IPC标准汇集目录(光盘)1-smt-焊接-设备-工艺-电子-说明

IPC汇集目录(光盘)1-smt-焊接-设备-工艺-电子-说明 IPC IPC-S-100 Standards and Specification Manual ( IPC-TM-650 Test Methods Manual ( IPC-A-600F Acceptability of Printed Boards ( Nov.1999) 4. IPC-A-610C Acceptability of Electronic Assemblies (Jan.2000) 5. IPC-PE-740A Troubleshooting for Printed Board (Dec.1997) 6. IPC-SM-782A Surface Mount Design and Land Pattern Standard (Oct.1996) 7. IPC-7711 Rework of Electronic Assemblies (Feb.1998) 8. IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies (Feb.1998) IPC-S-100 Standards Manual IPC-T-50F Terms and Definitions IPC-SC-60 Post Solder Solvent Cleaning Handbook IPC-SA-61 Post Solder Semiaqueous Cleaning Handbook IPC-AC-62A Post Solder Aqueous Cleaning Handbook IPC-PC-90 General Requirements for Implementation of Statistical Process Control IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems IPC-L-125A Specification for Plastic Substrates, Clad or Unclad, for High-Speed/High Frequency Interconnections IPC-DD-135 Qualification Testing for Deposited Organic Innerlayer Dielectric Materials for Multichip Modules IPC-EG-140 Specification for Finished Fabric Woven from 揈?Glass for Printed Boards (including updated Amendment to Appendix 2) IPC-SG-141 Specification for Finished Fabric Woven from 揝?Glass for Printed Boards IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards IPC-CF-148A Resin Coated Metal for Printed Boards IPC-MF-150F Metal Foil for Printed Wiring Applications (includes Amendment 1) IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards IPC-FC-231C Flexible Bare Dielectrics for Use in Flexible Printed Wiring (includes Slash Sheet Amendment) IPC-FC-232C Specification for Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring (includes Slash Sheet Amendment) IPC-FC-241C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring (includes Slash Sheet Amendment) IPC-D-300G Printed Board Dimension and Tolerances IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes IPC-MC-324 Performance Specification for Metal Core Boards IPC-D-325A Documentation Requirements for Printed Boards, Assemblies, and Support Drawings (supersedes IPC-ML-975) IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers IPC-D-356A Bare Board Electrical Test Information in Digital Form IPC-BP-421 General Specification for Rigid Prntd. Bd. Backplanes with Press-Fit Contracts IPC-DW-424 General Specification for Encapsulated Discrete Wiring Interconnection Boards IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards (includes Amendment 1) IPC-DW-426 Specifications for Assembly of Discrete Wiring IPC-DR-570A General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Bds. IPC-OI-645 Standard for Visual Optical Inspection Aids IPC-QL-653A Qualification of Facilities that Inspect/Test Printed Boards, Components, and Materials IPC-SM-786A Procedures for Characterizing and Handling of Moisture/Reflow Sensitive Plastic Ics IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives IPC-CA-821 General Requirements for Thermally Conductive Adhesives IPC-CC-830A Qualification and Performance of Electrical Insulating Compounds for Printed Board Assemblies IPC-SM-840C Qualification and Performance of Permanent Solder Mask IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits IPC-HM-860 Performance Specification for Multilayer Hybrid Circuits IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards IPC-2221 Generic Standard on Printed Board Design (Supersedes IPC-D-275) IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards (Supersedes IPC- D-275) IPC-2223 Sectional Design Standard for Flexible Printed Boards (Supersedes IPC-D-249) IPC-2224 Sectional Standard for Design of PWBs for PC Cards IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies IPC-2511 Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology (Supersedes IPC-D-350D, D- 351, D-352, D-354 and D-355) IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives IPC-3408 General Requirements for Anisotropically Conductive Adhesive Films IPC-4101 Laminate/Prepreg Materials Standard for Printed Boards (Supersedes IPC-L- 108, IPC-L-109, IPC-L-112, IPC-L-115, and IPC-AM-361) IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards IPC-4130 Specification and Characterization Methods for Nonwoven ''E" Glass Mat IPC-6011 GenericPerformance Specification for Printed Boards (Supersedes IPC-RB-276) IPC-6012 Qualification and Performance Specification for Rigid Printed Boards (Supersedes IPC-RB-276) IPC-6013 Qualification and Performance Specification for Flexible Printed Boards (Supersedes IPC-RF-245 and IPC-FC-250A) IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures IPC-6018 Microwave End Product Board Inspection and Test (Supersedes IPC-HF- 318A) J-STD-001B Requirements for Soldered Electrical and Electronic Assemblies J-STD-002A Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires (replaces IPC-S-805) J-STD-003 Solderability Tests for Printed Boards (replaces IPC-S-804A) J-STD-004 Requirements for Soldering Fluxes – (includes Amendment 1) J-STD-005 General Requirements and Test Methods for Electronic Grade Solder Paste – (includes Amendment 1) J-STD-006 General Requirements and Test Methods for Soft Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Applications – (includes Amendment 1) J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices 2 IPC TM-650 Test Methods Manual Section 2.1 Visual Test Methods（目视检测方法） Section 2.2 Dimensional Test Methods(物理量纲测试方法) Section 2.3 Chemical Test Methods(化学量纲测试方法) Section 2.4 Mechanical Test Methods(机械测试方法) Section 2.5 Electrical Test Methods(电学测试方法) Section 2.6 Environmental Test Methods(环境测试方法) PC TM-650 Test Methods Manual SECTION 2.1 - VISUAL TEST METHODS 2.1.1. Microsectioning - 3/98(显微剖切)或(金相切片 2.1.1.1. Microsectioning, Ceramic Substrate - 12/87 2.1.1.2. Microsectioning - Semi or Automatic Technique Microsection Equipment (Alternate) - 7/93 2.1.2. Pinhole Evaluation, Dye Penetration Method - 3/76 2.1.3 .Plated-Through Hole Structure Evaluation - 8/76 2.1.5 .Surface Examination, Unclad and Metal Clad Material - 12/82 2.1.6 .Thickness of Glass Fabric - 12/94(玻璃纤维布厚度) 2.1.6.1 .Weight of Fabric Reinforcements - 12/94 2.1.7 .Thread Count of Glass Fabric - 12/94(半固化片的玻璃布线数) 2.1.7.1 .Thread Count, Organic Fibers - 12/87 2.1.8 .Workmanship - 12/94 2.1.9. Surface Scratch Examination Metal Clad Foil - 5/86覆金属箔表面划痕检验) 2.1.10. Visual Inspection for Undissolved Dicyandiamide - 12/94(直观检查双氰胺晶体) 2.1.13a .Inspection for Inclusions and Voids in Flexible Printed Wiring Materials - 5/98 IPC TM-650 Test Methods Manual SECTION 2.2 - DIMENSIONAL TEST METHODS 2.2.1. Mechanical Dimensional Verification - 8/97 2.2.2. Optical Dimensional Verification - 8/97 2.2.4c. Dimensional Stability, Flexible Dielectric Materials - 5/98 2.2.5. Dimensional Inspections Using Mircosections - 8/97 2.2.6. Hole Size Measurement, Drilled - 8/97 2.2.7. Hole Size Measurement, Plated - 5/86 2.2.8. Location of Holes - 4/73 2.2.10. Hole Location and Conductor Location - 12/83 2.2.12. Thickness of Copper by Weight- 3/76 2.2.12.1. Overall Thickness and Profile Factor of Copper Foils Treated and Untreated – 9/87 2.2.12.2. Weight and Thickness of Copper Foils with Releasable Carriers - 7/89 2.2.12.3. Weight and Thickness Determination of Copper Foils With Etchable Carriers – 7/89 2.2.13.1. Thickness, Plating in Holes, Microhm Method - 1/83(孔镀层厚度-微欧法) 2.2.14. Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95 2.2.14.1. Solder Powder Particle Size Distribution - Measuring Microscope Method – 1/95 2.2.14.2. Solder Powder Particle Size Distribution - Optical Image Analyzer Method— 1/95 2.2.14.3. Determination of Maximum Solder Powder Particle Size - 1/95 2.2.15. Cable Dimensions (Flat Cable) - 6/79 2.2.16. Artwork Master Evaluation by Use of a Drilled Panel - 12/87 2.2.16.1. Artwork Master Evaluation by Overlay - 12/87 2.2.17. Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)- 3/90 2.2.18. Determination of Thickness of Laminates by Mechanical Measurement - 12/94 2.2.18.1. Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94 2.2.19. Measuring Hole Pattern Location-12/87 2.2.19.1. Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94 2.2.20. Solder Paste Metal Content by Weight - 1/95 2.2.21. Planarity of Dielectrics for High Density Interconnection (HDI) Microvia IPC TM-650 Test Methods Manual Technology - 11-98 SECTION 2.3 - CHEMICAL TEST METHODS 2.3.1. Chemical Processing, Suitable Processing Material- 4/73 2.3.1.1. Chemical Cleaning of Metal Clad Laminates- 5/86(覆金属箔层压板的化学清洗) 2.3.2f. Chemical Resistance Of Flexible Printed Wiring Materials - 5/98 2.3.3a. Chemical Resistance of Insulating Materials- 2/78 2.3.4. Chemical Resistance, Marking Paints and Inks - 8/97 2.3.4.2. Chemical Resistance of Laminates, Prepreg and Coated Foil Products, by Solvent Exposure - 12/94 2.3.4.3. Chemical Resistance of Core Materials to Methylene Chloride- 5/86(基材的耐化 ) 学性 2.3.5. Density, Insulating Material - 8/97 2.3.6. Etching, Ammonium Persulfate Method - 7/75 2.3.7. Etching, Ferric Chloride Method - 7/75 2.3.7.1. Cupric Chloride Etching Method - 12/94(氯化铜蚀剂方法) 2.3.7.2. Alkaline Etching Method - 12/94 2.3.8a. Flammability, Flexible Insulating Materials- 12/82 2.3.8.1. Flammability of Flexible Printed Wiring- 12/88 2.3.9. Flammability of Prepreg and Thin Laminate - 8/97(印制线路用材料的燃烧性) 2.3.10. Flammability of Laminate - 12/94() 印制线路用层压板的燃烧性 2.3.10.1. Flammability of Soldermask on Printed Wiring Laminate- 8/98(印制线路板上阻 ) 焊剂的燃烧性 2.3.11. Glass Fabric Construction- 4/73 2.3.13. Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods- 1/95 2.3.14. Print, Etch, and Plate Test- 4/73 2.3.15. Purity, Copper Foil or Plating - 8/97 2.3.16. Resin Content of Prepreg, by Burn-off - 12/94() 半固化片材料的树脂含量 2.3.16.1CResin Content of Prepeg, by Treated Weight--12/94(半固化片材料的树脂含量 (涂覆物称重) ) 2.3.16.2. Treated Weight of Prepreg - 12/94 2.3.17. Resin Flow Percent of Prepreg - 8/97(半固化片材料(B阶)的树脂流动度) 2.3.17.1b. Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films - 5/98 2.3.17.2. Resin Flow of "No Flow" Prepreg - 8/97(”不流动”树脂的树脂流动度) 2.3.18. Gel Time, Prepreg Materials - 4/86(预浸渍材料的凝胶时间) 2.3.19. Volatile Content of Prepreg - 12/94(半固化片材料的挥发物含量) 2.3.21. Plating Quality, Hull Cell Method - 8/97 2.3.22. Copper Protective Coating Quality - 2-78 2.3.23. Cure (Permanency) Thermally Cured Solder Mask - 2/88(热固性阻焊剂的固化 (耐久性) ) 2.3.23.1a. Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88(UV诱发的干膜 (耐久性) ) 阻焊剂的固化 2.3.24Porosity of Gold Plating- 2/78 2.3.24.1. Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85 2.3.24.2. Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97 2.3.25. Detection and Measurement of Ionizable Surface Contaminants - 8/97--- Supersedes 2.3.26 and 2.3.26.1(表面污染物的离子检测.动 )2.3.26ASuperseded by Test Method 2.3.252.3.26.1Superseded by Test 态法 Method 2.3.25 2.3.26.2. Mobile Ion Content of Polymer Films - 7/95 2.3.27. Cleanliness Test - Residual Rosin - 1/95 2.3.27.1. Rosin Flux Residue Analysis-HPLC Method - 1/95 2.3.28. Ionic Analysis of Circuit Boards, Ion Chromatography Method - 1/95 紫外光固化材料的相对 2.3.29. Flammability, Flexible Flat Cable- 11/88 2.3.30a. Solvent pH Determination in Anhydrous Flourocarbon Solvents- 11/81 ) 固化程度 2.3.31. Relative Degree of Cure of U.V. Curable Material - 2/88(2.3.32. Flux Induced Corrosion (Copper Mirror Method)- 1/95 2.3.33. Presence of Halides in Flux, Silver Chromate Method - 1/95 2.3.34. Solids Content, Flux - 1/95 2.3.34.1. Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95 2.3.35. Halide Content, Quantitative (Chloride and Bromide)- 1/95 2.3.35.1. Fluorides by Spot Test, Fluxes - Qualitative - 1/95 2.3.35.2. Flouride Concentration, Fluxes - Quantitative--1/95 2.3.36. Acid Acceptance of Chlorinated Solvents- 10/85 2.3.37b. Volatile Content of Adhesive Coated Dielectric Films - 5/98 2.3.38. Surface Organic Contaminant Detection Test - 8/97( 表面有机污染物的检测方 (企业内) ) 浊 2.3.39. Surface Organic Contaminant Identification Test (Infrared Analytical Method) – 8/97( 表面有机污染物的检测方法(红外法) ) 2.3.40. Thermal Stability - 7/95 IPC TM-650 Test Methods Manual SECTION 2.4 - MECHANICAL TEST METHODS 2.4.1d. Adhesion, Tape Testing--8/97( 镀层附着力) 2.4.1.1b. Adhesion, Marking Paints and Inks--11/88 2.4.1.2. Adhesion of Conductors on Hybrid Substrates--12/87 2.4.1.3. Adhesion, Resistors (Hybrid Circuits)--12/87 2.4.1.4. Adhesion, Overglaze (Hybrid Circuits)--12/87 2.4.1.5a. Determination of Heat Transfer--5/95 2.4.1.6. Adhesion, Polymer Coating--7/95 2.4.2a. Ductility of Copper Foil--3/76 2.4.2.1d. Flexural Fatigue and Ductility, Foil--3/91 2.4.3d. Flexural Fatigue, Flexible Printed Wiring Materials--5/98 2.4.3.1c. Flexural Fatigue and Ductility, Flexible Printed Wiring--3/91 2.4.3.2c. Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics--3/91 2.4.4b. Flexural Strength of Laminates (at Ambient Temperature)--12/94(刚性绝缘层压 (室温下) ) 材料抗弯曲强度 2.4.4.1a. Flexural Strength of Laminates (at Elevated Temperature)--12/94(刚性绝缘层压 (高温下) ) 材料抗弯曲强度 2.4.5. Folding Endurance, Flexible Printed Wiring Materials--4/73 2.4.6. Hot Oil--4/73 2.4.7a. Machinability, Printed Wiring Materials--7/75 2.4.8c. Peel Strength of Metallic Clad Laminates--12/94(金属箔层压板的剥离强度) 2.4.8.1. Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)--1/86 2.4.8.2a.Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)--12/94(高温下金属箔层压板的剥离强度热流法) ) 2.4.8.3a.Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)--12/94(高温下金属箔层压板的剥离强度(热风法) ) 2.4.8.4. Carrier Release, Thin Copper--1/90 2.4.9d. Peel Strength, Flexible Dielectric Materials--10/88 2.4.9.1Peel Strength of Flexible Circuits - 11/98 2.4.9.2. Bonding Process - 11/98 2.4.10. Plating Adhesion--4/73 2.4.11. Shear Strength Flexible Dielectric Materials--4/73 2.4.12a. Solderability, Edge Dip Method--6/91 2.4.13f. Solder Float Resistance Flexible Printed Wiring Materials--5/98 2.4.13.1. Thermal Stress of Laminates--12/94 2.4.14. Solderability of Metallic Surfaces--4/73 2.4.14.1. Solderability, Wave Solder Method--3/79 2.4.14.2. Liquid Flux Activity, Wetting Balance Method--1/95 2.4.15a. Surface Finish, Metal Foil--3/76 2.4.16a. Initiation Tear Strength, Flexible Insulating Materials--12/82 2.4.17. Tear Strength, Propagation--4/73 2.4.17.1a. Propagation, Tear Strength, Flexible Insulating Materials--12/82 2.4.18b. Tensile Strength and Elongation, Copper Foil--8/80 2.4.18.1. Tensile Strength and Elongation, In-House Plating--8/97 2.4.18.2. Hot Rupture Strength, Foil--7/89 2.4.18.3. Tensile Strength, Elongation, and Modulus--7/95 2.4.19c. Tensile Strength and Elongation, Flexible Printed Wiring Materials--5/98 2.4.20. Terminal Bond Strength, Flexible Printed Wiring--4/73 2.4.21d. Land Bond Strength, Unsupported Component Hole--8/97 弓曲和扭曲) 2.4.21.1c. Bond Strength, Surface Mount Lands Perpendicular Pull Method--5/91 2.4.22.1c. Bow and Twist-Laminate--5/93 2.4.22c. Bow and Twist (Percentage)--6/99(2.4.22.2. Substrate Curvature: Silicon Wafers with Deposited Dielectrics--7/95 2.4.23. Soldering Resistance of Laminate Materials--3/79 2.4.24c. Glass Transition Temperature and Z-Axis Thermal Expansion by TMA— 12/94(玻璃化温度和Z向膨胀-TMA法) 2.4.24.1. Time to Delamination (TMA Method)--12/94 2.4.24.2. Glass Transition Temperature of Organic Films - DMA Method--7/95 2.4.24.3. Glass Transition Temperature of Organic Films - TMA Method--7/95 2.4.24.4. Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98 2.4.24.5. Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias –TMA Method -11/98 2.4.25c. Glass Transition Temperature and Cure Factor by DSC--12/94(玻璃化温度和固 ---DSC法) 化系数 2.4.26. Tape Test for Additive Printed Boards--3/79 2.4.27.1b. Abrasion (Taber Method), Solder Mask and Conformal Coating--1/95(阻焊剂 :Taber) 法 和覆形涂层耐磨擦性测试 2.4.27.2a. Solder Mask Abrasion (Pencil Method)--2/88(阻焊剂耐磨擦性测试:Pencil法) 2.4.28b. Adhesion, Solder Mask (Non-Melting Metals)--8/97(阻焊膜附着力(在不熔金 ) ) 属上 2.4.28.1b. Adhesion, Solder Resist (Mask), Tape Test Method--3/98(阻焊膜附着力测 :(胶带法) ) 试 2.4.29b. Adhesion, Solder Mask, Flexible Circuit--2/88(挠性印制电路阻焊剂的附着力 ) 测试 2.4.30. Impact Resistance, Polymer Film--10/86 2.4.31a. Folding, Flexible Flat Cable--4/86 2.4.32a. Fold Temperature Testing, Flexible Flat Cable--4/86 2.4.33c. Flexural Fatigue and Ductility, Flat Cable--3/91 2.4.34. Solder Paste Viscosity - T-Bar Spin Spindle Method (applicable for 300,000 to 1,600,000 Centipose)--1/95 2.4.34.1. Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)--1/95 2.4.34.2. Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)--1/95 2.4.34.3. Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)--1/95 2.4.34.4. Paste Flux Viscosity - T-Bar Spindle Method--1/95 引线 2.4.35. Solder Paste - Slump Test--1/95 ) 金属化通孔的模拟返工2.4.36b. Rework Simulation, Plated-Through Holes for Leaded Components--8/97(2.4.37a. Evaluation of Hand Soldering Tools for Terminal Connections--7/91 2.4.37.1a. Evaluation of Hand Soldering Tools for Printed Wiring Board Applications— 7/91 2.4.37.2. Evaluation of Hand Soldering Tools on Heavy Thermal Loads--7/93 2.4.38a. Prepeg Scaled Flow Testing--6/91(半固化片流动性的换算测试) 2.4.39a. Dimensional Stability, Glass Reinforced Thin Laminates--2/86(增强型玻璃纤维 ) 薄层压板尺寸稳定性测试 2.4.40. Inner Layer Bond Strength of Multilayer Printed Circuit Boards--10/87 2.4.41. Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards--3/86(电 ) 气绝缘材料线性热膨胀系数测试方法 2.4.41.1a. Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method--8/97 2.4.41.2. Coefficient of Thermal Expansion - Strain Gage Method--8/97 2.4.41.3. In-Plane Coefficient of Thermal Expansion, Organic Films--7/95 2.4.41.4. Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates--7/95 2.4.42. Torsional Strength of Chip Adhesives--2/88 2.4.42.1. High Tempreature Mechanical Strength Retention of Adhesives--3/88 2.4.42.2. Die Shear Strength--2/98 2.4.42.3. Wire Bond Pull Strength--2/98 2.4.43. Solder Paste - Solder Ball Test--1/95 2.4.44. Solder Paste - Tack Test--3/98 2.4.45. Solder Paste - Wetting Test--1/95 2.4.46. Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms--1/95 2.4.47. Flux Residue Dryness--1/95 2.4.48. Spitting of Flux-Cored Wire Solder--1/95 2.4.49. Solder Pool Test--1/95 2.4.50. Thermal Conductivity, Polymer Films--7/95 2.4.51. Self Shimming Thermally Conductive Adhesives--1/95 IPC TM-650 Test Methods Manual SECTION 2.5 - ELECTRICAL TEST METHODS 2.5.1b. Arc Resistance of Printed Wiring Materials--5/86(印制线路基材的耐弧性) 2.5.2a. Capacitance of Insulating Materials--7/75 2.5.3b. Current Breakdown, Plated Through Holes--8/97 2.5.4. Current Carrying Capacity, Multilayer Printed Wring--4/73(多层线路板耐电流) 2.5.4.1a. Conductor Temperature Rise Due to Current Changes in Conductors--8/97 2.5.5a. Dielectric Constant of Printed Wiring Materials--7/75 2.5.5.1b. Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 100MHz (Contacting Electrode Systems)--5/86 2.5.5.2a. Dielectric Constant and Dissipation Factor of Printed Wiring Board Material— Clip Method--12/87(印制线路板材介电常数和损耗因数妁测试:夹持法) 2.5.5.3c. Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)--12/87(电容率(介电常数)和损耗角正切 (损耗因数)的测试(二流体槽法) ) 2.5.5.4. Dielectric Constant and Dissipation Factor of Printed Wiring Board Material— Micrometer Method--10/85 2.5.5.5c. Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band--3/98 2.5.5.5.1. Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ--3/98 2.5.5.6. Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates— 5/89 2.5.5.7. Characteristic Impedance and Time Delay of Lines on Printed Boards by TDR— 11/92 2.5.5.8. Low Frequency Dielectric Constant and Loss Tangent, Polymer Films--7/95 刚性印制电路材料 2.5.5.9. Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz--11/98 ) 介质击穿强度的测试2.5.6b. Dielectric Breakdown of Rigid Printed Wiring Material--5/86(2.5.6.1a. Dielectric Strength, Polymer Solder Mask and/or Conformal oatings--2/88(聚合 ) 物阻焊剂及覆形涂层的介电强度 2.5.6.2a. Electric Strength of Printed Wiring Material--8/97(印制线路材料的抗电强度) 2.5.6.3Dielectric Breakdown Voltage and Dielectric Strength--10/86 2.5.7c. Dielectric Withstanding Voltage, PWB--8/97(印制电路板的耐电压) 2.5.8a. Dissipation Factor of Flexible Printed Wiring Material--7/75 2.5.10a. Insulation Resistance, Multilayer Printed Wiring (Between Layers)--12/87 2.5.10.1. Insulation Resistivity for Adhesive Interconnection Bonds--11/98 2.5.11. Insulation Resistance, Multilayer Printed Wiring (Within a Layer)--4/73 2.5.12. Interconnection Resistance, Multilayer Printed Wiring--4/73 2.5.13a. Resistance of Copper Foil--3/76 2.5.14a. Resistivity of Copper Foil--8/76 2.5.15a. Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable--10/86 2.5.16a. Shorts, Internal on Multilayer Printed Wiring--11/88(多层印制电路板内部的短 ) 路 2.5.17e. Volume Resistivity and Surface Resistance of Printed Wiring Materials--5/98 2.5.17.1a. Volume and Surface Resistivity of Dielectric Materials--12/94(印制线路层压 ) 板体积电阻率和表面电阻率 2.5.17.2. Volume Resistivity of Conductive Resistance Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method—11/98 2.5.18b. Characteristic Impedance Flat Cables (Unbalanced)--7/84 2.5.19a. Propagation Delay of Flat Cables Using Time Domain Reflectometer--7/84 2.5.19.1a. Propagation Delay of Flat Cables Using Time Domain Reflectometer (TDR)— 7/84 2.5.21a. Digital