pcb英文厂用缩写与术语

電路板(PCB)企業常用英文縮寫&專業術語教育訓練教材僅供內部使用嚴禁翻印PCB字典一.企業常用縮寫部分FCST:預估(Forecast)PO/SO:訂單(PurchaseOrder/SalesOrder)BP:營運計劃(BusinessPlan)MRP:物料需求規劃(MaterialRequirementPlanning)PR:採購申請PurchaseRequestBOM:物料清單(BillOfMaterial)IQC:進料品質管制(IncomingQualityControl)IPQC:製程品質管制(In-ProcessQualityControl)FQC:成品品質管制(FinishorFinalQualityControl)OQC:出貨品質管制(Out-goingQualityControl)QA:品質保證(QualityAssurance)QC:品質管制(QualityControl)QCC:品管圈(QualityControlCircle)QE:品質工程(QualityEngineering)SFC:現場控制(ShopFloorControl)TPM:全面生產管理TotalProductionManagementTQC:全面品質管制(TotalQualityControl)TQM:全面品質管理(TotalQualityManagement)WIP:在製品(WorkInProcess)P/N:料號(PartNumber)PNL:小型版面(Panel)S/M:防焊(SolderMask)PDM:產品資料管理系統(ProductDataManagement)ECD:預計完成日期(EstimationcompletionDate)SCH:時間/計劃表(Schedule)KLM:負責人(KeyLineManager)A/W:底片(Artwork)ISO:國際標準組織(InternationalOrganizationforStandardization)JIT:即時管理(JustInTime)PDCA:PDCA管理循環(Plan-Do-Check-Action)PE:製前(Pre-Process<FrontEnd>)ME:製工(ManufacturingEngineering)PM:生產(ProductManufacturing)PQE:品管(ProductQualityEngineer)MA:工務(MaintenanceAdministrative)SF:平方英尺(SquareFeet)G/F:客戶資料(GerberFile)PP:膠片(Prepreg)SOP:標準操作程序(StandardOperatingProcedure)5W1H:When,Where,What,Who,Why,How4M1E:Men,Materiel,Machine,Method,Environment二.專業術語部分System:系統Standard:作業標準/規範Systemin:系統化Designin:設計化Excursion:突發性異常Chronic:長期異常CurrentStatus:現況GapAnalysis:原因分析RootCause:根本原因CorrectAction:糾正措施ContainmentPlan:圍堵措施ClosurePlan:改進措施Confirm:確認Review:檢查/審核/檢討GetApprove:核准Audit:稽核CommonSense:常識Target:目標Project:專案Subject:主題Item:項目Catchup:趕上Warning:警告,預先通知Alarm:警報器Incoming:進料InternalAudit:內部稽核OutsideAudit:外部稽核Evidance:證據Update/Revise:更新,進版,修訂Function:功能,職責二.專業術語部分SecondSource:第二資源CostDown/Reduction:降低成本Survey:調查/視察Effective:有效的Checklist:查檢表Self-check:自我檢查LossRate:漏失率Rough:粗略Detail:詳述,細節Stackheight:疊板高度TechnologyRoadmap/ProcessAbility:製程能力Summary:總結,概括Comments:註釋,評論Supplier:供應商Customer:客戶Performance:成績,績效Support:支持,支援CallHelp:求救,尋求幫助Important:重要/重大Document:文件,公文HumanResources:人力資源Modify:更改,修改Agenda:議程Defect:缺點WeeklyReport:週報MonthlyReport:月報LeadFree:無鉛製程HalogenFree:無鹵素*ProcessModule說明: A.下料(CutLamination) a-1裁板(SheetsCutting) a-2原物料發料(Panel)(ShearmaterialtoSize) B.鑽孔(Drilling) b-1內鑽(InnerLayerDrilling) b-2一次孔(OuterLayerDrilling) b-3二次孔(2ndDrilling) b-4雷射鑽孔(LaserDrilling)(LaserAblation) b-5盲(埋)孔鑽孔(Blind&BuriedHoleDrilling) C.