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C1412EOA中文资料

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C1412EOA中文资料C1412EOA中文资料2003MicrochipTechnologyInc.DS21391C-page1MTC1412/TC1412NFeatures•Latch-UpProtected:WillWithstand500mAReverseCurrent•InputWillWithstandNegativeInputsUpto5V•ESDProtected:4kV•HighPeakOutputCurrent:2A•WideInputSupplyVoltageOperatingRange:-4.5Vto16V•HighCapac...
C1412EOA中文资料
C1412EOA中文资料2003MicrochipTechnologyInc.DS21391C-page1MTC1412/TC1412NFeatures•Latch-UpProtected:WillWithstand500mAReverseCurrent•InputWillWithstandNegativeInputsUpto5V•ESDProtected:4kV•HighPeakOutputCurrent:2A•WideInputSupplyVoltageOperatingRange:-4.5Vto16V•HighCapacitiveLoadDriveCapability:-1000pFin18nsec•ShortDelayTime:35nsecTyp.•MatchedDelayTimes•LowSupplyCurrent:-WithLogic‘1’Input:500µA-WithLogic‘0’Input:100µA•LowOutputImpedance:4Ω•AvailableinSpace-Saving8-pinMSOPPackage•PinoutSameasTC1410/TC1411/TC1413Applications•SwitchModePowerSupplies•PulseTransformerDrive•LineDrivers•RelayDriverPackageTypeGeneralDescriptionTheTC1412/TC1412Nare2ACMOSbuffers/drivers.Theywillnotlatch-upunderanyconditionswithintheirpowerandvoltageratings.Theyarenotsubjecttodamagewhenupto5Vofnoisespikingofeitherpolarityoccursonthegroundpin.Theycanaccept,withoutdamageorlogicupset,upto500mAofcurrentofeitherpolaritybeingforcedbackintotheiroutput.Allterminalsarefullyprotectedagainstupto4kVofelectrostaticdischarge.AsMOSFETdrivers,theTC1412/TC1412Ncaneasilychargea1000pFgatecapacitancein18nsecwithmatchedriseandfalltimes,andprovidelowenoughimpedanceinboththeONandtheOFFstatestoensuretheMOSFET’sintendedstatewillnotbeaffected,evenbylargetransients.Theleadingandtrailingedgepropagationdelaytimesarealsomatchedtoallowdrivingshort-durationinputswithgreateraccuracy.26,7Inverting8-PinMSOP/PDIP/SOIC1234VDD5678OUTGNDVDDINNCGNDOUTTC1412NC=NoInternalConnection26,7Non-Inverting12345678TC1412NVDDINNCGNDVDDOUTGNDOUTNOTE:Duplicatepinsmustbeconnectedtogetherforproperoperation.2AHigh-SpeedMOSFETDrivers元器件交易网www.cecb2b.comFunctionalBlockDiagramEffectiveInputC=10pFTC1412NOutputInputGNDVDD300mV4.7VInvertingNon-InvertingOutputsOutputsTC14121.0ELECTRICALCHARACTERISTICSAbsoluteMaximumRatings†SupplyVoltage(20)InputVoltage......................VDD+0.3VtoGND–5.0VPowerDissipation(TA≤70°C)MSOP..........................................................340mWPDIP............................................................730mWSOIC............................................................470mWStorageTemperatureRange..............-65°Cto+150°CMaximumJunctionTemperature......................+150ºC†Stressesabovethoselistedunder"AbsoluteMaximumRatings"maycausepermanentdamagetothedevice.Thesearestressratingsonlyandfunctionaloperationofthedeviceattheseoranyotherconditionsabovethoseindicatedintheoperationsectionsofthespecificationsisnotimplied.ExposuretoAbsoluteMaximumRatingconditionsforextendedperiodsmayaffectdevicereliability.PINFUNCTIONTABLESymbolDescriptionVDDSupplyinput,4.5Vto16VINPUTControlinputNCNoconnectionGNDGroundGNDGroundOUTPUTCMOSpush-pulloutput,commontopin7OUTPUTCMOSpush-pulloutput,commontopin6VDDSupplyinput,4.5Vto16VDCELECTRICALCHARACTERISTICSElectricalSpecifications:Unlessotherwisenoted,overoperatingtemperaturerangewith4.5V≤VDD≤16V.TypicalvaluesaremeasuredatTA=+25°C,VDD=16V.ParametersSymMinTypMaxUnitsConditionsInputLogic‘1’,HighInputVoltageVIH2.0——VLogic‘0’,LowInputVoltageVIL——0.8VInputCurrentIIN-1.0—1.0µA0V≤VIN≤VDD,TA=+25°C-10—10-40°C≤TA≤+85°COutputHighOutputVoltageVOHVDD–0.025——VDCTestLowOutputVoltageVOL——0.025VDCTestOutputResistanceRO—46ΩVDD=16V,IO=10mA,TA=+25°C—570°C≤TA≤+70°C—57-40°C≤TA≤+85°CPeakOutputCurrentIPK—2.0—AVDD=16VLatch-UpProtectionWithstandReverseCurrentIREV—0.5—ADutycycle≤2%,t≤300µsec,VDD=16VSwitchingTime(Note1)RiseTimetR—1826nsecTA=+25°C—20310°C≤TA≤+70°C—2231-40°C≤TA≤+85°C,Figure4-1FallTimetF—1826nsecTA=+25°C—20310°C≤TA≤+70°C—2231-40°C≤TA≤+85°C,Figure4-1Note1:Switchingtimesensuredbydesign.TEMPERATURECHARACTERISTICSDelayTimetD1—3545nsecTA=+25°C,—40500°C≤TA≤+70°C—4050-40°C≤TA≤+85°C,Figure4-1DelayTimetD2—3545nsecTA=+25°C—40500°C≤TA≤+70°C—4050-40°C≤TA≤+85°C,Figure4-1PowerSupplyPowerSupplyCurrentIS—0.51.0mAVIN=3V,VDD=16V—0.10.15VIN=0VElectricalSpecifications:Unlessotherwisenoted,allparametersapplywith4.5V≤VDD≤18V.ParametersSymMinTypMaxUnitsConditionsTemperatureRangesSpecifiedTemperatureRange(C)TA0—+70ºCSpecifiedTemperatureRange(E)TA-40—+85ºCMaximumJunctionTemperatureTJ——+150ºCStorageTemperatureRangeTA-65—+150ºCPackageThermalResistancesThermalResistance,8L-MSOPθJA—206—ºC/WThermalResistance,8L-PDIPθJA—125—ºC/WThermalResistance,8L-SOICθJA—155—ºC/WDCELECTRICALCHARACTERISTICS(CONTINUED)ElectricalSpecifications:Unlessotherwisenoted,overoperatingtemperaturerangewith4.5V≤VDD≤16V.TypicalvaluesaremeasuredatTA=+25°C,VDD=16V.ParametersSymMinTypMaxUnitsConditionsNote1:Switchingtimesensuredbydesign.2.0TYPICALPERFORMANCECURVESNote:Unlessotherwiseindicated,overoperatingtemperaturerangewith4.5V≤VDD≤16V.FIGURE2-1:QuiescentSupplyCurrentvs.SupplyVoltage.FIGURE2-2:InputThresholdvs.SupplyVoltage.FIGURE2-3:High-StateOutputResistancevs.SupplyVoltage.FIGURE2-4:QuiescentSupplyCurrentvs.Temperature.FIGURE2-5:InputThresholdvs.Temperature.FIGURE2-6:Low-StateOutputResistancevs.SupplyVoltage.Note:Thegraphsandtablesprovidedfollowingthisnoteareastatisticalsummarybasedonalimitednumberofsamplesandareprovidedforinformationalpurposesonly.Theperformancecharacteristicslistedhereinarenottestedorguaranteed.Insomegraphsortables,thedatapresentedmaybeoutsidethespecifiedoperatingrange(e.g.,outsidespecifiedpowersupplyrange)andthereforeoutsidethewarrantedrange.Note:Unlessotherwiseindicated,overoperatingtemperaturerangewith4.5V≤VDD≤16V.FIGURE2-7:RiseTimevs.SupplyVoltage.FIGURE2-8:PropagationDelayvs.SupplyVoltage.FIGURE2-9:RiseandFallTimesvs.CapacitiveLoad.FIGURE2-10:FallTimevs.SupplyVoltage.FIGURE2-11:PropagationDelayvs.SupplyVoltage.FIGURE2-12:PropagationDelaysvs.CapacitiveLoad.3.0PINDESCRIPTIONSThedescriptionsofthepinsarelistedinTable3-1.TABLE3-1:PINFUNCTIONTABLE3.1SupplyInput(VDD)TheVDDinputisthebiassupplyfortheMOSFETdriverandisratedfor4.5Vto16Vwithrespecttothegroundpin.TheVDDinputshouldbebypassedtogroundwithalocalceramiccapacitor.Thevalueofthecapacitorshouldbechosenbasedonthecapacitiveloadthatisbeingdriven.Avalueof1.0µFissuggested.3.2ControlInput(INPUT)TheMOSFETdriverinputisahigh-impedance,TTL/CMOS-compatibleinput.Theinputhas300mVofhysteresisbetweenthehighandlowthresholdswhichpreventsoutputglitchingevenwhentheriseandfalltimeoftheinputsignalisveryslow.3.3CMOSPush-PullOutput(OUTPUT)TheMOSFETdriveroutputisalow-impedance,CMOSpush-pullstyleoutput,capableofdrivingacapacitiveloadwith2Apeakcurrents.3.4Ground(GND)Thegroundpinsarethereturnpathforthebiascurrentandforthehighpeakcurrentsthatdischargetheloadcapacitor.Thegroundpinsshouldbetiedintoagroundplaneorhaveveryshorttracestothebiassupplysourcereturn.3.5NoConnect(NC)Nointernalconnection.PinNo.SymbolDescription1VDDSupplyinput,4.5Vto16V2INPUTControlinput3NCNoconnection4GNDGround5GNDGround6OUTPUTCMOSpush-pulloutput,commontopin77OUTPUTCMOSpush-pulloutput,commontopin68VDDSupplyinput,4.5Vto16V4.0APPLICATIONINFORMATIONFIGURE4-1:SwitchingTimeTestCircuit.CL=1000pF0.1µF1.0µFInvertingDriverNon-InvertingDriverInputVDD=16VInputOutputtD1tFtRtD2Input:100kHz,squarewave,tRISE=tFALL≤10nsecOutputInputOutputtD1tFtRtD2+5V10%90%10%90%10%90%VDD0V90%10%10%10%90%+5VVDD0V0V0V90%4,526,71,8TC1412TC1412NTC1412NTC14125.0PACKAGINGINFORMATION5.1PackageMarkingInformation8-LeadPDIP(300mil)Example:Legend:XX...XCustomerspecificinformation*YYYearcode(last2digitsofcalendaryear)WWWeekcode(weekofJanuary1isweek‘01’)NNNAlphanumerictraceabilitycodeNote:IntheeventthefullMicrochippartnumbercannotbemarkedononeline,itwillbecarriedovertothenextlinethuslimitingthenumberofavailablecharactersforcustomerspecificinformation.*StandardmarkingconsistsofMicrochippartnumber,yearcode,weekcode,traceabilitycode(facilitycode,maskrev#,andassemblycode).Formarkingbeyondthis,certainpriceaddersapply.PleasecheckwithyourMicrochipSalesOffice.8-LeadSOIC(150mil)8-LeadMSOPExample:XXXXXXXYWWNNN1412NE3470578-LeadPlasticDualIn-line(PA)–300mil(PDIP)B1BA1ALA2pαEeBβcE1nD12UnitsINCHES*MILLIMETERSDimensionLimitsMINNOMMAXMINNOMMAXNumberofPinsn88Pitchp.1002.54ToptoSeatingPlaneA.140.155.1703.563.944.32MoldedPackageThicknessA2.115.130.1452.923.303.68BasetoSeatingPlaneA1.0150.38ShouldertoShoulderWidthE.300.313.3257.627.948.26MoldedPackageWidthE1.240.250.2606.106.356.60OverallLengthD.360.373.3859.149.469.78TiptoSeatingPlaneL.125.130.1353.183.303.43LeadThicknessc.008.012.0150.200.290.38UpperLeadWidthB1.045.058.0701.141.461.78LowerLeadWidthB.014.018.0220.360.460.56OverallRowSpacing§eB.310.370.4307.879.4010.92MoldDraftAngleTopα5101551015MoldDraftAngleBottomβ5101551015*ControllingParameterNotes:DimensionsDandE1donotincludemoldflashorprotrusions.MoldflashorprotrusionsshallnotexceedJEDECEquivalent:MS-001DrawingNo.C04-018.010”(0.254mm)perside.