JEDEC工业标准

JEDEC工业标准环境应力试验[JDal]JESD22-A100-BCycledTemperature-Humidity-BiasLifeTest上电温湿度循环寿命试验,(RevisionofJESD22-A100-A)April2000[Text-jd001][JDa2]JESD22-A101-BSteadyStateTemperatureHumidityBiasLifeTest上电温湿度稳态寿命试验,(RevisionofJESD22-A101-A)April1997[Text-jd002][JDa3]JESD22-A102-CAcceleratedMoistureResistanee-UnbiasedAutoclave高加速蒸煮试验，(RevisionofJESD22-A102-B)December2000[Text-jd003][JDa4]JESD22-A103-ATestMethodA103-AHighTemperatureStorageLife高温储存寿命试验,(RevisionofTestMethodA103PreviouslyPublishedinJESD22-B)July1989[Text-jd004][JDa5]JESD22-A103-BHighTemperatureStorageLife高温储存寿命试验,(RevisionofJESD22-A103-A)August2001[Text-jd005][JDa6]JESD22-A104-BTemperatureCycling温度循环,(RevisionofJESD22-A104-A)July2000(参见更新版本A104C)[Text-jd006][JDa7]EIA/JESD22-A105-BTestMethodA105-BPowerandTemperatureCycling上电和温度循环,(RevisionofTestMethodA105-A)February1996[Text-jd007][JDa8]JESD22-A106-ATestMethodA106-AThermalShock热冲击,(RevisionofTestMethodA106-PreviouslyPublishedinJESD22-B)April1995[Text-jd008][JDa9]JESD22-A107-ASaltAtmosphere盐雾试验,(RevisionofTestMethodA107-PreviouslyPublishedinJESD22-B)December1989[Text-jd009][JDa10]JESD22-A108-BTemperature,Bias,andOperatingLife高温环境条件下的工作寿命试验,(RevisionofJESD22-A108-A)December2000[JDa11]JESD22-A110-BTestMethodA110-BHighly-AcceleratedTemperatureandHumidityStressTest(HAST)高加速寿命试验,(RevisionofTestMethodA110-A)February1999[Text-jd010][JDa12]JESD22-A113-BPreconditioningofNonhermeticSurfaceMountDevicesPriortoReliabilityTesting非密封表贴器件在可靠性试验以前的预处理，(RevisionofTestMethodA113-A)March1999[Text-jd011][JDa13]JESD22-A118AcceleratedMoistureResistanee-UnbiasedHAST不上电的高加速湿气渗透试验December2000[Text-jd012][JDa14]JESD22-B106-BTestMethodB106-BResistaneetoSolderingTemperatureforThrough-HoleMountedDevices插接器件的抗焊接温度试验,(RevisionofTestMethodB106-A)February1999[Text-jd013][JDa15]EIA/JESD47Stress-Test-DrivenQualificationofIntegratedCircuits集成电路施加应力的产品验收试验,July1995[Text-jd031][JDal]JESD22-A104CTemperatureCycling,(RevisionofJESD22-A104-B)May2005[Text-jd040]电应力和电测试试验[JDb1]JESD22-A114-BElectrostaticDischarge(ESD)SensitivityTestingHumanBodyModel(HBM)人体模型条件下的静电放电敏感度试验，(RevisionofJESD22-A114-A)June2000[Text-jd014][JDb2]EIA/JESD22-A115-AElectrostaticDischarge(ESD)SensitivityTestingMachineModel(MM)机器模型条件下的静电放电敏感度试验，(RevisionofEIA/JESD22-A115)October1997[Text-jd015][JDb3]JESD22-A117ElectricallyErasableProgrammableROM(EEPROM)Program/EraseEnduraneeandDataRetentionTestEEPROM的擦涂和数据保存试验，January2000[Text-jd016][JDb4]EIA/JESD78ICLatch-UpTest集成电路器件闩锁试验，March1997[Text-jd017][JDb5]JESD22-C101-AField-InducedCharged-DeviceModelTestMethodforElectrostatic-Discharge-WithstandThresholdsofMicroelectronicComponents微电子器件在电荷感应模型条件下的抗静电放电试验,(RevisionofJESD22-C101)June2000[Text-jd018]机械应力试验[JDc1]JESD-22-B103-ATestMethodB103-AVibration,VariableFrequency振动和扫频试验(RevisionofTestMethodB103PreviouslyPublishedinJESD22-B)July1989[Text-jd019][JDc2]JESD22-B104-ATestMethodB104-AMechanicalShock机械冲击(RevisionofTestMethodB104,PreviouslyPublishedinJEDECStandardSeptember1990[Text-jd020][JDc3]EIA/JESD22-B116WireBondShearTestMethod焊线邦定的剪切试验，July1998[Text-jd021][JDc4]JESD22-B117BGABallShearBGA焊球的剪切试验，July2000[Text-jd022][JDc5]JESD22B113BoardLevelCyclicBendTestMethodforInterconnectReliabilityCharacterizationofComponentsforHandheldElectronicProducts,March2006[Text-jd038][JDc6]JESD22-B111BoardLevelDropTestMethodofComponentsforHandheldElectronicProducts,July2003[Text-jd039]综合试验与测试[JDd1]JEDECStandardTestMethodA109Hermeticity密圭寸性试验，July1988[Text-jd023][JDd2]JESD22-A120TestMethodfortheMeasurementofMoistureDiffusivityandWaterSolubilityinOrganicMaterialsUsedinIntegratedCircuits集成电路器件中使用的有机材料水分扩散和水溶性测定试验方法,June2001[Text-jd024][JDd3]JESD22-B100-APhysicalDimensions物理尺寸的测量,(RevisionofTestMethodB100-PreviouslyPublishedinJESD22-B)April1990[Text-jd025][JDd4]JESD22-B101TestMethodB101ExternalVisual外观检查,(PreviouslypublishedinJESD22-B)September1987[Text-jd026][JDd5]EIA/JESD22-B102-CSolderabilityTestMethod可焊性试验方法,September1998[Text-jd027][JDd6]EIA/JESD22-B105-BTestMethodB105-BLeadIntegrity器件管脚的完整性试验,(RevisionofTestMethodB105-A)January1999[Text-jd028][JDd7]EIA/JESD22-B107-ATestMethodB107-AMarkingPermanency图标的耐久性试验,(RevisionofTestMethodB107-PreviouslyPublishedinJESD22-B)September1995[Text-jd029][JDd8]JESD22-B108CoplanarityTestforSurface-MountSemiconductorDevices表贴半导体器件的共面性试验,November1991[Text-jd030]其它[JDe1]JEP113-BSymbolandLabelsforMoisture-SensitiveDevices湿度敏感器件的符号和标识,(RevisionofJEP113-A)May1999[Text-jd032][JDe2]EIA/JEP122FailureMechanismsandModelsforSiliconSemiconductorsDevices硅半导体器件的失效机理和模型，February1996[Text-jd033][JDe3]IPC/JEDECJ-STD-020AMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别，April1999[Text-jd034][JDe4]IPC/JEDECJ-STD-033StandardforHandling.Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevices湿度/回流焊敏感标贴器件的处理、包装、运输和使用的标准，May1999[Text-jd035][JDe5]EIA/JEP103-ASuggestedProduct-DocumentationClassificationsandDisclaimers,(RevisionofJEP103)July1996[Text-jd036][JDe6]IPC/JEDECMoisture/ReflowSensitivityClassificationforNonhermeticSolidStateSurfaceMountDevices针对非密封表贴半导体器件的湿度/回流焊敏感度分类和级别，SupersedesIPC/JEDECJ-STD-020DAugust2007,March2008[Text-jd037]