer Carbon Demounting and Cleaning Machine : C-RW-200/300 Automatic demounting of wafers from the slicing base, cleaning and storing into the cassette. Wafer Edge Grinding: W-GM-5200 , Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. , The non-contact measuring method achieves the stable alignment. , Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. , The modular concept to make the optimum process line possible. , Low damage grinding method is available. Machine specification ready for 300 mm and 200 mm wafer. Visual system (optional) for measuring the chamfer width of periphery and notch. Wafer Edge Grinding: W-GM-4200 , Newly-developed grinding unit enhances the rotative precision of the spindle, and improves the surface roughness. , The non-contact measuring method achieves the stable alignment. , Performs the non-contact measuring of the pre-processed wafer thickness at multiple points, the diameter and notch depth of the post-processed wafer. , The modular concept to make the optimum process line possible. , Low damage grinding method is available. Machine specification ready for 75 - 150 mm wafer or for 150 - 200 mm wafer. Capable of various material processes, such as chemical compound semiconductor. Wafer Slicing Machine: S-LM-116G Precise slicing machine for fragile materials such as glass, ceramics, ferrite. 16"-size blade for easy handling, lifting and adjustment. Open-structure loading unit for easy mounting of the workpiece. Easy setting of slicing speed and wafer thickness with digital switch. Strong frame, highly rigid table provides long-term stability in performance. Easy coolant adjustment and dressing operation. Wafer Slicing Machine: A-WS-100S Scribes wafer substrate with high precision Easy alignment With fine adjustment in horizontal and rotative directions Easy scribe setting With the touch panel to set the index amount, number of times of scribing, etc. CMP CMPs remove unevenness on wafer surfaces that occur during the production process. Applications are growing due to the increase of layers in semiconductor devices and the growing variety of wiring materials. ChaMP: For 300mm Wafers Combining the technological expertise built up by Accretech in precision measuring equipment and semiconductor manufacturing equipment, we now offer "the ChaMP Series", the CMP systems compatible with 300 mm wafers, with process performance required by design rules for 90 nm and 32 nm devices, and able to keep up with the most advanced volume-production fabs. Feature 1Air-float Head "Sylphide" , Reference polishing is made possible via an air cushion that provides uniform pressure distribution. , Wafer pressure is applied by an airbag independent of ring pressure, providing excellent low-pressure controllability and stability. , Zone control is available. Feature 2Edge Exclusion of 1 mm! Feature 3Wafer Pressure Controllability & Repeatability Feature 4Simple Maintenance for Polishing Heads - Ring Change Demounting (approximately 5 seconds) Slide the snap ring cover up with both hands Spread the snap ring with your thumb (the retaining ring drops off) Completely remove the retaining ring Mounting (approximately 10 seconds) 1. Grip the snap ring with both hands and push the retainer into the carrier. Rotate it slightly to align the faces where the positioning frame slips into place. 2. Attach the snap ring round the whole circumference and slide the cover down. ChaMP: For 150 or 200mm Wafers For 150 or 200mm Wafers ChaMP: Compact CMP System Small footprint Wafer Probing Machines Wafer probing machines perform electrical tests of each chip on a wafer, ensuring the quality of semiconductor devices. Wafer Probing Machines: UF3000EX Next-generation high-spec probing machine the world No.1 supplier presents Phenomenal levels of throughput have been made possible with the synergistic effects of high-speed wafer handling enabled by a new algorithm, and the high-speed and low-noise XY Stage enabled by a newly developed purpose-built drive unit for probes. The Z axis ensures world-class load capacity and high precision, and offers excellent contact via an optimal structural design that employs topology which reliably eliminates changes in flatness due to positioning. With advanced OTS latest positioning system technology and by colorizing wafer alignment imaging and equipping a light super magnification function, the UF3000EX has improved dramatically in terms of precision and operability. Wafer Probing Machines: UF3000EX-e Assimilating the up-to-date technologies such as originative OTS, QPU and TTG, this super high-spec system provides the testing system which meets your needs for the miniaturization of the next-generation devices and various testing environment. OTS - the newest positioning technology (Optical Target Scope) OTS enables to measure the relative position of the cameras with absolute accuracy, which improved dramatically. Based on the ACCRETECH metrology technology, OTS enables the self-correlation of the alignment optical system. QPU - super high-rigid chucking (Quad-Pod Unit) To effectively attain the accuracy in positioning, the high rigidity of every part is greatly important. The UF3000 uses the new technology of 4 axes driving mechanism (QPU) for Z-axis, enabling the high-rigid, stable probe contact. Load-port Testing environment satisfying the users' needs is available by the common platform of 8-inch and 12-inch cassettes and the front allocation of the inspection tray. The machine is also ready for AMHS (Automated Material Handling System). TTG (Touch To Go) Pursuing the easy operation, the UF3000 adopts the function to move to the position you touch on the map or image shown on the touch panel. Setting up is easy, and screen configuration is possible by the user definition. Wafer Probing Machine: UF2000 Tokyo Seimitsu, now known as Accretech, has continued to lead the semiconductor industry as the world's number one manufacturer of wafer probing machines. The newly developed UF2000 high-precision 200mm wafer prober is designed for devices with decreasing pad pitches typified by LCD drivers and other such devices, and features enhanced functionality in all areas, while offering the same functions and operating ease as the previous model. Achieves overall precision of ?1.5µm. Adopts new processor, newly designed loader and image processing system with enhanced performance, dramatically boosting throughput. Wafer Probing Machine: UF200R Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system. 