SMT检验标准(PCBA)

检验项目:A-1零件脚吃锡不足SOPQFP(InspectionItem:A-1InsufficientSolderSOPQFPLead)允收(AcceptStandard)拒收标准(RejectStandard)吃锡应该达零件脚长的1/2以上及需有吃锡未达脚长1/2以上爬锡的状況Sidejointlength(D)islessthanSidejointlength(D)ismorethan50%of50%ofleadlength(L).leadlength(L).检验项目：A-2零件脚吃锡不足PLCCSOJ(InspectionItem:A-2InsufficientSolderPLCCSOJLead)允收标准(AcceptStandard)拒收标准(RejectStandard)吃锡高度(F)＞＝零件脚厚度(T)的1/2吃锡高度(F)<零件脚厚度(T)的1/2＋焊接物(G)+焊接物(G)Heelfilletheight(F)morethansolderHeelfilletheight(F)lessthansolderthickness(G)plus50%Leadthickness(T)thickness(G)+50%leadthickness(T)检验项目:A-3零件偏移SOPQFP(InspectionItem:A-3ComponentShiftSOPQFP)允收标准(AcceptStandard)拒收标准(RejectStandard)偏移:1.零件脚(W)超出PCB不可超过本体宽度的1.零件偏离焊垫且零件与焊垫接触面积(C)1/4占零件本体宽度(W)的3/4以下.Componentleadshiftoffthepad,utnotComponentleadshiftoffthepadexceed1/4widthofleadwidth(W)andcontactthepadlessthan3/4widthof2.对于尺寸小于0.5mm之QFP零件偏移量leadwidth(W)不可超过本体宽度的1/2.TheQFPcomponentleadofpitchlessthan0.5mmshiftoffthepad,butnotexceed1/2widthofleadwidth.检验项目:A-4零件偏移PLCCSOJ(InspectionItem:A-4ComponentShift)允收标准(AcceptStandard)拒收标准(RejectStandard)零件脚超出PCB(A)不可超过本体1/4(W)零件偏离焊垫且超出本体面积1/4(W).ComponentLeadshiftoffthepad,butnotComponentLeadshiftoffthepadandexceed1/4widthofLeadarea(W).exceed1/4widthofLeadarea(W)检验项目:A-5零件偏移(InspectionItem:A-5Componentshift)允收标准(AcceptStandard)拒收标准(RejectStandard)零件位於焊垫中心点.零件偏离焊垫且超出本体宽度1/4.ComponentbodyshiftoffthepadandComponentisonthecenterofpadexceed1/4Widthofbodywidth.检验项目:A-6吃锡过多(InspectionItem:A-6ExcessSolder)允收標準(AcceptStandard)拒收標準(RejectStandard)吃锡带形状如锥形.焊锡超过焊垫四周Tinexcessaroundofpad.Thecontourofsolderinglooklikeconicshape.锡过多结成球点Tintoomuchlooklikeballshape检验项目:A-7立件(InspectionItem:TombstoneEffect)允收标准(AcceptStandard)拒收标准(RejectStandard)零件位於焊垫中心点.零件高翘造成电极端未吃锡ComponentisonthecenterofpadChipcomponentsstandingontheirTerminalend(tombstone)检验项目:A-8反向(InspectionItem:A-8ComponentReverse)允收标准(AcceptStandard)拒收标准(RejectStandard)方向零件依PCB上方向标示上件零件上件方向与PCB上方向标示不同ThepolaritycomponentisinsertedThepolaritycomponentisinsertedaccordingwithpolarityindexonPCB.reversingwithpolarityindexonPCB.检验项目:A-9空焊(InspectionItem:A-9VoidSoldering)允收标准(AcceptStandard)拒收标准(RejectStandard)零件吃锡饱满,并延伸至焊垫边.零件脚吃锡未连接焊垫,造成空焊SolderwellandTinextendoversideofOneleadorseriesofleadsoncomponentpad.IsoutofalignmentandfailstomakePropercontactwiththeland.检验项目:A-10短路(InspectionItem:A-10ShortCircuit)允收标准(AcceptStandard)拒收标准(RejectStandard)零件吃锡部份无任何短路.零件吃锡部份造成短路.Thereisn’tanyshortcircuitonsolderpartThereisshortcircuitonsolderpartofofcomponent.component.检验项目:A-11缺件(InspectionItem:A-11OmittingPart)允收标准(AcceptStandard)拒收标准(RejectStandard)PCB零件数目与BOM零件数目相符合.PCB零件数目与BOM零件数目不符合.ThecomponentquantityofPCBhavetoThecomponentquantityofPCBdon’tmatchthecomponentquantityonBOMmatchthecomponentquantityonBOM.