乾膜製程(PhotoProcess(D/F)) c-1前處理(Pretreatment) c-2壓膜(DryFilmLamination) c-3曝光(Exposure) c-4顯影(Developing) c-5蝕銅(Etching) c-6去膜(Stripping) c-7初檢(Touch-up) c-8化學前處理,化學研磨(ChemicalMilling) c-9選擇性浸金壓膜(SelectiveGoldDryFilmLamination)c-10顯影(Developing) c-11去膜(Stripping) D.壓合Lamination d-1黑化(BlackOxideTreatment) d-2微蝕(Microetching) DES二.專業術語部分d-3鉚釘組合(eyelet) d-4疊板(Layup)d-5壓合(Lamination) d-6後處理(PostTreatment) d-7黑氧化(BlackOxideRemoval)d-8銑靶(spotface)d-9去溢膠(resinflushremoval)E.減銅(CopperReduction) e-1薄化銅(CopperReduction) F.電鍍(HorizontalElectrolyticPlating) f-1水平電鍍(HorizontalElectro-Plating)(PanelPlating)f-2錫鉛電鍍(Tin-LeadPlating)(PatternPlating) f-3低於1mil(Lessthan1milThickness) f-4高於1mil(Morethan1milThickness) f-5砂帶研磨(BeltSanding) f-6剝錫鉛(Tin-LeadStripping) f-7微切片(Microsection) G.塞孔(PlugHole) g-1印刷(InkPrint) g-2預烤(Precure) g-3表面刷磨(Scrub) g-4後烘烤(Postcure) H.防焊(綠漆):(SolderMask) h-1C面印刷(PrintingTopSide) h-2S面印刷(PrintingBottomSide) h-3靜電噴塗(SprayCoating) h-4前處理(Pretreatment) h-5預烤(Precure) h-6曝光(Exposure) h-7顯影(Develop) h-8後烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend) h-11噴砂(Pumice)(WetBlasting) h-12印可剝離防焊(PeelableSolderMask) I.鍍金Goldplating i-1金手指鍍鎳金(GoldFinger) i-2電鍍軟金(SoftNi/AuPlating) i-3浸鎳金(ImmersionNi/Au)(ElectrolessNi/Au) J.噴錫(HotAirSolderLeveling) j-1水平噴錫(HorizontalHotAirSolderLeveling) j-2垂直噴錫(VerticalHotAirSolderLeveling) j-3超級焊錫(SuperSolder) j-4印焊錫突點(SolderBump) K.成型(Profile)(Form)k-1撈型(N/CRouting)(Milling) k-2模具沖(Punch)k-3板面清洗烘烤(Cleaning&Backing) k-4V型槽(V-Cut)(V-Scoring) k-5金手指斜邊(BevelingofG/F) L.短斷路測試(ElectricalTesting/Continuity&InsulationTesting)l-1AOI光學檢查(AOIInspection) l-2VRS目檢(Verified&Repaired) l-3汎用型治具測試(UniversalTester) l-4專用治具測試(DedicatedTester) l-5飛針測試(FlyingProbe) M.終檢(FinalVisualInspection) m-1壓板翹(WarpageRemove) m-2X-OUT印刷(X-OutMarking) m-3包裝及出貨(Packing&shipping)m-4目檢(VisualInspection) m-5清洗及烘烤(FinalClean&Baking)m-6護銅劑(ENTEKCu-106A)(OSP) m-7離子殘餘量測試(IonicContaminationTest/CleanlinessTest)m-8冷熱衝擊試驗(ThermalcyclingTesting)m-9焊錫性試驗(SolderabilityTesting) N.雷射鑽孔(LaserDrilling) n-1雷射鑽Tooling孔(LaserablationToolingHole)n-2雷射曝光對位孔(LaserAblationRegistrationHole)n-3雷射Mask製作(LaserMask)n-4雷射鑽孔(LaserAblation) n-5AOI檢查及VRS(AOIInspection&Verified&Repaired)n-6BlaserAOI(afterDesmearandMicroetching) n-7除膠渣(Desmear) n-8微蝕(Microetching) A/W(artwork) 底片Ablation燒溶(laser),切除abrade 粗化abrasionresistance 耐磨性absorption 吸收acceleratedcorrosiontest 