国巨电容规格书

YAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-1-1.SUBJECT:ThisspecificationappliesonthechipcapacitormadebyYageoCorporation.2.PARTNUMBER:Partnumberofthechipcapacitorisidentifiedbythesize,tolerance,packing,materialandcapacitorvalue.Example:CC0805KKX7R9BN104Code1~2SeriesNameCC=Multi-layerchipcap.CA=Cap.ArrayCL=Low.InductanceCode3~6SizeCodeinches(mm)0402(1005)0603(1608)0805(2012)1206(3216)1210(3225)1808(4520)1812(4532)2220(5750)Code7CapacitancetoleranceA=±0.05pFG=±2%B=±0.1pFJ=±5%C=±0.25pFK=±10%D=±0.5pFM=±20%F=±1%Z=-20%+80%Code8PackingstyleR=Papertapereelϕ7inchP=Papertapereelϕ13inchK=Embossedplastictapereelϕ7inch.F=Embossedplastictapereelϕ13inch.B=BulkBagC=BulkCassetteCode9~11MaterialNPOX7RZ5UY5VCode12Ratedvoltage5=6.3V6=10V7=16V8=25V9=50V0=100VA=200VB=500VC=1000VD=2000VE=3000VY=250VZ=63VCode13TerminationB=Ni-barrierA=PdAgCode15~17CapacitanceValue(2significantdigits+No.ofZeros)The3rddigit:0=×13=×1031=×104=×1042=×1025=×1056=×106LetterRisdecimalpointCode14SeriesN=NonBMEB=BMEYAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-2-3.ELECTRICALCHARACTERISTICSRequirementClassIClassIICharacteristicsTestconditionsNPOX7RY5VZ5UOperationtemperaturerange-55°Cto125°C-55°Cto125°C-25°Cto85°C+10°Cto+85°CTemperaturecharacteristic/coefficient(TC)Withrespectto20°C(25°C,forY5V、Z5U)withinoperationtemperaturerangeNPO16V,0±60ppm/KNPO>16V,0±30ppm/K±15%+30%to–80%+22%to–56%CapacitancetoleranceC<5pF;±0.25pFC≥≥≥≥5pF;±0.5pFC≥≥≥≥10pF;±5%,±10%±10%,±20%±20%,-20%~+80%±20%,-20%~+80%Dissipationfactor(Tanδ)Withrespectto20°C(25°C,forY5V、Z5U)NPO:C≤1000pF1Vrms/1MHzC>1000pF1Vrms/1KHzX7R/Y5V:1Vrms/1KHzZ5U:0.5Vrms/1KHzC<10pF:Tanδ≤10(3/C+0.7)x10-4or30x10-4whicheverisless.C≥10pFTanδ≤10x10-4Tanδ≤2.5%,50VTanδ≤2.5%,25VTanδ≤3.5%,16VTanδ≤5%,10VTanδ≤5%or≤7%,25V/50VdependingoncapacitancevalueTanδ≤9%or≤12.5%,16VdependingoncapacitancevalueTanδ≤12.5%,10VTanδ≤4%,50VTanδ≤6%,25VTanδ≤9%,16VInsulationresistance(IR)AtUr(ratedvoltage)for1minuteUr>500V,at500V(DC)for1minuteRins>10GΩorRinsxC≥500s,whicheverisless.Rins>10GΩorRinsxC≥500s,Whicheverisless.Rins>10GΩorRinsxC≥100s,whicheverisless.DielectricwithstandingVoltageAt2.5Ur(forUr≤100V)1.5Ur+100V(forUr>100V)1.5Ur,Ur=1000V1.2Ur,Ur>1000Vfor5SecondNobreakdownYAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-3-4.DIMENSION(mm)LWTL1；L2L3StyleMIN.MAX.MIN.MAX.Min.CC04021.0±0.050.5±0.050.450.550.150.300.40CC06031.6±0.100.8±0.100.700.900.200.600.40CC08052.0±0.101.25±0.100.501.350.250.750.55CC12063.2±0.151.6±0.150.501.350.250.751.40CC12103.2±0.202.5±0.200.501.800.250.751.40CC18124.5±0.203.2±0.200.501.800.250.752.20CC22205.7±0.205.0±0.200.501.800.250.752.20Unit:mmTLL1L2WL3YAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-4-AgingRateAgingCurve-30-20-100101101001000Hours∆C/C(%)NPOX7RY5VYAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-5-ReflowProfileTempTime(seconds)℃245225183150235±10120-180Sec.60-100Sec.ProfileParameters參數1-2℃℃℃℃/Secramp溫昇Preheat150-183℃：℃：℃：℃：2-3minutesTimeabove183℃：℃：℃：℃：60-100secondsPeakTemperature：：：：230±±±±10℃℃℃℃Moduleshouldonlybeinovenfor5.5-6minuteYAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-6-5.TESTSANDREQUIREMENTSRequirementsIEC384-10TestitemsConditionsNPOX7RY5V4.9BendingBendingrate1mm/s,jig.Radius340mm∆C/C≤1%∆C/C≤10%∆C/C≤20%4.10Resistancetosolderingheat260±5°Cfor10±0.5sinstaticsolderbath∆C/C≤0.5%or0.5pF,whicheverisgreater-5%≤∆C/C≤10%-10%≤∆C/C≤20%4.11Solderability235±5°Cfor2±0.5sinastaticsolderbath75%minimumcoverageofmetallicarea4.12RapidchangeoftemperatureNPO/X7R:-55°Cto+125°C,5cyclesY5V:-25°Cto+85°C,5cycles∆C/C≤1%or1pF,whicheverisgreater∆C/C:≤15%∆C/C:≤20%4.14Dampheat,steadystateAt40°C,90to95%RHandUrapplied(max.500V,for56days(500hoursforY5V)Class2only56daysat40°C,90to95%RH,Novoltage(forUr≥1kV)PreconditionforClass2Ur≤16V∆C/C:2%or1pFwhicheverisgreaterTanδ:≤2xspecifiedValueIR:2500MΩorRxC≥25swhicheverisless∆C/C:≤15%Tanδ:≤7%IR:1000MΩorRxC≥25sWhicheverisless-40%≤∆C/C≤30%Tanδ:≤7%,12.5%,15%IR:1000MΩorRxC≥25sWhicheverisless4.15EnduranceAtuppercategorytemperature,2xUrapplied(1.5UrforUr>50V,1.2UrforUr≥1KV)for1000hoursClass2only1000hours,Atuppercategorytemperature,Novoltage(forUr≥1KV)PreconditionforClass2Ur≤16V∆C/C:2%or1pFwhicheverisgreaterTanδ:≤2xspecifiedValueIR:4000MΩorRxC≥40swhicheverisless∆C/C:≤20%Tanδ:≤7%IR:2000MΩorRxC≥50sWhicheverisless-40%≤∆C/C≤30%Tanδ:≤7%,12.5%,15%IR:2000MΩorRxC≥50sWhicheverislessPCBLayoutforReliabilitytest:SolderresistSolderlandYAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-7-NPO16V25V50V100V200V500V1kV2kV3kV4kVCapacitance040206030402060308051206121004020603080512061210181206030805120612101812080512061210181212061210181212061812120618081812180818120.470.560.680.821.01.21.51.82.22.73.33.94.75.66.88.21012151822333947566882100120150180220270330390470560680820100012001500180022002700330039004700560068008200100001200015000180002200027000330003900047000(pF)YAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-8-X7R10V16V25V50V100V200V500V1kV2kVCapacitance060308051206040206030805120604020603080512061210040206030805120612101812222008051206121018120805120612101812120612101812120618081812180818120.10.120.150.180.220.270.330.470.560.680.8211.21.51.82.22.73.33.94.75.66.88.2101215182227333947566882100120150180220270330390470560680820100012001500180022002700330039004700(nF)YAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-9-Y5VY5V10VY5V16VY5V25VY5V50VZ5U25VZ5U50VCapacitance0603080512061210040206030805120612100603080512061210060308051206060312060805120612100.0100.0220.0470.100.220.471.02.23.34.71022(uF)YAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-10-commendeddimensionofsolderlandsReflowsolderingFOOTPRINTDIMENSIONS(mm)PlacementAccuracyStyleABCD(mm)CC04021.50.50.50.5±0.15CC06032.30.50.90.9±0.25CC08052.80.90.951.4±0.25CC12064.02.01.01.8±0.25CC12104.02.01.02.7±0.25CC18085.43.31.053.3±0.25CC18125.43.31.053.3±0.25CC22206.64.51.053.3±0.25WavesolderingFOOTPRINTDIMENSIONS(mm)PlacementAccuracyStyleABCD(mm)CC06032.70.90.90.8±0.25CC08053.41.31.051.3±0.25CC12064.82.31.251.7±0.25CC12105.32.31.502.6±0.25BCADsolderland/solderpastepatternPreferreddirectionduringwaveYAGEOCORPORATIONCORPORATIONCORPORATIONCORPORATION-11-MLCCQCFlowChartProcessStageControlPointPowderAnalysisofpowderBinderBallMillRecipeMillingtimeViscosityinnerpasteFoilCastingFoilWeightScreenPrintingPrintingwidthlaydownPressingPressureTemperatureCuttingFreeMarginBinderBurnOutWeightloss%outerpasteSinteringThermo-ringtemperatureTumblingRollingspeedDippingTerminationlengthCuringProfilesettingInnerdefectcheckDestructurePhysicalAnalysisPlatingSolderabilityTinconcentrationNiconcentrationTinthicknessNickelthicknessTestingC%1stpiececheckMechanicalM/CsettingMechanicalvisualMechanicaldefectQACap/TanDIR+HVBodyfaultitemEndterm.faultitemDimensionitemSolderabilityTapingPeeloffforceProductdefectTapingQ/ATapingdefectStockProcessFlowincominginspectionincominginspectionPrepareprocessMat'lProcessDueStageIncomingInspectionPackingMaterial