电子元件标准规范中英文对照

电子元件规范中英文对照1GB/T1772-1979电子元器件失效率试验方法Determinationoffailurerateofelectronicelementsandcomponents2GB/T2036-1994印制电路术语Termsforprintedcircuits3GB/T2413-1980压电陶瓷材料体积密度测量方法Piezoelectricceramicmaterials--Measuringmethodsfordeterminationofvolumedensity4GB/T2470-1995电子设备用固定电阻器、固定电容器型号命名方法Typedesignationsystemforfixedresistorsandfixedcapacitorsforuseinelectronicequipment5GB/T2471-1995电阻器和电容器优先数系Preferrednumberseriesforresistorsandcapacitors6GB/T2472-1981电子设备用固定式电容器工作电压系列Fixedcapacitorsforelectronicequipments--Workingvoltageseries7GB/T2473-1981电子设备用矩形金属外壳电容器外形尺寸系列Capacitorswithrectangularmetalenclosureforelectronicequipments--Outlinedimensionsseries8GB/T2474-1981电子设备用圆形金属外壳电容器外形尺寸系列Capacitorswithdiscmetalenclosureforelectronicequipments--Outlinedimensionsseries9GB/T2658-1995小型交流风通用机技术条件A.C.miniatureblowers,generalspecificationfor10GB/T2693-1990电子设备用固定电容器第一部分:总规范(可供认证用)Fixedcapacitorsforuseinelectronicequipment—Part1:Genericspecification11GB/T2775-1993手控电子元件的轴端尺寸Dimensionsofspendleendsformanuallyoperatedelectroniccomponents12GB/T3351-1982人造石英晶体的型号命名Designationsforsyntheticquartzcrystals13GB/T3388-1982压电陶瓷材料型号命名方法Designationsfortypesofpiezoelectricceramics14GB/T3389.3-1982压电陶瓷材料性能测试方法居里温度Tc的测试Testmethodsforthepropertiesofpiezoelectricceramics--TestforCurietemperatureTc15GB/T3389.4-1982压电陶瓷材料性能测试方法柱体纵向长度伸缩振动模式Testmethodsforthepropertiesofpiezoelectricceramics--Longitudinallengthextensionvibrationmodeforrod16GB/T3389.7-1986压电陶瓷材料性能测试方法强场介电性能的测试Testmethodsforthepropertiesofpiezoelectricceramics--Testfordielectricpropertiesinhighelectricfield17GB/T3389.8-1986压电陶瓷材料性能测试方法热释电系数的测试Testmethodsforthepropertiesofpiezoelectricceramics--Testforthepyroelectriccoefficient18GB/T3664-1986电容器非线性测量方法Methodofmeasurementofnon-linearityincapacitors19GB/T3788-1995真空电容器通用技术条件Generalspecificationforvacuumcapacitors20GB/T4071-1983光致荧光粉测试方法Measuringmethodforthephosphorexcitedbylight21GB/T4072-1983阴极射线致荧光粉测试方法Measuringmethodofthephosphorexcitedbycathodrays22GB/T4098.1-1983射频电缆电晕试验方法Testmethodofcoronaforradio-frequencycables23GB/T4098.2-1983射频电缆电容和电容不平衡测量方法Methodsofmeasurementofcapacitanceandcapacitanceunbalanceforradio-freguencycables24GB/T4098.3-1983射频电缆特性阻抗测量方法Methodsofmeasurementofcharacteristicimpedanceforradio-frequencycables25GB/T4098.4-1983射频电缆衰减常数测量方法Methodsofmeasurementofattenuationconstantforradio-frequencycables26GB/T4098.5-1983射频电缆电容稳定性试验方法Testmethodofcapacitancestabilityforradio-frequencycables27GB/T4098.6-1983射频电缆衰减稳定性试验方法Testmethodofattenuationstabilityforradio-frequencycables28GB/T4098.7-1983射频电缆高温试验方法Testmethodofhigh-temperatureforradio-frequencycables29GB/T4098.8-1983射频电缆低温试验方法Testmethodoflow-temperatureforradio-frequencycables30GB/T4098.9-1983射频电缆流动性试验方法Testmethodofflowforradio-frequencycables31GB/T4098.10-1983射频电缆尺寸稳定性试验方法Testmethodofdimensionalstabilityforradio-frequencycables32