加速腐蝕acceleratedtest 加速試驗acceleration 速化反應accelerator 加速劑 acceptable 允收activator 活化液 activeworkinprocess 實際在製品 adhesion 附著力 adhesivemethod 黏著法 airinclusion 氣泡airknife 風刀amorphouschange 不定形的改變amount 總量amylnitrite 硝基戊烷analyzer 分析儀anneal 回火annularring 環狀墊圈;孔環anodeslime(sludge) 陽極泥 anodizing 陽極處理AOI(automaticopticalinspection) 自動光學檢測applicabledocuments 引用之文件AQLsampling 允收水準抽樣aqueousphotoresist 液態光阻aspectratio 縱橫比(厚寬比)Asreceived 到貨時backlighting背光back-up 墊板 bankedworkinprocess預留在製品basematerial 基材baselineperformance 基準績效batch批 betabackscattering貝他射線照射法beveling 切斜邊;斜邊biaxialdeformation 二方向之變形black-oxide黑化blankcontroller 空白對照組blankpanel空板blanking 挖空blip 彈開blister 氣泡;起泡blistering氣泡blowhole 吹孔 board-thicknesserror 板厚錯誤bondingplies 黏結層bow;bowing 板彎breakout 從平環內破出bridging 搭橋;橋接BTO(BuildToOrder) 接單生產burning 燒焦burr 毛邊(毛頭)camcorder一體型攝錄放機 carbide 碳化物carlsonpin 定位梢carrier載運劑catalyzing 催化catholicsputtering 陰極濺射法caulplate 隔板;鋼板calibrationsystemrequirements校驗系統之各種要求centerbeammethod 中心光束法centralprojection 集中式投射線certification 認證chamfer 倒角(金手指)chamfering 切斜邊;倒角characteristicimpedance 特性阻抗chargetransferoverpotential電量傳遞過電壓chase 網框checkboard 棋盤chelator 蟹和劑chemicalbond 化學鍵chemicalvapordeposition 化學蒸著鍍circumferentialvoid 圓周性之孔破cladmetal 包夾金屬cleanroom 無塵室clearance間隙coat鍍外表coatingerror 防焊覆蓋錯coefficientofthermalexpansion(CTE)熱澎脹系數coldsolderjoint 冷焊點cold-weld 金屬粉末冷焊color 顏色colorerror 顏色錯誤compensation 補償competitiveperformance 競爭力績效complexsalt 錯化物complexor 錯化物componenthole 零件孔componentside 零件面concentric 同心conformance 密貼性consumerproducts 消費性產品contactresistance 接觸電阻continuousperformance 連續發揮效能contractservice 協力廠controlledsplit均裂式conventionalflow 亂流方式conventionaltensiletest 傳統張力測試法conversioncoating 轉化層convex 突出 coordinatelist 資料清單coppercladedlaminates(CCL)銅箔基板copperexposure 線路露銅coppermirror 鏡銅copperpad銅箔圓配copperresidue(coppersplash)銅渣corrosionratenumbering 腐蝕速率計數系統corrosionresistance 抗蝕性coulombslaw 庫倫定律countersink喇叭孔coupon 試樣couponlocation 試樣點coveringpower 遮蓋力CPU 中央處理器crack 破裂;裂痕crazing 裂痕;白斑crosslinking 交聯聚 crosstalk 呼應作用crosslinking 交聯 crystalcollection結晶收集curing 聚合體currentefficiency電流效率 cut-outs 挖空cutting 裁板cyanide 氰化物cyclesoflearning 學習循環cycle-timereduction 交期縮短datecode 週期deburring 去毛頭dedicated 專用型degradation 退變delamination 分層dent/pinhole 凹陷/針孔departmentofdefense國防部designation 字碼簡示法de-smear除膠渣developing 顯影dewetting 縮錫dewettingtime 