塑胶电镀介绍-platingPPT课件

塑膠電鍍介紹PlatingonPlastics塑膠電鍍介紹PlatingonPlastics塑膠電鍍原理及注意事項PrinciplesofPlatingonPlastic第一站素材選擇ABS塑料案例(Step1:SelectingMaterialABSPlasticCase)1.最好採用電鍍級ABS塑膠如圖所示其丁二烯含量15%~16%密著強度最好SelectstheABSplasticsshowingontherightwhichthebutadieneis15%-16%.Itsadhesionisbest.2.采用70%~95%PC+ABS要請供應商提供防火材料%、PC%、等相關資料Appliershouldofferfireproofmaterial,PC%,etc,andreferencesbeforeselecting70%-95%PC+ABS.3.塑膠電鍍原料應完全乾燥(含水率0.1%以下)Materialsofplatingonplasticshouldbedriedtotally.4.塑膠電鍍原料盡量避免染色Materialsofplatingonplasticmustpreventdyeing.5.塑膠電鍍原料UL認證MaterialsofplatingonplasticshouldbeattestedbyUL.0.51.52.02.53.03.54.04..51.0141915161718密著強度Kgf/cm丁二烯　ｗt%各材質丁二烯之含量塑膠電鍍介紹PlatingonPlastics塑膠電鍍原理及注意事項第二站模具設計Step2:MouldDesign1.塑膠電鍍模具必須預留電鍍夾具掛架點(以防產品變形及生產便利性)Remainspointsforelectroplatingrackinmouldofplatingonplastic.2.模具設計趨向：耐高溫不易頂開產生毛邊、射出點不可太細以防入水斷裂脫落、預防尖端放電(加框)、注意離模斜度、預留排氣孔、注意頂針粗細影響外觀及進膠口位置產生之結合線等Trendofmouldsdesign:Mouldsshouldofberesistanttohightemperatureandnoteasilyopentocreatecrudeoutline,theejectionpointshouldnotbetoosmalltoprevententeringwaterandbreaking.Preventsdischargeoftip.Remindstheventilator.Paysattentiontothatthicknessoftipwillinfluencetheexteriorandthecombinationlinecreatedintheejectionhole.5.模具需預留電鍍後膜厚及組裝間隙Remainthethicknessofmembranewhichformedafterelectroplating.3.塑膠電鍍模具成型盡量避免尖端設計，盡可能改為R角Adoptsroundcornerinsteadoftipcornerinmoulddesign.4.模具孔洞盡量設計導通，預防殘留藥水不易清洗Designspassageintheholetocleantheremnants.塑膠電鍍介紹PlatingonPlastics塑膠電鍍介紹PlatingonPlastics塑膠電鍍原理及注意事項第三站成型射出FormationandEjection5.尺寸確認：依廠商訂定長寬尺寸、範圍Affirmingthesize:decidesthesizeandrangeoflenthandwidthaccordingtotherequirementofthefirm.2.射出參數在不頂模、不起毛邊狀況下，盡可能拉高樹脂溶解溫度及模溫溫度，降低射出壓力及射出速度，以減少應力產生TheejectionparametersuchasplasticTmandmouldtempretureshouldriseashighaspossidbleandtheejectionstressandspeedshouldbereducedtolessenthestress.3.成形表面確認：不可有感結合線、刮痕、頂凸、拉模、縮水、起蒼、包風、及異色點(浮出表面上)等等Affirmingthesurface:Theremustbenocombinationline,scratch,etc.4.成型品包裝：用Tray(托盤)+紙箱，以防碰刮傷Packing:adopttrayandpapercasetopreventbeingscratched.1.脫模劑最好能不用，要用務必使用含氟水性脫模劑Avoidusingthemouldreleases,ifitisessentialtouseone,theFluorine-typemaybeusedspringly.塑膠電鍍介紹PlatingonPlastics塑膠電鍍原理及注意事項模溫與密著力關系relationbetweentempretureofmouldandadhesion樹脂溶溫度與密著力關系relationbetweenplasticmeltingtemperatureandadhesion射速與密著強度關系relationbetweenspeedofejectionandadhesion密著力(kgf/cm)Adhesion密著力(kgf/cm)Adhesion密著力(kgf/cm)Adhesion模溫(°C)tempretureofmould溶融溫度(°C)tempretureofplasticmelting射出速度(mm/sec)speedofejection0134201342013425060708021022023024025020000010305070塑膠電鍍介紹PlatingonPlastics第四站防鍍方式MethodsofPlating-proof塑膠電鍍原理及注意事項1.與機構R&D、RF、EMI、ESD、電子等人員討論絕緣區位置、熱溶點位置、卡勾防鍍、耳機孔迴朔、EMI歐姆值Discussespositionofinsulationareaandmeltingpoint,plating-proofofhooksinrack,EMIohm.2.防鍍方式：噴塗、貼膠、蝕刻、照影、印刷(依需求而決定)MethodofPlating-proof:sprayingpaint,etching,printing,etc.