CYPRESS USB3.0 硬件设计指南

www.cypress.com Document No. 001-70707 Rev. *D 1 AN70707 EZ-USB® FX3™ Hardware Design Guidelines and Schematic Checklist Author: Rizwan Afridi, Hussein Osman Associated Project: No Associated Part Family: CYUSB3014 Software Version: N/A Related Application Notes: None AN70707 discusses recommended practices for EZ-USB ® FX3™ hardware design and the critical items that a developer must consider. The Cypress EZ-USB FX3 is the next generation USB 3.0 peripheral controller. With its highly integrated and flexible features, developers can add USB 3.0 functionality to any system. Contents Introduction ....................................................................... 1 Power System ................................................................... 2 Overview ...................................................................... 2 Power Modes ............................................................... 3 Device Supply Decoupling............................................ 3 Inrush Current Consideration and Power Supply Design .............................................................. 3 Clocking ............................................................................ 5 Crystal .......................................................................... 5 Clock ............................................................................ 6 Watchdog Timer ........................................................... 6 GPIF II Interface ................................................................ 6 I 2 C Interface ...................................................................... 6 Low Performance Peripherals (LPP) ................................. 7 JTAG ............................................................................ 7 I 2 S................................................................................. 7 SPI and UART .............................................................. 7 Booting .............................................................................. 7 EMI and ESD Considerations ............................................ 7 FX3 Device Package Dimensions ..................................... 8 Electrical Design Consideration ........................................ 8 USB 3.0 SuperSpeed Design Guidelines ..................... 8 Appendix A – PCB Layout Tips ....................................... 14 Introduction The Cypress EZ-USB FX3 has an integrated USB 3.0 and USB 2.0 physical layer (PHY), and a fully configurable, parallel, general programmable interface called GPIF II, which can connect to an external processor, ASIC, or FPGA. EZ-USB FX3 enables data transfers up to 320 MBps from GPIF II to the USB interface. To successfully add this high throughput pipe to a system, a developer has to consider a number of critical items when designing the system. Because of the packaging and high-performance characteristics of the EZ-USB FX3 device, you should follow the guidelines for trace width, stack up, and other layout considerations to make sure the system will perform as expected. A reference schematic for the EZ-USB FX3 DVK is available at CYUSB3KIT-001 EZ-USB ® FX3™. EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 2 Power System Overview The EZ-USB FX3 device CYUSB3014 power domains are shown in the block diagram in Figure 1. A description and the voltage settings on each of these domains are provided in Table 1. Figure 1. EZ-USB FX3 Power Domains Diagram VBAT VIO1 VIO2 VIO3 VIO4 VIO5 VDD U3RXVDDQ VBAT 0.01uF 0.1uF VIO1 0.01uF 0.1uF VIO2 0.01uF 0.1uF VIO3 0.01uF 0.1uF VIO4 0.01uF 0.1uF VIO5 0.01uF 0.1uF VDD 0.1uF22uF U3RXVDDQ 0.1uF22uF V S S CVDDQ 0.01uF0.1uF CVDDQ AVDD AVDD 0.1uF2.2uF U3TXVDDQ U3TXVDDQ 0.1uF22uF VBUS 0.1uF VBUS A V S S U 2 A F E U 3 V S S U 2 P L L Table 1. EZ-USB FX3 Power Domains Description Parameter Description Min Typical Max Unit VDD Core voltage supply 1.15 1.2 V typical 1.25 V AVDD Analog voltage supply 1.15 1.2 V typical 1.25 V VIO1 GPIF II I/O power domain 1.7 1.8, 2.5 and 3.3 V typical 3.6 V VIO2 IO2 power domain 1.7 1.8, 2.5 and 3.3 V typical 3.6 V VIO3 IO3 power domain 1.7 1.8, 2.5 and 3.3 V typical 3.6 V VIO4 UART/SPI/I2S power domain 1.7 1.8, 2.5 and 3.3 V typical 3.6 V VIO5 I 2 C and JTAG supply domain 1.15 1.2, 1.8, 2.5 and 3.3 V typical 3.6 V VBATT USB voltage supply 3.2 3.7 V typical 6 V VBUS USB voltage supply 4.0 5 V typical 6 V CVDDQ Clock voltage supply 1.7 1.8, 3.3 V typical 3.6 V U3TXVDDQ USB 3.0 1.2 V supply 1.15 1.2 V typical 1.25 V U3RXVDDQ USB 3.0 1.2 V supply 1.15 1.2 V typical 1.25 V EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 3 Power Modes EZ-USB FX3 supports different power modes:  Normal mode: This is the full functional operating mode. In this mode the internal CPU clock and the internal PLLs are enabled.  