縮錫時間dimensionerror外形尺寸錯誤dielectricconstant 介質常數difficulty 困難度difunctional雙功能dimension 尺寸dimensionstability 尺寸安定性dimensionalstability 尺度安定性dimensionandtolerance 尺寸與公差dirtyhole 孔內異物discolorhole 孔黑;孔灰;氧化discoloration 變色disposableeyeletmethod 消耗性鉚釘法distortionfactor 尺寸變形函數 doubleside 雙面板downtime 停機時間drill 鑽孔drillbit 鑽頭drillfacet 鑽尖切萷面drillpointer 鑽尖重(研)磨機 drilledblankboard 已鑽孔之裸板drilling 鑽孔dryfilm 乾膜ductility 延展性economyofscale 經濟規模 edgespacing 板邊空地 edge-boardcontact(goldfinger)金手指 efficiency 能量效率electrictest電測electricaltesting 電測;測試electrochemicalmachineECM電化學加工法electrochemicalreactor 電化學反應器electroforming 電鑄electrolessplate 化學銅 electroless-deposition 無電鍍electropolishing 電解拋光electrorefining 電解精鍊electrowinning 電解萃取ellipticalset 橢圓形embrittlement 脆性 entitlementperformance 可達成績效entrapment 電鍍夾雜物epoxy 環氧樹酯equipotential 電位線 errordatafile 異常情形 etchrate 蝕銅速率 etchants 蝕刻液 etchback 回蝕 evaluationprogram 評估用程式 exposure 曝光 externalpinmethod 外部插梢法 eyelethole 鉚釘孔 Eyeletting 鉚眼 fabric網布 failure故障fastresponse 快速回應fault 瑕庛;缺陷fiberexposure 纖維顯露 fiberprotrusion 纖維突出 fiducialmark 光學點,基準記號 filler 填充料film 底片filtration 過濾 finishedboard成品 fixing 固著fixture 電測夾具(治具)flakingoff 粹離flammabilityrating燃性等級flare 喇叭形孔flatcable 併排電纜feedbackloop 回饋循環first-in-first-out(FIFO)先進先出flexiblemanufacturingsystem(FMS)彈性製造系統flux 助焊劑foildistortion 銅層變形fold 空泡foreigninclude 異物foreignmaterial 基材內異物freeradicalchainpolymerization自由基連鎖聚合fullyadditive 加成法fullyannealedtype 徹底回火軔化之類形function 函數fundamentalandbasic 基本fungusresistance 抗黴性funnelflange 喇叭形摺翼 galvanized 加法尼化製程 gap 鑽尖分開 gaugelength 有效長度geltime 膠化時間generalresistink 一般阻劑油墨general 通論generalindustrial 一般性(電子)工業級geometricallevelling幾何平整glasstransitiontemperature(Tg)玻璃態轉換溫度goldfinger 金手指goldplating 鍍金goldenboard 標準板gouges 刷磨凹溝gouging 挖破grainboundary 金屬晶體之四邊green 綠色grip 夾頭groundplane 接地層groundplaneclearance 接地空環hackers 駭客HAL(hotairleveling) 噴錫 haloing 白邊;白圈hardener 硬化劑hardness 硬度hepafilter 空氣濾清器highperformanceindustrial高性能(電子)工業級highreliability 高可靠度highresolution 高解析度hightemperatureelongation(HTE)高溫延展性銅箔hightemperatureepoxy(HTE)高溫樹酯hit 擊holecounter 數孔機holediameter 孔徑holediametererror 孔徑錯誤holelocation 孔位holenumber 孔數holewallquality 孔壁品質hook 外弧hotdip 熱浸法hullcell 哈氏槽hybrid 混成積體電路hydrogenbonding 氫鍵hydrolysis 水解hydrometallurgy 濕法冶金法 imageanalysissystem 影像分析系統imagetransfer 影像轉移immersiongold 浸金(化鎳金)immersionplating 