(decidedbyrequirements)塑膠電鍍介紹PlatingonPlastics硬度耐溶劑抗紫外線表面細膩邊緣覆蓋作業性膜厚均勻耐磨性R.C.A價格技術性灰塵毛屑附著液體垂涎電子功能EMIESD量產性良率金屬感電器電鍍>9H以上優良優良優良優良複雜優良優良通過普通高不會不會優良普通優良真空濺鍍+UV烤漆3H優良優良普通普通普通普通通過普通普通會會需二次加工優良普通彩色電鍍5H優良優良優良優良複雜優良優良通過貴高不會不會優良普通優良I.M.D4H優良通過優良普通普通普通通過普通普通會會需二次加工優良普通PU烤漆2HNG通過普通普通普通普通NG普通普通會會需二次加工優良普通UV烤漆3H優良優良普通普通普通普通通過普通普通會會需二次加工優良普通PVDTiNZrN>9H以上優良優良優良優良複雜優良優良通過最貴高不會不會優良普通優良水轉印2HNGNG普通普通普通普通NG普通普通會會需二次加工優良普通方法項目工業塑膠表面處理比較表塑膠電鍍介紹PlatingonPlasticsHardnessResistancetosolventANTI-UVFinenessofsurfaceVergecoverageoperationEvennessofmembraneR.C.ApriceTechniquenormAdhesionofdustDroppingofliquidElectricpowerfunctionEMIESDqualityofbatchproductionSenseaboutmentalElectricalApplianceplating>9HgoodgoodgoodgoodcomplexgoodPasssuccessfullyaverageHIGHNOYESgoodaveragegoodSprayingpaintinvacuum+UVpaint3HgoodgoodaveragegoodaverageaveragepaverageaverageYYSecondaryprocessisnecessarygoodaverageColorplating5HgoodgoodgoodgoodcomplexgoodPasssuccessfullyexpensiveHIGHNNOgoodgoodgoodI.M.D4HgoodpassgoodgoodaverageaveragepassaverageaverageYYSecondaryprocessisnecessarygoodaveragePUpaint2HNGpassaveragegoodaverageaverageNGaverageaverageYYSecondaryprocessisnecessarygoodaverageUVpaint3HgoodpassaverageaverageaverageaveragepassaverageaverageYYSecondaryprocessisnecessarygoodaveragePVDTiNZrN>9Hgoodpassgoodgoodcomplex優良PasssuccessfullyextremelyexpensivehighNONgood優良Printinwater2HNGNGaverageaverageaverageaverageNGaveragehighYNsecondaryprocessisnecessarygoodaverageItemChartofTreatmentsonPlasticSurfacegoodgoodaverageMethod塑膠電鍍介紹PlatingonPlasticsPrinciplePossibilities原理Pop_met0IonicCatalystLonic催化劑ColloidalCatalyst膠狀催化劑ConductiveSurface傳送面FinalLayers最終層Electroplating電鍍ElectrolessMetallDeposition無電鍍金屬沉澱SwellandEtch粗化ChromosulfuricAcidEtch鉻酸＋硫酸粗化ComparisonofFoxconn‘sProcesses制程對比Compa201.Cleaner(Option)清潔劑（任選）CrO3-Etch粗化Reducer還原劑PrePlateNicke預鍍鎳Electroplating電鍍Accelerator加速劑Coll.Pd–Catalyst離子催化劑PreDip預浸E‘lessNickel化學鎳Cleaner(Option)清潔劑（任選）CrO3-Etch粗化Reducer還原劑Electroplating電鍍CuLink銅槽Coll.Pd–Catalyst離子催化劑PreDip預浸Cleaner(Option)清潔劑（任選）Swell+Etch粗化Conditioner調解劑PrePlateNickel預鍍鎳Electroplating電鍍Reducer還原劑Ion.Pd–Catalyst離子催化劑E‘lessNickel化學鎳Cleaner(Option)清潔劑（任選）CrO3-Etch粗化Reducer還原劑PrePlateNickel預鍍鎳Electroplating電鍍Accelerator加速劑Coll.Ag–Catalyst離子催化劑E‘lessnickel化學鎳Cleaner(Option)清潔劑（任選）CrO3-Etch粗化PrePlateNicke預鍍鎳lElectroplating電鍍Reducer還原劑Ion.Pd–Catalyst離子催化劑E‘lessNickel化學鎳Noviganth341NoviganthAKFuturonNoviganthPA[Mellon]塑膠電鍍介紹PlatingonPlasticsStructureofPolymersonABS–BasisABS表面聚合物結構－基Abs_stru0塑膠電鍍介紹PlatingonPlasticsTheoryofAdhesion:MechanicalInterconnection黏合原理﹕自動連接Abs_aet30Toseparatethemetalfromtheplastic,energymustbeappliedtocompensatethecohesiveforcesintheplasticmatrix(green)orinthemetal(red).