GB/T4165-1984电子设备用可变电容器的使用导则Guidetotheuseofvariablecapacitorsinelectronicequipment33GB/T4166-1984电子设备用可变电容器的试验方法Methodsoftestofvariablecapacitorsinelectronicequipment34GB/T4210-1984电子设备用机电元件名词术语Termsofelectromechanicalcomponentsforelectronicequipment35GB/T4475-1995敏感元器件术语Termsofsensor36GB/T4588.1-1996无金属化孔单双面印制板分规范Sectionalspecification:singleanddoublesidedprintedboardswithplainholes37GB/T4588.2-1996有金属化孔单双面印制板分规范Sectionalspecification:singleanddoublesidedprintedboardswithplated-throughholes38GB/T4588.3-1988印制电路板和使用Designanduseofprintedboards39GB/T4588.4-1996多层印制板分规范Seetionalspocification--Multilayerprintedboards40GB/T4588.10-1995印制板第10部分:有贯穿连接的刚挠双面印制板规范Printedboards--Part10:Specificationforflex-rigiddouble-sidedprintedboardswiththroughconnections41GB/T4596-1984电子设备用三相变压器形铁心E-coresforthree-phasetransformersforuseinelectronicequipment42GB/T4677.1-1984印制板表层绝缘电阻测试方法Testmethodofsurfaceinsulationresistanceforprintedboards43GB/T4677.2-1984印制板金属化孔镀层厚度测试方法微电阻法Micro-resistancetestmethodofplatingthicknessofplatedthroughholesforprintedboards44GB/T4677.3-1984印制板拉脱强度测试方法Testmethodsofpullstrengthforprintedboards45GB/T4677.4-1984印制板抗剥强度测试方法Testmethodsofpeelstrengthforprintedboards46GB/T4677.5-1984印制板翘曲度测试方法Testmethodsofplatnessforprintedboards47GB/T4677.6-1984金属和氧化覆盖层厚度测试方法截面金相法Testmethodsforthicknessofmetalandoxidecoatingbymicroscopicalexaminationofcross-section48GB/T4677.7-1984印制板镀层附着力试验方法胶带法Testmethodofplatingadhesionbyadhesivetypeforprintedboards49GB/T4677.8-1984印制板镀涂覆层厚度测试方法β反向散射法Testmethodofplatingandcoatingthicknessbybetabackscatteringforprintedboards50GB/T4677.9-1984印制板镀层孔隙率电图象测试方法Theelectrographictestmethodofplatingporosityforprintedboards51GB/T4677.10-1984印制板可焊性测试方法Testmethodofsolderabilityforprintedboards52GB/T4677.11-1984印制板耐热冲击试验方法Testmethodsofthermalshockforprintedboards53GB/T4677.12-1988印制板互连电阻测试方法Testmethodofinterconnectionresistanceforprintedboards54GB/T4677.13-1988印制板金属化孔电阻的变化热循环测试方法Testmethodofchangeinresistanceofplated-throughholes--Thermalcyclingforprintedboards55GB/T4677.14-1988印制板蒸汽-氧气加速老化试验方法Testmethodofsteam/oxygenacceleratedageingofprintedboard56GB/T4677.15-1988印制板绝缘涂层耐溶剂和耐焊剂试验方法Testmethodforsolventandfluxresistanceofinsulatingcoatingonprintedboards57GB/T4677.16-1988印制板一般检验方法Generalexaminationmethodforprintedboards58GB/T4677.17-1988多层印制板内层绝缘电阻测试方法Testmethodforinsulationresistancewithininnerlayersofmultilayerprintedboards59GB/T4677.18-1988多层印制板层间绝缘电阻测试方法Testmethodforinsulationresistancebetweenlayersofmultilayerprintedboards60GB/T4677.19-1988印制板电路完善性测试方法Testmethodforelectricalintegrityofprintedboards61GB/T4677.20-1988印制板镀层附着性试验方法摩擦法Testmethodforplatingadhesionofprintedboards--Burnishing62GB/T4677.21-1988印制板镀层孔隙率测试方法气体暴露法Testmethodforplatingporosityofprintedboards--Thegasexposuremethod63GB/T4677.22-1988印制板表面离子污染测试方法Testmethodforsurfaceioniccontaminationofprintedboards