浸鍍法impedance 阻抗infraredreflow 紅外線重熔 inhibitor 熱聚合抑制劑injectionmold 射模ink 油墨innerlayer&outlayer 內外層insulationresistance 絕緣電阻intendedposition 應該在的位置intensifier 增強器intensity 強度intermolecularexchange 交互改變interconnection 互相連通ioniccontaminants 離子性污染物ioniccontaminationtesting離子污染試驗IPA 異丙醇5I:inspiration (啟蒙)identification 確認計劃目標implementation改善information 數據internalization 制度化invisibleinventory 無形的庫存 knifeedges 刀緣Knoop 努普(硬度單位)kraftpaper牛皮紙laminarflow 層流laminate 基層板lamination 壓合laminator 壓膜機land 焊墊layback 刃角磨損layup 組合疊板layout 佈線;佈局leadscrew 牽引螺絲leakage 漏電learningcurve 學習曲線legend 文字標記leveling 平整levellingadditive 平整劑levellingpower 平整力lifesupport 維繫生命limitingcurrent 極限電流linespace 線距linewidth 線寬linearvariabledifferentialtransformer(LVDL)線性可變差動轉換器liquid 液狀(態)liquidcrystalresins 液晶樹脂liquidphotoimageablesolderresistink液態感光防焊油墨liquidphotoresistink 液態光阻劑油墨lotsize 批量lowercarrier 底部承載板mechanicalplating 機祴鍍法machinescrub 刷磨清潔法macrothrowingpower 巨分佈力margin 鑽頭刃帶marketshare 市場佔有率markingerror 文字錯誤maskedleveling 儰裝平整masslamination 大型壓板masstransfer質量傳送效應masstransferoverpotential質量傳遞過電壓masstransportation 質傳masterdrawing 主圖;藍圖materialusefactor 材料使用率mealing 泡點;白點memory 記憶裝置meniscographsolderabilitymeasurement新月型焊錫效果microetch 微蝕microfocus 微焦距microfocussystem 微焦距系統microprofile 微表面microsectioning 微切片法microthrowingpower 微分佈力migration 遷移mini-tensiletester 迷你拉力測試儀misholelocation 孔位錯誤misregistration 焊錫面與零件面對位偏差misregsitration 對不準moistureandinsulationresistancetest濕氣與絕緣電阻試驗moldedcircuitboard(MCB) 模製電路板monoethanalamine 單乙醇氨monohydratestate 水化物monomer 單分子膜;單體mousebite 鋸齒;蝕刻缺口msec 毫秒mufflefurnace 高溫焚火爐multichip 超大IC型(多晶片模組)mylar 保護膜nailhead 釘頭NCdrill 數位鑽孔機negativeetchback 反回蝕negativefilm 負片negativerakeangle 負摳耙角network 迴路;網路neutralization 中和nick 缺口nickel 鎳nodule 銅瘤;瘤粒noflowresin 不流樹脂noise 雜訊nominal標示nominaldimension標定長度nominalgeltime 標示膠性時間nominalresincontent 標示膠含量nominalresinflow 標示膠流量nominalscaledflowthickness 標示比例流量厚度OAequip 辦公室自動化設備obsolescencefactor 報廢因素OEM 原設備製造商offset-list 補償數據清單ohmmeter歐姆計open 斷路opencircuits斷路openshorttesting斷短路測試opening 開口 originalartwork(A/W) 原稿底片Others 其它outgrowth 增出overdesign 牛刀殺雞overlap鑽尖重疊overlayentry 蓋板overpotential 過電壓oxidation氧化oxidetreatment 黑化處理 oxidedcytochrome氧化性之細包色素 oxygenevolution 氧氣發生反應packedbed 充填床式pad 錫墊;圓配padcopperexposure pad露銅 panel 小型板面;母板 panelplating一次銅電鍍 parasitic 寄生的 partno. 