PADS内电层分割与铺铜

PADS内电层分割与铺铜PadStadcs...DrflPairs,,.jPro)G£tExpJorerJumpers...软件：PADSLAYOUT9.3〔PADS2022也可以参考通用步骤〕二、一般步骤I多层板的分割一般步骤为：定义叠层T设置层的属性〔正、负片〕T分配网络T分割T铺铜.首次定义多层板的叠层结构.四层板堆叠一般为：SIG1/GND/POWER/SIG2六层板堆叠为：①SIG1/GND/SIG2/SIG3/P0WER/SIG4②SIG1/GND1/P0WER/SIG2/GND2/SIG3在PADS当中板层定义如下列图所示::FileEditViewg总H11MT即Prcyectljntegratjon-.HDesignRules...LarerDefinition..,SetOriginDispl曲CokjrsnrCtrl^-Alt'K1'A'xfLayersSetupLev.TypeDir.血me;Top0:45ElectricaJL苦yftrTyps⑥ComponentPlariftTvpe@WoRaneOCAMPlaneOSplit/MwedQA□□tingRflUtingDirechcn◎HorKoHaSQ45OyerticdOAnijElectricalLayeis1".k"I:■'Ll-jS'C^urtt:40^G4［时odilV..-IReassj口rt...NonelectiicalLayersConnr：2S0(186Endble/Disable...\-^:rLi；'!'?其次,为电源层分配电源网络.nLayersSetupLev.TypeDir.NwmeCM3RXHPOWER114CMVSattonn\,105GNLayef_l05\HoeGNLm卿」DS\,107GNLaileT_107\拥0,1CMHbHTVIFWE用F.oudr7j1PlanftTypERentingDirecHcnONoRane◎HorboHaS0450CAMPlaneOSfertiedO?5®Split/MwedOAnijElectricalL日yefs'',br|：•二Th・II-J：iiirlC^urtt:40^G41KlodifV...1ReaSSI口rt...ElectricaJ仙剖T咖NonelectiicalLayersAssenNetsCoLinr：2S0(186Endbte/Disable...門FlaiitL^jeEletsL:礎'*25VIX_3AiKPciattdHdj_VDDAL证JDNH*35vn.忙那禹N>[*nr上图中强调一下“PlaneType〞的问题.首先从工艺角度讲,内电层实物为薄薄的铜箔.在制造流程上有“正片〞和“负片〞之分.在PADSLAYOUT中,内电层属性配置当中,CAMPLANE为负片属性,其他两层为正片属性.以下局部是摘自PADSheIp文件：NoPlane—Preventsplanesfrombeingaddedtothelayer.TheNoPlanelayerisavailableforrouting.IfyouselectNoPlane,youcanonlycreateCopperandCopperPourareasonthelayer.CAMPlane—Setstheentirelayertobesolidcopperandconnectedtoonlyonenet.TheCAMPlanelayerisanegativeimage,andthecopperdoesnotappearinthedesignasitnormallydoesforallothercopperobjects.Youcannotmanipulatetheshape/outlineofthecopperonthislayersinceitisgeneratedautomaticallyandcoverstheentirelayer.Thisisanoutmodedlayertype.YoucannotroutetracesonaCAMPlanelayer.CopperPoursandPlaneareascannotbecreatedonCAMPlanelayers.Split/MixedPlane—Enablesoneormoreplanesonthelayer,andenablesroutingonthelayer.Routescanbeplacedwithinorwithoutplaneareas.Planeareasavoidtraceswithintheiroutlinebyaclearanceareadefinedinthedesignrules.CopperPourscannotbeplacedonSplit/Mixedlayers.PlaneareasarecreatedonSplit/Mixedplanelayersandaresimilartobutmorefeature-packedthanCopperPours.简单的讲,我们可以在NOPLANENOPLANECAMPlane负片方式显示的.操作.自由度更大一些,除了“PlaneArea〞以及相关的操作命令不能用以外,层进行布线、铺铜、铺铜切割、2D图形边框的绘制等常用操作.层只能赋予直观的讲,暗的区域实际为整片的铜箔,Split/MixedPlane电层,只能通过“是PADS专门针对多电源系统内电层分割给出的内电层属性.Planearea爰I〞命令以及“autoplaneseparate〞命令进行电源层分割.赋予该属性的内“单一网络〞,可以是整片的电源也可以是地网络.在本层中,铜箔是以本层不能进行布线、铺铜和planearea注意：电源层层属性的选择也可以选择为其他性质〔如NOPLANE〕.唯一需要注意的是,前期层属性的不同将导致后期铺铜方式的改变.否那么就会发生无法铺铜或者铺铜错误的情况.第三、分割操作.下文主要说明电源层为Split/MixedPlane属性的情况.该属性下,分割操作使用Autoplaneseparate命令.这里首先绘制铺铜的keepout层,这样可以预防每层的敷铜边界不一致的问题.利用Planearea命令依据PCB外框画出整体敷铜边框,完成后.右键选择“selectshape〞,双击选择该边框或者右键调用属性菜单.弹出以下菜单：rDrafting;PropertiesITTypE：W册1—PlaneAreaScalefaetcrrArcawroHimatioherror|口5Ratdtionc▼0.000Irackclearance:r/aOption?HetLaijer*■"powerNelalignmentTo6貓i曲anet.selectaneiintheNetlistaridclickYoucandibodickAssignNetbyClickandthenselectadesignobjectintheworkspace.Nel*时比IRestrictions如antipm!pe<'M'-LL.i[:1_.Ill,IDjf1inirQ-:Ih：III'I:RfpomM匚卫Piue^pviUna；'；d訂岛肚就炉2[竺?ptiir!'ISel?crAirAccordions□E][Hwlp」idssiynN袖切口心订]在Netassignment选项中分配一个最大的电源网络给当前内电层.然后点击进入"单：Options〞菜[产Pltwrt静OptOptiorksHlDehdhEOK]1屮IInrj51匚^ncel1'iiifluhnumii'1总结