64GB/T4677.23-1988印制板阻燃性能测试方法Testmethodforflammabilityofprintedboards65GB/T4721-1992印制电路用覆铜箔层压板通用规则Generalrulesforcopper-cladlaminatedsheetsforprintedcircuits66GB/T4722-1992印制电路用覆铜箔层压板试验方法Testmethodsforcopper-cladlaminatedsheetsforprintedcircuits67GB/T4723-1992印制电路用覆铜箔酚醛纸层压板Phenoliccellulosepapercopper-cladlaminatedsheetsforprintedcircuits68GB/T4724-1992印制电路用覆铜箔环氧纸层压板Epoxidecellulosepapercopper-cladlaminatedsheetsforprintedcircuits69GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板Epoxidewovenglassfabriccopper-cladlaminatedsheetsforprintedcircuits70GB/T4779.1-1984彩色显象管用荧光粉Y22-G3荧光粉Phosphorsforcolorpicturetubesuse--PhosphorY22-G371GB/T4779.2-1984彩色显象管用荧光粉Y22-B2荧光粉Phosphorsforcolorpicturetubesuse--PhosphorY22-B272GB/T4779.3-1984彩色显象管用荧光粉Y22-R4荧光粉Phosphorsforcolorpicturetubesuse--PhosphorY22-R473GB/T4825.1-1984印制板导线局部放电测试方法Testmethodforpartialdischargeofconductorsonprintedboards74GB/T4825.2-1984印制板导线载流量测试方法Testmethodforcurrentcarryingcapacityofconductorsonprintedboards75GB/T4874-1985直流固定金属化纸介电容器总规范Genericspecificationforfixedmetallizedpaperdielectriccapacitorsfordirectcurrent76GB/T5076-1985具有两个轴向引出端的圆柱体元件的尺寸测量Measurementofthedimensionsofacylindricalcomponenthavingtwoaxialterminations77GB/T5077-1985电容器和电阻器的最大外形尺寸Maximumcasedimensionsforcapacitorsandresistors78GB/T5078-1985单向引出的电容器和电阻器所需空间的测定方法Methodforthedeterminationofthespacerequiredbycapacitorsandresistorswithunidirectionalterminations79GB/T5489-1985印制板制图Printedboarddrawing80GB/T5594.1-1985电子元器件结构陶瓷材料性能测试方法气密性测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforgas-tightness81GB/T5594.2-1985电子元器件结构陶瓷材料性能测试方法杨氏弹性模量、泊松比测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--TestmethodforYoungselasticmodulusandPoissonratio82GB/T5594.3-1985电子元器件结构陶瓷材料性能测试方法平均线膨胀系数测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodformeancoefficientoflinearexpansion83GB/T5594.4-1985电子元器件结构陶瓷材料性能测试方法介质损耗角正切值的测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodfordielectriclossangletangentvalue84GB/T5594.5-1985电子元器件结构陶瓷材料性能测试方法体积电阻率测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforvolumeresistivity85GB/T5594.6-1985电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforchemicaldurability86GB/T5594.7-1985电子元器件结构陶瓷材料性能测试方法透液性测定方法Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Testmethodforliquidpermeability87GB/T5594.8-1985电子元器件结构陶瓷材料性能测试方法显微结构的测定Testmethodsforpropertiesofstructureceramicusedinelectroniccomponents--Determinationofmicrostructure88GB/T5598-1985氧化铍瓷导热系数测定方法Testmethodforthermalconductivityofberylliumoxideceramics89GB/T5729-1994电子设备用固定电阻器第一部分:总规范Fixedresistorsforuseinelectronicequipment--Part1:Genericspecification90GB/T5730-1985电子设备用固定电阻器第二部分:分规范:低功率非线绕固定电阻器(可供认证用)Fixedresistorsforuseinelectronicequipment--Part2:Sectionalspecification:Fixedlow-powernonwirewoundresistors91GB/T5731-1985电子设备用固定电阻器第二部分:空白详细规范:低