8-inch multipurpose machine. Wafer Probing Machine: UF190R Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system. High-performance, high-throughput, and excellent cost performance machine. The UF190A features the same high-performance and excellent operability as the UF200 earned a reputation including the automatic needle alignment function and the color LCD touch panel. Wafer Probing Machine: FP200A Evolving and Proliferating Wafer Probing Machine, UF Series Based on a flexible platform, the high accuracy and high rigidity, UF series is further evolved. Wafers are varying with the progress of line width shrinkage and assembly technology. This machine can be used for processing very thin wafers and can be used as a handler for the wafer level burn-in system. Frame transfer ready for the thinner wafer. Wafer Probing Machines Network: VEGANET The operation status of the wafer probing machines can be centralizedly monitored to further improve the operation rate System monitor Operation rate control Prober status monitor Data analysis Wafer Probing Machines Network: LIGHTVEGA The resource control will be centralized on the user host Wafer Probing Machines Network: GEM Network System Wafer Probing Machines Network: VEGA PLANET Dedicated terminals contributing to the efficiency enhancement of test areas Device data compile terminal Remote operation terminal Logging data analysis terminal Map viewer Polish Grinders Polish grinders simultaneously thin wafers while performing damage removal caused by the grinding process, and offer various applications for peripheral processes in the one system. Polish Grinder: PG3000/PG200 PG3000 PG200 The product of a unique ACCRETECH innovation, this Polish Grinder combines the wafer thinness required for IC cards and three-dimensional mounting technology with damage removal functions in a single device. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table. The smallest footprint in the world Environmental - friendly - subsurface damage reduction without chemicals. System configuration Polish Grinder: PG3000RM/PG200RM PG3000 RM : For 300mm Wafers PG200 RM : For 200mm Wafers ACCRETECH also offers the "RM option", having the additional process of the tape removing for thinner wafer after the tape mounting, in addition to the standard process of PG300/200. Optional RM module The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table. The smallest footprint in the world. Environmental - friendly - subsurface damage reduction without chemicals. System configuration Wafer Dicing Machines Wafer dicing machine cut wafers into individual semiconductor chips with blades. ACCRETECH Laser dicing machines use lasers instead of blades to dicewafers at high speed in a completely dry process. Wafer Dicing Machines:AD3000T/S Tokyo Seimitsu Wafer Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology. Wafer Dicing Machines:A-WD-200T High throughput achieved by a new concept The A-WD-200T uses an opposing, twin spindle arrangement. This unique concept minimizes motion and delivers a massive boost in throughput. Wafer Dicing Machines:A-WD-250S Fully automated dicing machine for 8 inch wafer and large-sized substrates Wafer Dicing Machines: AD20T Revolutionary axis design orientation creates the smallest twin spindle Dicing Saw Wafer Dicing Machines:A-WD-10B This multipurpose dicing machine realizes ease of use with the adaptation of the much sought-after space saving factor, slide cover system and function management system. Wafer Dicing Machines:PS280 Now, with two independent stages, cutting and positioning can proceed in parallel. The result - a maximum dicing speed up to twice that previously possible! New connected handlers, shorten coordination time - bringing increased operation efficiency and substantial savings in processing time. Automatic Cleaning System:A-CS-100A Stand-alone wafer cleaning unit, A-CS-100A will provide best solution for cleaning and drying the wafer such as sawn with semi-automatic dicing saws. High-pressure water spray up to 10 MPa driven by horizontal swinging arm will achieve excellent cleaning quality. Wafer Dicing Machines:ML300 High performance laser dicing machine for 300 mm wafers with SDE. Wafer Dicing Machines:ML200 We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance. Precision ACCRETECH Blade With the diamond, the world-hardest substance, super-abrasive grit, we offer the cutting blade and solution that are high quality and cost cutting. , Precision ACCRETECH Blade Product list Measuring Systems:Product list "No measurement,no manufacturing" - ACCRETECH supplys the best from Multi-perpose measuring to In-line measuring. Automatic Measuring Systems Machine control gauges control processing machines based on data taken before, during and after operation. This indispensable system is used to prevent defects and boost accuracy in manufacture, thereby raising productivity. We also produce air micrometers, electric micrometers and high-precision sensors. , Machine Control Gauges , Various Sensors and Electric / Air Micrometers , High Precisions Digital Measurement Instrument , Laser Interferometer / Built-in Measuring Instruments , Automatic Measuring Systems Industrial Measuring Systems We manufacture a variety of high-precision industrial measuring systems, including: 3D Coordinate Measuring Machines, Surface Texture and Contour Measuring Instruments and Cylindrical Form Measuring Instruments. , 3D Coordinate Measuring Machines , Surface Texture and Contour Measuring Instruments , Roundness and Cylindrical Profile Measuring Instruments