The I/O power supplies VIO2, VIO3, VIO4, and VIO5 may be turned off when the corresponding interface is not in use. VIO1 may not be turned off at any time if the GPIF II interface is used in the application.  VBATT is a power input to the USB PHY. It is internally regulated to 3.3 V. When VBUS is greater than 3.7 V, VBUS becomes the primary supply to the USB circuitry unless there is a software override. VBATT pin can be left open if not used.  Suspend mode with USB 3.0 PHY enabled (L1): Power supply for the wakeup source and core power must be retained. All other power domains can be turned off/on individually.  Suspend mode with USB 3.0 PHY disabled (L2): Power supply for the wakeup source and core power must be retained. All other power domains can be turned off/on individually.  Standby mode (L3): Power supply for the wakeup source and core power must be retained. All other power domains can be turned off/on individually.  Core power down mode (L4): Core power is turned off. All other power domains can be turned off/on individually. Device Supply Decoupling Power supply decoupling is critical in ensuring that system noise does not propagate into the device through the power supply. Improper decoupling can lead to jittery signaling, especially on the USB bus, which results in higher CRC error rate and more retries. Decoupling capacitors should be Ceramic type of a stable dielectric. It is important to have the decoupling caps as close to the power pins as possible and short trace runs for the power and ground connections on the EZ-USB FX3 device to solid power and ground planes. Figure 2 shows a sample of decoupling caps placement. Figure 2. Decoupling Caps Placements Decoupling Caps placed close to the device The specific recommendation for the Ceramic capacitor nearest to each EZ-USB FX3 power pin is given in Table 2. Table 2. Power Domain Decoupling Requirements Cap Value Number of Caps Pin Name 22 uF, 0.01 uF 4 x 0.01 uF, 3 x 0.1 uF, 1 x 22 uF VDD 0.1 uF, 2.2 uF 1 of each AVDD 0.1 uF, 22 uF 1 of each U3TXVDDQ 0.1 uF, 22 uF 1 of each U3RXVDDQ 0.1 uF, 0.01 uF 1 of each CVDDQ 0.1 uF, 0.01 uF 1 of each per supply VIO1-5 0.1 uF 1 VBUS Inrush Current Consideration and Power Supply Design When the USB 3.0 Super Speed PHY is enabled for the first time, or a reset event; an initial inrush current is expected on the 1.2 V U3RXVDDQ and U3TXVDDQ supplies for ~10 us. The magnitude of this current can be as high as 800 mA. In order that this inrush current does not cause the common 1.2 V supply to droop to unacceptable levels, care must be taken in the design of the power supply network for these supplies. If the same 1.2 V supply is also used for the VDD core supply, care must be taken to insure that the level on this supply does not fall too low, as this has the potential to trip the on-chip power-on reset (POR) circuit that will reset the entire chip. The POR circuit can fire if the 1.2 V core VDD EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 4 voltage falls down to less than 0.83 V for more than 200 ns. The 1.2 V power network must be designed such that the VDD does not drop below 0.83 V when an inrush event occurs. Proper combination of decoupling capacitors (as specified in the datasheet), inductor chokes and regulator output impedance are required to make this possible. The following example waveforms show the inrush current (Figure 4) and resultant drop in VDD levels (Figure 5) when the current spike occurs. The results were obtained from a non-optimized power supply design using TPS76801QD power regulator, 2.2 uF decoupling caps and chokes as shown in Figure 3. Figure 3. Non-optimized Power Supply Design U3RXVDDQ U3TXVDDQ VDD FX3 0.1µF 2.2µF 0.1µF 2.2µF 0.1µF 2.2µF Lchoke Lchoke Lchoke Regulator TPS76801QD V1P2 Figure 4. Inrush Current (80 mV/0.1 Ω = 800 mA) Figure 5. 1.2 V Power Domain Voltage Drop (200 mV) In contrast, an optimized power design shown in Figure 6 below designed using the same regulator (TPS76801QD), with the modification of using 22 uF decoupling capacitor and removing the choke from VDD supply, shows a reduction in the inrush (Figure 7) and an improvement in the power supply drop (Figure 8). Figure 6. Optimized Power Supply Design U3RXVDDQ U3TXVDDQ VDD FX3 0.1µF 22µF 0.1µF 22µF 0.1µF 22µF Lchoke Lchoke Regulator TPS76801QD V1P2 Figure 7. Inrush Current (320 mA) EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 5 Figure 8. 