功率非线绕固定电阻器评定水平E(可供认证用)Fixedresistorsforuseinelectronicequipment--Part2:Blankdetailspecification:Fixedlow-powernon-wirewoundresistors--AssessmentlevelE92GB/T5732-1985电子设备用固定电阻器第四部分:分规范:功率型固定电阻器(可供认证用)Fixedresistorsforuseinelectronicequipment--Part4:Sectionalspecification:Fixedpowerresistors93GB/T5733-1985电子设备用固定电阻器第四部分:空白详细规范:功率型固定电阻器评定水平E(可供认证用)Fixedresistorsforuseinelectronicequipment--Part4:Blankdetailspecification:FixedpowerresistorsAssessmentlevelE94GB/T5734-1985电子设备用固定电阻器第五部分:分规范:精密固定电阻器(可供认证用)Fixedresistorsforuseinelectronicequipment--Part5:Sectionalspecification:Fixedprecisionresistors95GB/T5735-1985电子设备用固定电阻器第五部分:空白详细规范:精密固定电阻器评定水平E(可供认证用)Fixedresistorsforuseinelectronicequipment--Part5:Blankdetailspecification:Fixedprecisionresistors--AssessmentlevelE96GB/T5838-1986荧光粉名词术语Termsforphosphors97GB/T5966-1996电子设备用固定电容器第8部分:分规范:1类瓷介固定电容器Fixedcapacitorsforuseinelectronicequipment--Part8:Sectionalspecification:Fixedcapacitorsofceramicdielectric,class198GB/T5967-1996电子设备用固定电容器第8部分:空白详细规范1类瓷介固定电容器评定水平EFixedcapacitorsforuseinelectronicequipment--Part8:BlankdetailspecificationFixedcapacitorsofceramicdielectric,class1--AssessmentlevelE99GB/T5968-1996电子设备用固定电容器第9部分:分规范2类瓷介固定电容器Fixedcapacitorsforuseinelectronicequipment--Part9:SectionalspecificationFixedcapacitorsofceramicdielectric,class2100GB/T5969-1996电子设备用固定电容器第9部分:空白详细规范2类瓷介电容器评定水平EFixedcapacitorsforuseinelectronicequipment--Part9:BlankdetailspecificationFixedcapacitorofceramicdielectric,class2--AssessmentlevelE101GB/T5993-1986电子设备用固定电容器第四部分:分规范固体和非固体电解质铝电容器(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part4:Sectionalspecification--Aluminiumelectrolyticcapacitorswithsolidandnon-solidelectrolyte102GB/T5994-1986电子设备用固定电容器第四部分:空白详细规范非固体电解质铝电容器评定水平E(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part4:Blankdetailspecification--Aluminiumelectrolyticcapacitorswithnon-solidelectrolyte--AssessmentlevelE103GB/T6252-1986电子设备用A类调谐可变电容器类型规范Typespecificationforvariabletuningcapacitors--TypeAinelectronicequipments104GB/T6253-1986电子设备用B类微调可变电容器类型规范Typespecificationforvariabletrimmercapacitors--TypeBinelectronicequipments105GB/T6254-1986电子设备用C类预调可变电容器类型规范Typespecificationforvariablepresetcapacitors--TypeCinelectronicequipments106GB/T6346-1986电子设备用固定电容器第11部分:分规范:金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part11:Sectionalspecification:Fixedpolyethylene-terephthalatefilmdielectricmetalfoilD.C.capacitors107GB/T6347-1986电子设备用固定电容器第11部分:空白详细规范:金属箔式聚乙烯对苯二甲酸乙二醇酯膜介质直流固定电容器评定水平E(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part11:Blankdetailspecification:Fixedpolyethylene-terephthalatefilmdielectricmetalfoilD.C.capacitors--AssessmentlevelE108GB/T6429-1986石英谐振器型号命名方法Theruleoftypedesignationforquartzcrystalunits109GB/T6430-1986晶体盒型号命名方法Theruleoftypedesignationforcrystalholders(enclosures)110GB/T6452-1986吸气用锆铝合金粉Zirconium-