Unbalanced Crosstalk, Flat Cable--3/84 2.5.24. Conductor Resistance, Flexible Flat Cable--6/79 2.5.25a. Dielectric Withstand Voltage Flexible Fat Cable--11/85 2.5.26a. Insulation Resistance Flexible Flat Cable--11/85 2.5.27. Surface Insulation Resistance of Raw Printed Wiring Board Material--3/79 2.5.28a. Q Resonance, Flexible Printed Wiring Materials--4/88(挠性印制线路材料谐振 Q值的测试) 2.5.30. Balanced and Unbalanced Cable Attenuation Measurements--12/87 2.5.31. Current Leakage (Through Overglaze Films)--12/87 2.5.32. Resistance Test, Plated Through-Holes--12/87 2.5.33. Measurement of Electrical Overstress from Soldering Hand Tools--11/98 2.5.33.1. Measurement of Electrical Overstress from Soldering Hand Tools (Ground Measurements)--11/98 2.5.33.2. Measurement of Electrical Overstress from Soldering Hand Tools (Transient Measurements)--11/98 2.5.33.3. Measurement of Electrical Overstress from Soldering Hand Tools (Current Leakage Measurements)--11/98 2.5.33.4. Measurement of Electrical Overstress from Soldering Hand Tools (Shielded Enclosure)--11/98 IPC TM-650 Test Methods Manual SECTION 2.6 - ENVIRONMENTAL TEST METHODS 印制线路材料的耐霉性) 2.6.2c. Water Absorption, Flexible Printed Wiring--5/98 2.6.1e. Fungus Resistance Printed Wiring Materials--8/97(2.6.2.1a. Water Absorption, Metal Clad Plastic Laminates--5/86(覆金属塑性层压板的吸 ) 水性 2.6.3e. Moisture and Insulation Resistance, Printed Boards--8/97(,,刚性刚挠挠性印制线 ) 路板的耐湿性和绝缘电阻 2.6.3.1c. Moisture and Insulation Resistance-Polymeric Solder Masks and Conformal Coatings--11/98() 聚合物阻焊剂和敷形涂层的耐湿性和绝缘电阻 2.6.3.2b. Moisture and Insulation Resistance, Flexible Base Dielectric--5/88 2.6.3.3a. Surface Insulation Resistance, Fluxes--1/95 2.6.4a. Outgassing, Printed Boards--8/97 2.6.5c. Physical Shock, Multilayer Printed Wiring--8/97 2.6.6b. Temperature Cycling, Printed Wiring Board--12/87 2.6.7a. Thermal Shock and Continuity, Printed Board--8/97 2.6.7.1. Thermal Shock--Polymer Solder Mask Coatings--2/88(聚合物阻杆剂涂层的耐 ) 热冲击 2.6.7.2a. Thermal Shock, Continuity and Microsection, Printed Board--8/97 2.6.8d. Thermal Stress, Plated Through-Holes--3/98 2.6.8.1. Thermal Stress, Laminate--9/91 2.6.9a. Vibration, Rigid Printed Wiring--8/97 2.6.9.1. Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy— 1/95 2.6.9.2. Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy— 1/95 2.6.10a. X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods--8/97(多 X射线检查) 层印制电路板 2.6.11b. Hydrolytic Stability Solder Mask and/or Conformal Coating--11/88(阻焊剂和敷 ) 形涂层的水稳定性 2.6.12. Temperature Testing, Flexible Flat Cable--6/79 2.6.13. Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring--10/85 2.6.14a. Resistance to Electrochemical Migration, Polymer Solder Mask--8/87(聚合物 ) 阻焊剂抗电迁移性 2.6.15b. Corrosion, Flux--1/95(助焊剂腐蚀性测试) 2.6.16. Pressure Vessel Method for Glass Epoxy Laminate Integrity--7/85(环氧玻璃布层 :压力容器法) 压板完善性试验方法 2.6.16.1. Moisture Resistance of HDIS Under High Temperature and Pressure (Pressure Vessel)--8/98 2.6.17. Hydrolitic Stability, Flexible Printed Wiring Material--12/82 2.6.18a. Low Temperature Flexibility, Flexible Printed Wiring Materials--7/85 2.6.19. Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards--12/87 2.6.20a. Assessment of Plastic Encapsulated Electronic Components for Susceptibility to Moisture/Reflow Induced Damage--1/95 2.6.21. Service Temperature of Flexible Printed Wiring--12/882.6.22Superseded by J- STD-035 (.pdf file) 2.6.23. Test Procedure for Steam Ager Temperature Repeatability--7/93 2.6.24 2-6-24. Junction Stability Under Environmental Conditions