為將金屬從塑膠中分離出來﹐必須要求有能夠同塑膠母体（綠色）和金屬（紅色）的能量相抵之能量﹒塑膠電鍍介紹PlatingonPlasticsTypical„Polycarbonate“Blends典型“多碳酸鹽”混合blends10BayblendT45BayblendFR1441Polycarbonate聚碳酸鹽Polyacrylonitrile聚丙烯腈Polystyrene聚苯乙烯Polybutadiene聚丁二烯Filler,Pigments,...填充料顏料nArCNSANPB塑膠電鍍介紹PlatingonPlasticsSomePlateableGradePlastics可電鍍塑膠galvsub0Typ類型Name名稱Supplier供應商ABSABS+PCPPOPPPALCPTPONovodurP2MC,PM3CCycolacLustranPG299RonfalinCP55BayblendT45CycoloyNorylPN235Codyx4019GDurethanBM240Minlon73M40UltramidB3M6IXEFBayerAGGeneralElectricsMonsantoDSMBayerAGGeneralElectricsGeneralElectricsRTPBayerAGDuPontBASFSolvayVectraHoechstAGRDP98119Solvay塑膠電鍍介紹PlatingonPlasticsPerfectlyPretreatedABSSurface(SEM,5000x)完全粗化處理之ABS表面（SEM﹐5000x）absaet10塑膠電鍍介紹PlatingonPlasticsRinsing:Concept水洗﹕步驟Dragoutv=0,2l/m2Dragoutv=0,4l/m2Evaporationapprx80l/hReducer還原劑RinsingCascade水洗過程Etch粗化(SprayRinseshavetwicedilutionfactor)2kgCrO3=100m2etchedABS=5500Ah=230Ain24hR=C0/Cn=[Q/V]nCn=C0*[V/Q]n塑膠電鍍介紹PlatingonPlasticsEtchingRatesofBayblend(25cm²)andResultingAdhesionofPlatedMetalLayer.Bayblend(25cm²)粗化率及電鍍后之金屬面所產生的黏附力﹒etchrough000,20,40,60,811,21,41,60100200300400EtchingRate[mg]粗化率Adhesion[N/mm]黏附力塑膠電鍍介紹PlatingonPlasticsPalladium/TinCluster鈀/錫簇cluste10Cl-PdSn2+0,181nm0,128nm0,093nmR.L.CohenK.W.WestJ.Electrochem.Soc.120,502(1973)CoreDiameter:核心直徑3–4nmSn塑膠電鍍介紹PlatingonPlasticsElectrolessMetalDeposition(Model)化學金屬沉澱物eless00Activeplastic‘ssurface活性塑膠表面Startofmetal-deposition.開始出現金屬沉澱物Completemetalization:allactivatorparticlesareconnectedelectricallyconductive.金屬化完成﹕所有活性劑顆粒均結合在一起具導電性﹒塑膠電鍍介紹PlatingonPlasticsElectrolessNickelDepositionI化學鎳沉澱物IStartingReaction初期反應AdsorptionofReducer還原劑吸附作用Protolysis質子遷移AdditionofWater附加水Desorption解吸附作用塑膠電鍍介紹PlatingonPlasticsElectrolessNickelDepositionII化學鎳成份IISideReactions側邊反應RecombinationofHydrogenAtoms:HydrogenGasEvolution氫原子再結合﹕成為氫气‚Reduction‘ofHydroxide氫氧化物還原Phosphorous-CoDeposition磷酸根沉澱物塑膠電鍍介紹PlatingonPlasticsElectrolessNickelDepositionIII化學鎳成份IIIMetalDeposition金屬沉澱物MainReaction主要反應DirectReductionbyElektrons(only1%)由Elektrons直接還原（僅有1％）塑膠電鍍介紹PlatingonPlasticsMechanismoftheCuLink–Operation(Model)銅槽機能－操作（模型）culime01Activatorparticlesareboundtoaplastic‘ssurface.活化劑顆粒同塑膠件表面結合Chelatedcopperionsarereducedtoeithercopper(0)orcopper(I)bytin.螯合銅離子被錫還原成為銅（0）或銅（1）﹒Thecoppercrosslinksthepalladiumparticlesresultinginaelectroconductivesurfacelayer.銅与鈀顆粒交叉結合形成一個導電表層﹒塑膠電鍍介紹PlatingonPlasticsCuLink-Step:DependenceoftheElectricalConductivityofaPlastic‘sSurfacefromSurfaceBoundAmountofCopper.銅槽步驟﹕銅表面范圍同塑膠表面的電導率之依從關系﹒culres00020406080100050100150200Copper銅[µg/dm²]Conductivity[µS]導電性塑膠電鍍介紹PlatingonPlasticsSimplifiedModeloftheSpreadingofMetalduringPlatingaftertheCuLinkStep在完成銅槽步驟后﹐電鍍中金屬擴散的簡單模擬圖﹒culime20Palladiumclusterarecrosslinkedbycopperorbycopperions.鈀簇由銅或銅離子相交聯構成﹒Duringelectroplating,copperionsarereducedtocopper在電鍍的過程中﹐銅離子將被還原成銅.塑膠電鍍介紹PlatingonPlastics刚才的发言，如有不当之处请多指正。谢谢大家！