Aluminiumalloypowdersforgetter111GB/T6453-1986吸气用锆铝合金复合带材Zirconium-Aluminiumalloycombinedstripsforgetter112GB/T6454-1986吸气用锆铝合金环件和片件Ringsandtabletsofzirconium-aluminiumalloyforgetter113GB/T6455-1986释汞吸气用复合带材Mercuryreleasingcombinedstripsforgetter114GB/T6591-1986电子设备用电容器和电阻器名词术语Termsofcapacitorandresistorforelectronicequipment115GB/T6625-1986掺氮吸气剂含氮量测试方法Testmethodsfornitrogencontentofnitrogen-dopedgetter116GB/T6626.1-1986释汞吸气剂性能测试方法释汞吸气剂释汞特性的测试方法Testmethodsforthecharacteristicsofgetter-mercurydispenser--Testmethodsformercuryyieldcharacteristicofgetter-mercurydispenser117GB/T6626.2-1986释汞吸气剂性能测试方法释汞吸气剂含汞量的测试方法Testmethodsforthecharacteristicsofgetter-mercurydispenser--Testmethodformercurycontentofgetter-mercurydispenser118GB/T6626.3-1986释汞吸气剂性能测试方法释汞吸气剂放气量的测试方法Testmethodsforthecharacteristicsofgetter-mercurydispenser--Testmethodforgasemissionofgettermercurydispenser119GB/T6626.4-1986释汞吸气剂性能测试方法释汞吸气剂压粉牢固度的检验方法Testmethodsforthecharacteristicsofgetter-mercurydispenser--Methodforpeelofftestofgetter-mercurydispenser120GB/T6627-1986人造石英晶体棒材型号命名方法Designationsforlumberedsyntheticquartzcrystals121GB/T6643-1986通用硬同轴传输线及其法兰连接器总规范Generalpurposerigidcoaxialtransmissionlinesandtheirassociatedflangeconnectors--Genericspecification122GB/T6663-1986直热式负温度系数热敏电阻器总规范(可供认证用)Generalspecificationforthedirectlyheatednegativetemperaturecoefficientthermistors123GB/T6664-1986直热式负温度系数热敏电阻器空白详细规范评定水平E(可供认证用)Blankdetailspecificationfordirectlyheatednegativetemperaturecoefficientthermistors--AssessmentlevelE124GB/T6832-1986头戴耳机测量方法Methodsofmeasurementonheadphones125GB/T7016-1986固定电阻器电流噪声测量方法Methodofmeasurementofcurrentnoisegeneratedinfixedresistors126GB/T7017-1986电阻器非线性测量方法Methodofmeasurementofnon-linearityinresistors127GB/T7153-1987直热式阶跃型正温度系数热敏电阻器总规范(可供认证用)Genericspecificationforthedirectlyheatedpositivestep-functiontemperaturecoefficientthermistors128GB/T7154-1987直热式阶跃型正温度系数热敏电阻器空白详细规范评定水平E(可供认证用)Blankdetailspecificationforthedirectlyheatedpositivestep-functiontemperaturecoefficientthermistors--AssessementlevelE129GB/T7213-1987电子设备用固定电容器第十五部分:分规范非固体或固体电解质钽电容器(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part15:Sectionalspecification--Fixedtantalumcapacitorswithnon-solidorsolidelectrolyte130GB/T7214-1987电子设备用固定电容器第十五部分:空白详细规范固体定电解质和多孔阳极钽电容器评定水平E(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part15:Blankdetailspecification--Fixedtantalumcapacitorswithsolidelectrolyteandporousanode--AssessmentlevelE131GB/T7265.1-1987固体电介质微波复介电常数的测试方法微扰法Testmethodforcomplexpermittivityofsoliddielectricmaterialsatmicrowavefrequencies--Perturbationmethod132GB/T7265.2-1987固体电介质微波复介电常数的测试方法"开式腔"法Testmethodforthecomplexpermittivityofsoliddielectricmaterialsatmicrowavefrequencies--"Opencavity"method133GB/T7332-1996电子设备用固定电容器第2部分:分规范:金属化聚乙烯对苯二甲酸酯膜介质直流固定电容器Fixedcapacitorsforuseinelectronicequipment--Part2:Sectionalspecification--Fixedmetallizedpolyethylene-terephthalatefilmdielectricd.c.capacitors134GB/T7333-1996电子设备用固定电容器第2部分:空白详细规范金属化聚乙烯对苯二甲酸酯膜介质直流固定电容器评定水平EFixedcapacitorsforuseinelectronicequipment--Part2:Blankdetailspecification--Fixedmetallizedpolyethylene-terephthalatefilmdielectricd.c.capacitors--AssessmentlevelE135GB/T7338-1996电子设备用固定电阻器第6部分:分规范各电阻器可单独测量的固定电阻网络Fixedresistorsforuseinelectronicequipment--Part6:Sectionalspecification--Fixedresistornetworkswithindividuallymeasurableresistors136GB/T7339-1987电子设备用固定电阻器第六部分:空白详细规范:阻值和功耗相同,各电阻器可单独测量的固定电阻网络评定水平E(可供认证用)Fixedresistorsforuseinelectronicequipment--Part6:Blankdetailspecification--Fixedresistornetworkswithindividuallymeasurableresistors,allofequalvalueandequaldissipation--AssessmentlevelE137GB/T7340-1987电子设备用固定电阻器第六部分:空白详细规范:阻值和功耗不同,各电阻器可单独测量的固定电阻网络评定水平E(可供认证用)Fixedresistorsforuseinelectronicequipment--Part6:Blankdetailspecification--Fixedresistornetworkswithindividuallymeasurableresistorofeitherdifferentresistancevaluesordifferentrateddissipations--AssessmentlevelE138GB/T7345-1994控制微电机基本技术要求Generalrequirementsforelectricalmicromachineforautomaticcontrolsystem139GB/T7423.1-1987半导体器件散热器通用技术条件Heatsinkofsemiconductordevices--Genericspecification140GB/T7423.2-1987半导体器件散热器型材散热器Heatsinkofsmiconductordevices--Heatsink,extrudedshapes141GB/T7423.3-1987半导体器件散热器叉指形散热器Heatsinkofsemiconductordevices--Heatsink,Staggeredfingersshapes142GB/T7556-1987对称电缆60路载波系统进网特性要求Generalcharacteristicscomplyingwiththenetworkperformanceobjectivesfor60channelcarriertelephonesystemsonsymmetriccablepairs143GB/T7557-19871.2/4.4mm标准同轴电缆300路载波系统进网特性要求Generalcharacteristicscomplyingwiththenetworkperformanceobjectivesfor300channelcarriertelephonesystemsonstandardized1.2/4.4mmcoaxialcablepairs144GB/T7613.1-1987印制板导线耐电流试验方法Testmethodforcurrentproofofconductorsonprintedboards145GB/T7613.2-1987印制板表层耐电压试验方法Testmethodsforvoltageproofofsurfacelayersonprintedboards146GB/T7613.3-1987印制板金属化孔耐电流试验方法Testmethodsforcurrentproofofplated-throughholesonprintedboards147GB/T7614-1987校准测耳机用的宽频带型仿真耳Anartificialearofwidebandtypeforthecalibrationofearphonesusedinaudiometry148GB/T8553-1987晶体盒总规范Holders(Enclosures),crystal,generalspecificationfor149GB/T8977-1988调频、电视广播接收机用300Ω/75Ω平衡-不平衡阻抗变换器300Ω/75ΩbalunforFMandTVbroadcastreceiver150GB/T9020-1988视频同轴连接器总规范Visual-frequency--Coaxialconnectors,genericspecificationof151GB/T9023-1988射频同轴电缆屏蔽效率测量方法(转移阻抗法)Methodsofmeasurementofscreeningefficiencyforradio-frequencycoaxialcables(Testmethodfortransferimpedance)152GB/T9024-1988印制板用频率低于3MHz的连接器总则和制订详细规范的导则Connectorsfrequenciesbelow3MHzforusewithprintedboards--Geneneralrulesandguideforthepreparationofdetailspecilications153GB/T9315-1988印制电路板外形尺寸系列Seriesforprintedboardsoutsidedimension154GB/T9320-1988电子设备用固定电容器第八部分(1):分规范1类高压瓷介电容器(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part8(1):Sectionalspecification