§SignificantCharacteristic2003MicrochipTechnologyInc.DS21391C-page11TC1412/TC1412N8-LeadPlasticSmallOutline(OA)–Narrow,150mil(SOIC)FootAngleφ048048151201512βMoldDraftAngleBottom1512015120αMoldDraftAngleTop0.510.420.33.020.017.013BLeadWidth0.250.230.20.010.009.008cLeadThickness0.760.620.48.030.025.019LFootLength0.510.380.25.020.015.010hChamferDistance5.004.904.80.197.193.189DOverallLength3.993.913.71.157.154.146E1MoldedPackageWidth6.206.025.79.244.237.228EOverallWidth0.250.180.10.010.007.004A1Standoff§1.551.421.32.061.056.052A2MoldedPackageThickness1.751.551.35.069.061.053AOverallHeight1.27.050pPitch88nNumberofPinsMAXNOMMINMAXNOMMINDimensionLimitsMILLIMETERSINCHES*Units21DnpBEE1hLβc45°φA2αAA1*ControllingParameterNotes:DimensionsDandE1donotincludemoldflashorprotrusions.Moldflashorprotrusionsshallnotexceed.010”(0.254mm)perside.JEDECEquivalent:MS-012DrawingNo.C04-057§SignificantCharacteristicTC1412/TC1412N8-LeadPlasticMicroSmallOutlinePackage(UA)(MSOP)DS21391C-page122003MicrochipTechnologyInc.2003MicrochipTechnologyInc.DS21391C-page13TC1412/TC1412NPRODUCTIDENTIFICATIONSYSTEMToorderorobtaininformation,e.g.,onpricingordelivery,refertothefactoryorthelistedsalesoffice.SalesandSupportDevice:TC1412:2ASingleMOSFETDriver,InvertingTC1412N:2ASingleMOSFETDriver,Non-InvertingTemperatureRange:C=0°Cto+70°CE=-40°Cto+85°CPackage:OA=PlasticSOIC,(150milBody),8-leadOA713=PlasticSOIC,(150milBody),8-lead(TapeandReel)UA=PlasticMicroSmallOutline(MSOP),8-lead*UA713=PlasticMicroSmallOutline(MSOP),8-lead*(TapeandReel)PA=PlasticDIP(300milBody),8-lead*MSOPpackageisonlyavailableinE-Temp.PARTNO.X/XXPackageTemperatureRangeDeviceExamples:a)TC1412COA:2ASingleMOSFETdriver,SOICpackage,0°Cto+70°C.b)TC1412CPA:2ASingleMOSFETdriver,PDIPpackage,0°Cto+70°C.c)TC1412EUA713:TapeandReel,2ASingleMOSFETdriver,MSOPpackage,-40°Cto+85°C.a)TC1412NCPA:2ASingleMOSFETdriver,PDIPpackage,0°Cto+70°C.b)TC1412NEPA:2ASingleMOSFETdriver,PDIPpackage,-40°Cto+85°C.c)TC1412NEUA:2ASingleMOSFETdriver,MSOPpackage,-40°Cto+85°C.DataSheetsProductssupportedbyapreliminaryDataSheetmayhaveanerratasheetdescribingminoroperationaldifferencesandrecommendedworkarounds.Todetermineifanerratasheetexistsforaparticulardevice,pleasecontactoneofthefollowing:1.YourlocalMicrochipsalesoffice2.TheMicrochipCorporateLiteratureCenterU.S.FAX:(480)792-72773.TheMicrochipWorldwideSite(www.microchip.com)Pleasespecifywhichdevice,revisionofsiliconandDataSheet(includeLiterature#)youareusing.CustomerNotificationSystemRegisteronourwebsite(www.microchip.com/cn)toreceivethemostcurrentinformationonourproducts.TC1412/TC1412NNOTES:DS21391C-page142003MicrochipTechnologyInc.2003MicrochipTechnologyInc.DS21391C-page15Informationcontainedinthispublicationregardingdeviceapplicationsandthelikeisintendedthroughsuggestiononlyandmaybesupersededbyupdates.Itisyourresponsibilitytoensurethatyourapplicationmeetswithyourspecifications.NorepresentationorwarrantyisgivenandnoliabilityisassumedbyMicrochipTechnologyIncorporatedwithrespecttotheaccuracyoruseofsuchinformation,orinfringementofpatentsorotherintellectualpropertyrightsarisingfromsuchuseorotherwise.UseofMicrochip’sproductsascriticalcomponentsinlifesupportsystemsisnotauthorizedexceptwithexpresswrittenapprovalbyMicrochip.Nolicensesareconveyed,implicitlyorotherwise,underanyintellectualpropertyrights.TrademarksTheMicrochipnameandlogo,theMicrochiplogo,KEELOQ,MPLAB,PIC,PICmicro,PICSTART,PROMATEandPowerSmartareregisteredtrademarksofMicrochipTechnologyIncorporatedintheU.S.A.andothercountries.FilterLab,microID,MXDEV,MXLAB,PICMASTER,SEEVALandTheEmbeddedControlSolutionsCompanyareregisteredtrademarksofMicrochipTechnologyIncorporatedintheU.S.A.Accuron,ApplicationMaestro,dsPIC,dsPICDEM,dsPICDEM.net,ECONOMONITOR,FanSense,FlexROM,fuzzyLAB,In-CircuitSerialProgramming,ICSP,ICEPIC,microPort,MigratableMemory,MPASM,MPLIB,MPLINK,MPSIM,PICC,PICkit,PICDEM,PICDEM.net,PowerCal,PowerInfo,PowerMate,PowerTool,rfLAB,rfPIC,SelectMode,SmartSensor,SmartShunt,SmartTelandTotalEndurancearetrademarksofMicrochipTechnologyIncorporatedintheU.S.A.andothercountries.SerializedQuickTurnProgramming(SQTP)isaservicemarkofMicrochipTechnologyIncorporatedintheU.S.A.Allothertrademarksmentionedhereinarepropertyoftheirrespectivecompanies.©2003,MicrochipTechnologyIncorporated,PrintedintheU.S.A.,AllRightsReserved.Printedonrecycledpaper.NotethefollowingdetailsofthecodeprotectionfeatureonMicrochipdevices:•MicrochipproductsmeetthespecificationcontainedintheirparticularMicrochipDataSheet.•Microchipbelievesthatitsfamilyofproductsisoneofthemostsecurefamiliesofitskindonthemarkettoday,whenusedintheintendedmannerandundernormalconditions.•Therearedishonestandpossiblyillegalmethodsusedtobreachthecodeprotectionfeature.Allofthesemethods,toourknowledge,requireusingtheMicrochipproductsinamanneroutsidetheoperatingspecificationscontainedinMicrochip'sDataSheets.Mostlikely,thepersondoingsoisengagedintheftofintellectualproperty.•Microchipiswillingtoworkwiththecustomerwhoisconcernedabouttheintegrityoftheircode.•NeitherMicrochipnoranyothersemiconductormanufacturercanguaranteethesecurityoftheircode.Codeprotectiondoesnotmeanthatweareguaranteeingtheproductas“unbreakable.”Codeprotectionisconstantlyevolving.WeatMicrochiparecommittedtocontinuouslyimprovingthecodeprotectionfeaturesofourproducts.Attemptstobreakmicrochip’scodeprotectionfeaturemaybeaviolationoftheDigitalMillenniumCopyrightAct.Ifsuchactsallowunauthorizedaccesstoyoursoftwareorothercopyrightedwork,youmayhavearighttosueforreliefunderthatAct.MicrochipreceivedQS-9000qualitysystemcertificationforitsworldwideheadquarters,designandwaferfabricationfacilitiesinChandlerandTempe,ArizonainJuly1999andMountainView,CaliforniainMarch2002.TheCompany’squalitysystemprocessesandproceduresareQS-9000compliantforitsPICmicro®8-bitMCUs,KEELOQ®codehoppingdevices,SerialEEPROMs,microperipherals,non-volatilememoryandanalogproducts.Inaddition,Microchip’squalitysystemforthedesignandmanufactureofdevelopmentsystemsisISO9001certified.MAMERICASCorporateOffice2355WestChandlerBlvd.Chandler,AZ85224-6199Tel:480-792-7200Fax:480-792-7277TechnicalSupport:480-792-7627WebAddress:Atlanta3780MansellRoad,Suite130Alpharetta,GA30022Tel:770-640-0034Fax:770-640-0307Boston2LanDrive,Suite120Westford,MA01886Tel:978-692-3848Fax:978-692-3821Chicago333PierceRoad,Suite180Itasca,IL60143Tel:630-285-0071Fax:630-285-0075Dallas4570WestgroveDrive,Suite160Addison,TX75001Tel:972-818-7423Fax:972-818-2924DetroitTri-AtriaOfficeBuilding32255NorthwesternHighway,Suite190FarmingtonHills,MI48334Tel:248-538-2250Fax:248-538-2260Kokomo2767S.AlbrightRoadKokomo,IN46902Tel:765-864-8360Fax:7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