InSb超高灵敏度霍尔元件 HE12AF1U12

DATEOFISSUE:2014.07.31-1-HALLELEMENTSPECIFICATIONMODEL:SH-12AP/N:HE12A*1U12(*:Rank)HalogenFreeNANOSCo.,Ltd4,Madogongdanro,Madomyeon,Hwaseongsi,Gyeonggido,445-861,RepublicofKoreaDATEOFISSUE:2014.07.31-2-1.ApplicationThisspecificationSheetisappliedtoHallsensorthatNANOSsupplies.2.ElectricalCharacteristics2.1MaximumRatings(Ta:25℃)ParameterSymbolRatingUnitMaximumInputCurrentImax20(at25℃)mAMaximumPowerDissipationPmax150(at25℃)mWOperatingTemperatureRangeTop－40~＋120℃StorageTemperatureRangeTst－40~＋150℃2.2ElectricalCharacteristics(Measuredat25℃)ParameterSymbolMeasurementConditionsMinMaxUnitOutputHallVoltageVHVin＝1V,B＝500G196320mVInputResistanceRinI＝0.1mA240550ΩOutputResistanceRoutI＝0.1mA240550ΩOffsetVoltageVOVin＝1V,B＝0G－7＋7mVTemp.Coeff.ofVHαTa＝0~＋40℃―－1.8%/℃Temp.Coeff.ofRin,RoutβTa＝0~＋40℃―－1.8%/℃※VH＝VHM－VO(VHM:Theoutputvoltagemeasuredat500G.)2.3RankClassificationandMarkonOutputHallVoltageOutputHallVoltage,VH(mV)RankMarkMeasurementConditions196~236D·SDVin＝1V,B＝500G(ConstantVoltage)228~274E·SE266~320F·SFDATEOFISSUE:2014.07.31-3-3.MethodforMounting3.1LeadFrame1)Thematerialofleadframeisphosphorbronzealloyandthediebondedsurfaceisplatedbysilver.Theminimumthicknessofplatingis3.0㎛.2)LeadFrameisplatedbypureSnandthethicknessiscontrolledby4~12㎛.3.2SolderingConditionsonPCB1)Norapidheatingandcoolingisdesired.2)Preheatingisrecommendedfor1∼2minutesat150∼190℃.3)Reflowingisrecommendedfor10∼20secondsat220∼260℃.3.3SolderingMethodandTemperatureItemsMethodsTemperatureReflowSolderingbypassingtheheatedzoneMax260℃in10secSolderIronSolderingbysolder-ironMax350℃in3sec[ReflowMethod]60~120sec150220Temp.(℃)CoolingintheAir10~20sec190260TimeDATEOFISSUE:2014.07.31-4-4.Packaging4.1Taping1)SH-12Ashouldbepackedmarkingsidetocovertapesideandputlongsidetotaperunningdirection.180°rotationhasnoeffectontheapplication.2)Atleast,40mmvacantpartsaremadebothfrontandrearsideoftape.4.2HandlingMethodsofTape1)PullStrength(F)=20∼70g2)Devicesshouldnotrunoutofapocketwhentapeisbentdown15mmcurvature.3)Devicesshouldnotsticktocovertape.4)Devicesshouldbekeptbelow40℃andbelowRH80%intheshade.5)Tapehasnojoint.4.3PackingUnit1)3,000pcsofdevicesarepackedinonereel.2)Fivereelsarepackedinoneinnerbox.3)Fourinnerboxes,60,000pcsofdevices,arepackedinoneouterbox.4)Dummycouldbepackedforsafedealing.F165∼180°CoverTapeCarrierTapeTrailerVacantComponentsContainedLeaderPartHeaderVacantTapeRunningDirectionDATEOFISSUE:2014.07.31-5-5.ExternalDimensionsandAppearance5.1ExternalDimensions(Unit:mm)Fourleadsofinput·outputterminalsaredesignedinthediagonallysymmetricmodeandareequalindimensions.SH-12Acouldbeusedwithoutconsideringontherotationof180°.LEADCONNECTIONINPUTOUTPUT1(±)32(±)40.95±0.030.95±0.031.5±0.05(BOT)±2°10°±2°1.45±0.11.45±0.1±2°(±)(±)12342.9±0.10.4±0.030.3±0.030.8±0.030.05±0.03R0.15MAXR0.15MAX5°10°±2°0.1+0.05-01.1±0.06R0.12±0.020.35±0.052.9±0.1(BOT)5°'06.05.10/smk0.7±0.050.7±0.055.2MarkingMethodDevicesshouldbemarkedbyLASERbeamintheformof「·S+'Rank'」.[PackageDimensions]·SEDATEOFISSUE:2014.07.31-6-6.RELIABILITY6.1TESTItemandCondition6.2CriterionForJudgingAftereachreliabilitytest,samplesshouldbeduringatleast24hrsinroomtemp.&humidity,andthenmeasure.Thechangeratesshouldbeinthevaluesasbelow.ItemOKSpec.NG/OKRinUnderInitial±20%OK(Spec.Satisfying)RoutVHVoMax.±15㎷NoTESTItemTESTCondition1HIGHTEMP.STORAGETa=150℃,t=1000HR2HIGHTEMP.OPERATIONTa=120℃,Iopr=10mA,t=1000HR3LOWTEMP.OPERATIONTa=-40℃,Iopr=6mA,t=1000HR4HIGHTEMP.HIGHHUMIDITYOPERATIONTa=85℃,HR=85%,Iopr=9mA,t=1000HR5PCTTa=121℃,HR=100%,Pv=2atm,t=24HR6THERMALSHOCKT(L)=-55℃,T(H)=150℃,t=(L,H)=30min,M=30CYCLE7HIGHHUMIDITYTEMPERATURECYCLET(L)=-20℃,T(H)=85℃,t(L,H)=30min,HR=95%,M=40CYCLE8SOLDERINGHEATRESISTANCEPeakTemp=260℃,t=10sec,REFLOW9ESD(MM)V=500V,C=200pF,R=0Ω(EIAJTESTCONDITION)DATEOFISSUE:2014.07.31-7-7.CautionontreatingOnsurfacemounting,pleasekeepthestatementswrittenbymountingconditions.SafekeepingPeriodis6monthatroomtemperatureinconditionofbeingpacked8.TheAnalysisofRoHS(RestrictionofHazardousSubstances)ItisguaranteedthattherearenoRoHSmaterialsinHallSensorbyspecificanalysisresults-References:RoHs6Materials1)Cadmium(Cd)　2)Lead(Pb)3)Mercury(Hg)　4)HexavalentChromium(CrⅥ)　5)PBBs(PolybrominatedBiphenyls)　6)PBDEs(PolybrominatedDiphenylEthers)9.HalogenFreeNANOSHallsensorguaranteesthatitcontainsnoHalogenatedmaterials.ThatisHalogenFree-productandisconfirmedbyspecificanalysisresults.-References:Halogenmaterials1)Fluorine(F)2)Chlorine(Cl)3)Bromine(Br)4)Iodine(I)