:Fixedclasss1highvoltageceramicdielectriccapacitors155GB/T9321-1988电子设备用固定电容器第八部分(1):空白详细规范1类高压瓷介电容器评定水平E(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part8(1):Blankdetailspecification:Fixedclass1ceramicdielectriccapacitors--AssessmentlevelE156GB/T9322-1988电子设备用固定电容器第九部分(1):分规范2类高压瓷介电容器(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part9(1):Sectionalspecification:Fixedclass2highvoltageceramicdielectriccapacitors157GB/T9323-1988电子设备用固定电容器第九部分(1):空白详细规范2类高压瓷介电容器评定水平E(可供认证用)Fixedcapacitorsforuseinelectronicequipment--Part9(1):Blankdetailspecification:Fixedclass2ceramicdielectriccapacitors--AssessmentlevelE158GB/T9324-1996电子设备用固定电容器第10部分:分规范多层片式瓷介电容器Fixedcapacitorsforuseinelectronicequipment--Part10:Sectionalspecification--Fixedmultilayerceramicchipcapacitors159GB/T9325-1996电子设备用固定电容器第10部分:空白详细规范多层片式瓷介电容器评定水平EFixedcapacitorsforuseinelectronicequipment--Part10:BlankdetailspecificationFixedmultilayerceramicchipcapacitorsAssessmentlevelE160GB/T9489.1-1988刚玉粉方法通则Generalruleforanalyticalmethodofalundumpowder161GB/T9489.2-1988刚玉粉中氧化钙、氧化镁、二氧化硅、三氧化二铁、二氧化钛的电感耦合高频等离子体发射光谱法测定DeterminationofCaO,MgO,SiO2,Fe2O3,TiO2inalundumpowderbyICP-AES162GB/T9489.3-1988刚玉粉中三氧化二铁、氧化钙、氧化镁、氧化钠、氧化钾的原子吸收分光光度测定法DeterminationofFe2O3,CaO,MgO,Na2OandK2Oinalundumpowderbyatomicabsorptionspectrophotometry163GB/T9489.4-1988刚玉粉中三氧化二铝含量的络合滴定氟化物释放测定法DeterminationofAl2O3inalundumpowderbycomplexometrictitration164GB/T9489.5-1988刚玉粉中二氧化硅的比色测定法DeterminationofSiO2inalundumpowderbycolorimetry165GB/T9489.6-1988刚玉粉中二氧化钛的比色测定法DeterminationofTiO2inalundumpowderbycolorimetry166GB/T9489.7-1988刚玉粉中氯根的目视比浊测定法Determinationofchlorideinalundumpowderbyvisualturbidimetry167GB/T9489.8-1988刚玉粉中碳和硫的测定方法Methodsfordeterminationofcarbonandsulphurinalundumpowder168GB/T9489.9-1988刚玉粉PH值的测定方法MethodsfordeterminationofpHinalundumpowder169GB/T9489.10-1988刚玉粉灼烧失重的测定方法Methodfordeterminationofignitionlossofalundumpowder170GB/T9506.1-1988吸气剂性能测试方法通则Genericrulesfortestmethodofgetterproperties171GB/T9506.2-1988蒸散型钡吸气剂得钡量测试方法Testmethodforbariumyieldofbariumflashgetter172GB/T9506.3-1988蒸散型钡吸气剂载料和模中钡量的测定Testmethodforbariumcontentingetterfillandgetterfilmofbariumflashgetter173GB/T9506.4-1988吸气剂放气量测试方法Testmethodforamountofgasevolvedfromgetter174GB/T9506.5-1988掺氮吸气剂释氮吸气动态曲线测试方法Testmethodfornitrogen-releasedandgas-absorbeddynamiccurveofnitrogen-dopedgetter175GB/T9506.6-1988掺氮吸气剂钡膜分布测试方法Testmethodforbariumfilmdistributionofnitrogen-dopedgetter176GB/T9506.7-1988蒸散型钡吸气剂吸气性能测试方法Testmethodforgetteringpropertiesofbariumflashgetter177GB/T9506.8-1988非蒸散型吸气剂吸气性能测试方法Testmethodforgetteringpropertiesofnon-evaporablegetter178GB/T9506.9-1988吸气剂装载量测试方法Testmethodforamountoffillinggetter179GB/T9506.10-1988吸气剂压制或烧结牢固度测试方法Testmethodforfirmnessofgetterbypressureorsinter180GB/T9506.11-1988吸气剂支架焊接强度测试方法Testmethodforweldstrenghtofgettersupport181GB/T9530-1988电子陶瓷名