检验项目:A-12多件(InspectionItem:A-12ExcessParts)允收标准(AcceptStandard)拒收标准(RejectStandard)PCB零件数目与BOM零件数目相符合.PCB零件数目与BOM零件数目不符合ThecomponentquantityofPCBhavetoThecomponentquantityofPCBdon’tmatchthecomponentquantityonBOMmatchthecomponentquantityonBOM.检验项目:A-13掉件(InspectionItem:A-13MissingParts)允收标准(AcceptStandard)拒收标准(RejectStandard)PCB零件数目与BOM零件数目相符合.外力造成掉件ThecomponentofexternalforceThecomponentquantityofPCBhavetomakemissingpartsmatchthecomponentquantityonBOM检验项目:A-14焊垫吃锡不足(InspectionItem:A-14InsufficientPad)允收标准(AcceptStandard)拒收标准(RejectStandard)吃锡带形状如锥形焊垫吃锡面积未达75%以上.ThecontourofsolderinglookThesolderareadon’tlikeconicshape.excess75%ofpad.检验项目:A-15锡尖(InspectionItem:A-15SolderIcicle)允收标准(AcceptStandard)拒收标准(RejectStandard)零件脚无造成锡尖.零件脚造成锡尖.Thereisn’tanyicicleoncomponentleadThereisanicicleoncomponentlead.检验项目:A-16零件破损(InspectionItem:A-16ComponentBreakage)允收标准(AcceptStandard)拒收标准(RejectStandard)零件无任何裂痕或断裂零件外部有刮、刺、割、碰等损伤.Thereisn’tanybreakageorbreakThereissomescratch、dub、cutorbumpdamageoncomponentappearance.检验项目:A-17金手指缺点(InspectionItem:A-17DefectOnGoldenFinger)允收标准(AcceptStandard)拒收标准(RejectStandard)1.每面缺点不超过3根,单根不能超过两点﹐1.每面缺点超过3根,单根超过两点﹐缺点单点缺点单点不得大於金手指宽度1/4。大於金手指宽度1/4。Everysideofdefectislessthan3goldEverysideofdefectismorethan3goldsingers,singers,thegoldsingersismorethan2point,thethegoldsingersislessthan2point,thepointpointofofdefectismorethan1/4wideofgolddefectislessthan1/4wideofgoldsinger.singer.检验项目:A-18浮件(InspectionItem:A-19Floating)允收标准(AcceptStandard)拒收标准(RejectStandard)整个零件本体的长度全接触於基板面.零件本体与基板面高度大於0.5mm.ThewholecomponentbodytouchesthePCBThenearestdistancebetweencomponentandPCBismorethan0.5mm.检验项目:A-19锡渣(InspectionItem:A-20SolderResidue)允收标准(AcceptStandard)拒收标准(RejectStandard)PCB及零件皆无沾锡丝或锡渣.PCB或零件沾有锡丝或锡渣.Thereisn’tanysolderwireorsolderdregsonThereisasolderwireorsolderdregsonPCBorcomponent.PCBorcomponent.检验项目:A-20锡珠(InspectionItem:A-21SolderBall)允收标准(AcceptStandard)拒收标准(RejectStandard)1.锡珠直径0.127mm以下,及PCB每面3颗锡1.锡珠直径0.127mm以上,及PCB每面3珠以下.颗锡珠以上.Thediameterofsolderballisunder0.127mmThediameterofsolderballisunderandthereareunder3solderballononeside0.127mmandthereover3solderballonofPCBonesideofPCB2.锡珠离焊垫或线路在在0.127mm以外.2.锡珠离焊垫或线路在0.127mm以内.Solderballsbeyond0.127mmoflandsorSolderballswithin0.127mmoflandsortraces.traces.检验项目:A-21(InspectionItem:A-22OtherBodyAdhere)允收标准(AcceptStandard)拒收标准(RejectStandard)PCB无结晶状异物及白包沉淀物.PCB有结晶状异物及白色沉淀物.Therearen’tanycrystalsludgeandwhiteTherearesomecrystalsludgeandmagisteryonPCB.whitemagisteryonPCB检验项目:A-22锡裂(InspectionItem:A-23SolderCrack)允收标准(AcceptStandard)拒收标准(RejectStandard)吃锡带没有裂痕、面光亮平滑.吃锡带有裂痕.Thereisn’tanycrackonsolderingareaThereisacrackonsolderingarea.andthesurfaceisbrightandflat.检验项目:A-23锡洞(InspectionItem:A-24SolderCrack)允收标准(AcceptStandard)拒收标准(RejectStandard)吃锡带没有空洞、表面光亮平滑.一个针孔以上焊点上有小颗粒或气泡.Thereisn’tanycaveonsolderingareaAboveonelittlecave.andthesurfaceisbrightandflat.Thereisaprillorbubbleonsolderingarea.