1.2 V Power Domain Voltage Drop (112 mV) Customers can choose any regulator with similar specification. Clocking The EZ-USB FX3 device can use either a 19.2 MHz crystal or any of 19.2 MHz, 26 MHz 38.4 MHz, or 52 MHz clock as the clocking source. Crystal Figure 9 shows the connection of the crystal. Figure 9. Crystal Circuit The 19.2 MHz crystal requirements for is listed in Table 3. Table 3. Crystal Requirements Parameter Specification Unit Tolerance ±100 ppm Temp Range -40 to 85 °F Load capacitance 12 pF Drive level Use Equation-1 mW The power dissipation of the crystal depends on the drive level of the XTAL-OUT pin (for EZ-USB FX3 this is 1.32 V), the desired frequency (19.2 MHz) and the equivalent resistance of the crystal. Equation 1. Crystal Drive Level A compatible crystal‟s drive level should not exceed the power dissipation limitation of the crystal. Examples of compatible crystals are shown in Table 4, it must be noted that only the NX3225SA was characterized with the EZ-USB FX3, and the rest for the crystals are provided as example using the above equation. Table 4. Crystal Selection Device Max R1 (Ohm) from datasheet CL eqv (pF) C0 (pF) estimate Drive Level using equation 1 (uW) Max Drive Level (Spec) uW Epson FA- H20 40 6 3 82 100 ITTI I16 80 6 3 171 300 NX2520SA 50 6 3 107 200 NX3225SA 50 6 3 107 200 Saronix-FL 40 6 3 82 100 EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 6 Clock Clock inputs to EZ-USB FX3 must meet the phase noise and jitter requirements specified in the following table. Table 5. Clock Requirements Parameter Description Specification Units Min Max Phase noise 100 Hz Offset – –75 dB 1 kHz Offset – –104 dB 10 kHz Offset. – -120 dB 100 kHz Offset – -128 dB 1 MHz Offset – -130 dB Maximum frequency deviation – 150 ppm Duty cycle 30 70 % Overshoot – 3 % Undershoot – -3 % Rise time/fall time – 3 ns Based on the clocking option that is used, the frequency select, FSLC[2:0], lines can be tied to power, through a weak pull-up resistor, or to ground. Table 6 shows the values of FSLC[2:0] for the different clocking options. Table 6. Frequency Select Configuration FSLC[2] FSLC[1] FSLC[0] Crystal/Clock Frequency 0 0 0 19.2 MHz crystal 1 0 0 19.2 MHz input clock 1 0 1 26 MHz input clock 1 1 0 38.4 MHz input clock 1 1 1 52 MHz input clock CVDDQ supply is the supply associated with the clock input. It should be set to the same voltage level as the external clock input (if any). If only external clock input is used, the XTALIN and XTALOUT pins can be left unconnected. If only crystal clocking is used, the CLKIN pin can be left unconnected. Watchdog Timer A 32.768 kHz clock input can be used for watchdog timer operation during Standby mode. This may be optionally supplied by an external source. Table 7. Wachdog Timer Requirements Parameter Min Max Unit Duty Cycle 40 60 % Frequency Deviation - ±200 ppm GPIF II Interface EZ-USB FX3 offers a high-performance general programmable interface, GPIF II. This interface enables functionality similar to but more advanced than FX2LP‟s GPIF and Slave FIFO interfaces. AN65974 “Designing with the EZ-USB FX3 Slave FIFO Interface” and AN75779 “Interfacing the EZ-USB FX3 to an Image Sensor in UVC Framework” are two popular application notes regarding the GPIF interface. Following are some general design guidelines for the EZ-USB FX3‟s GPIF II interface.  The maximum frequency of the GPIF II interface is 100 MHz. It is recommended that all lines on the GPIF II bus should be length matched within 500 mils. We also recommend using 22-Ohm series termination resistors  If the GPIF lines are to be routed for more than 5 inches or routed through a medium, which can cause impedance mismatch, we recommend doing signal integrity simulation using the EZ-USB FX3 IBIS model, available at CYUSB3KIT-001 EZ-USB ® FX3™ and come up with a termination.  GPIO[16] (PCLK) should be used as the GPIF II clock signal in all synchronous interfaces.  GPIO[32:30] (PMODE[2:0]) signals should be configured appropriately at FX3 boot-up. After boot- up, these signals can be used as GPIOs.  INT# signal cannot be used as a GPIO. I2C Interface EZ-USB FX3 has an I 2 C interface compatible with the I 2 C Bus Specification Revision 3. EZ-USB FX3‟s I 2 C interface is capable of operating as I 2 C Master only. For example, EZ-USB FX3 may boot from an EEPROM connected to the I 2 C interface, as a selectable boot option. EZ-USB FX3‟s I 2 C Master Controller also supports Multi-master mode functionality. EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 7 The power supply for the I 2 C interface is VIO5, which is a separate power domain from the other serial peripherals. This is to allow the I 2 C interface the flexibility to operate at a different voltage than the other serial interfaces. The bus frequencies supported by the I 2 C controller are 100 kHz, 400 kHz, and 1 MHz. When VIO5 is 1.2 V, the maximum operating frequency supported is 100 kHz. When VIO5 is 1.8 V, 2.5 V, or 3.3 V, the operating frequencies supported are 400 kHz and 1 MHz. If an external EEPROM is used on the I 2 C bus for firmware image booting, 2 kΩ pull-up resistors should be placed on the SCL and SDA lines for proper operation as shown in Figure 10. Figure 10. I 2 C Configuration Low Performance Peripherals (LPP) JTAG EZ-USB FX3 has a JTAG interface to provide a standard five-pin interface for connecting to a JTAG debugger. This feature enables the debugging of the firmware through the CPU core's on-chip debug circuitry. There is no need for external pull up/down on the JTAG signals as the JTAG signals TDI, TMC, TRST# signals have fixed 50 kΩ internal pull-ups and the TCK signal has a fixed 10 kΩ pull-down resistor. I2S EZ-USB FX3 has an I 2 S port to support external audio codec devices. EZ-USB FX3 functions as an I 2 S master (transmitter only). EZ-USB FX3 can generate the system clock as an output on the I2S_MCLK line or accept an external system clock input on the same line. SPI and UART EZ-USB FX3 supports an SPI master interface on the serial peripherals port. The SPI GPIOs are shared with the UART GPIOs. There should be no pull up/down on MOSI and MISO signals. Figure 11 shows the correct SPI signal connection using the M25P40-VMN6TPB SPI device. Figure 11. SPI Configuration Booting EZ-USB FX3 can be either the main processor in a system or a co-processor to another main processor. The booting option you use depends on the specific system implementation. PMODE[2:0] configures the boot option and can be connected directly to the main processor or hardwired on the board depending on the booting option that will be used. The following table shows the levels of the PMODE[2:0] signals required for the different booting options. Table 8. PMODE Signals Setting PMODE[2:0] Boot from Z00 Sync ADMUX (16-bit) Z01 Async ADMUX (16-bit) Z11 USB boot Z0Z Async SRAM (16-bit) Z1Z I 2 C, on failure, USB boot is enabled 1ZZ I 2 C only 0Z1 SPI, on failure, USB boot is enabled Note Z = High-Z, Open drain, No connect We recommend adding pull-up and pull-down options on the PMODE[2:0] signals and load the combination needed for preferred booting option. This will give the flexibility to debug the system during early development. EMI and ESD Considerations You must consider EMI and ESD on a case-by-case basis relative to the product enclosure, deployment environment, and regulatory statutes. This application note does not give specific recommendations regarding EMI, EZ-USB FX3 meets EMI requirements outlined by FCC 15B (USA) and EN55022 (Europe) for consumer electronics. EZ-USB FX3 can tolerate reasonable EMI, EZ-USB ® FX3™ Hardware Design Guidelines and Schematic Checklist www.cypress.com Document No. 001-70707 Rev. *D 8 which is conducted by the aggressor, outlined by these specifications and continue to function as expected. However this application note gives general EMI and ESD considerations. Refer to Appendix A – PCB Layout Tips for general information on PCB layout techniques. You can also refer „Appendix A: PCB Layout Tips of AN61290 - PSoC ® 3 and PSoC 5 Hardware Design Considerations‟, which has a list of layout tips to improve EMI/EMC and also have reference books on this topic. EZ-USB FX3 has built-in ESD protection on the D+, D- and GND pins on the USB interface. The ESD protection levels provided on these ports are:  ±2.2 kV human body model (HBM) based on ±6 kV Contact Discharge and ±8 kV Air Gap Discharge based on IEC61000-4-2 level 3A  ±8 kV Contact Discharge and ±15 kV Air Gap Discharge based on IEC61000-4-2 level 4C. This protection ensures the device will continue to function after ESD events up to the levels stated. The SSRX+, SSRX-, SSTX+, SSTX- pins have only up to ±2.2 kV human body model (HBM) internal ESD protection. You can include additional protection to these pins by using high performance, low capacitance external ESD devices (SP3010-04UTG), as shown in Figure 12. To prevent an effect on the performance of this bus, the added capacitance should not exceed 0.5 pF. Figure 12. Low Capacitance External USB SuperSpeed ESD Protection In terms of EMI, all signal and clock traces emit electromagnetic (EM) radiation when they switch from one level to another. To meet the various standards in different countries, these emissions must be minimized. You can use several techniques to lower EM emissions:  Consider putting the power and ground planes as t