料號 patternplating 二次銅電鍍 PCB(printcircuitboard) 印刷電路板 pcs 片 peelstrength 抗撕強度 peelingoff 剝離(剝落) performancespecification 性能規範 permittivity 透電率perspectivesonexperience經驗透視 PET 聚酯 photodiodedetector 發光二極體偵測器 photoinitiator 感光啟始劑 photoresist 光阻 phototool 光具(指工作底片) piece 子板面 pincetonappliedresearch 腐蝕測定儀 pinkring 粉紅圈 pit 凹點 pitch 腳距 planar 平面 plating 電鍍 platingexposure 下鍍層露出 pluggauge 插規 plughole 孔塞 PNL(panel) 排板 polar-polarinteraction 極性之間的吸力 polyester 聚酯類polyglycols 聚乙二醇polyimide 聚亞醯氨poorbevelling 磨邊加工引起突起,剝離poordrill 孔形不良poorHAL 噴錫不良poormarking 字體不良poorpad 錫墊不良poorprinted 印刷偏差poorsolderability 焊錫性不良poortouch-up 補線不良positioncontrolsystem 位置控制系統positiverakeangle 正摳耙角 powercurvemodel 幕次曲線模式practice 工藝慣例preferred 良好prematuretearing 提前撕裂prepolymer 預聚合物prepreg 膠片pre-process(front-end) 製前 press 壓床 presscycle 壓合週期 primarycurrentdistribution一次電流分佈primary主要 productlifetimes 生命週期 productprocess 製程 promoter 促進劑 protocal 初步資料 prussicacid 普魯士酸 PTF-basedprocess 厚膜糊法PTH(platingthoughhole) 導通孔 pullaway 拉開 pumice 浮石粉 pumicescrub 噴砂清潔法 pyrometallurgy 火燒法冶鍊 QC(qualitycontrol) 品管 QFP(quadflatpack) 扁方型封裝體 qualificationinspection 資格審查檢驗 qualificationtesting 資格檢定 qualityclassification 品質等級 quantitative 計量式測試 rack 掛架 radiometer 能量劑 rakeangle 摳耙角 RAM[RandomAccessMemory隨機存取記憶體realtime 關鍵時刻 recessedtraceprocess 凹槽線路法 recoverytank 回收槽 reduction 還原 re-eninforcement 強化 refraction 折光率 reinforcementstyle 補強材料的型式 registermark 對位用標記 registrationhole 對位孔 registrationpattern 長方形銅地 REJ(reject) 退貨;拒收 rejectable 拒收 releaseagent 脫模劑 reliefangle 浮離角 remark 備註 repair 修理 resincontent 樹脂含量(膠含量)resinflow 膠流量resinflowpercentage 樹脂流量之百分率resinrecession 樹脂下陷 resinsmear 膠渣resiststrippers 剝乾膜劑resistornetwork 排列電阻resolution 解像度returnonassets 資產報酬率reversibility 可逆性rework 重工rosin 天然松香 rotatingcylinder 旋轉圓柱形 roughtness 孔壁粗糙;粗慥 routing 切外形,成型 routingbit 銑刀runout偏轉S/Lonhole 孔內沾文字S/M(soldermask),S/L 防焊文字S/M(soldermask) 防焊S/Merror 防焊種類錯誤S/Monhole 孔內綠漆 saltspraytest鹽水噴霧試驗samplingsize抽樣數scope 範圍 scored 刻痕scoring 樞槽;刮線 scrap廢框scratches 刮傷screenprinting 網版印刷scum 透明殘膜sealing 封孔處理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator鋼隔板sequentiallamination 漸成式壓法serratededges 毛邊shatter破碎short 短路shunt 分路silanetreatment 矽烷處理siliconecouplingagent 矽烷偶合劑silkscreen 文字印刷simulator 模擬器singleaxis 單軸sizing 底片之伸縮補償skip 漏印skipprinting 跳印;漏印sliver 絲條slot 開槽slotting 開槽SMD(surfacemountdevice)表面黏著元件smear膠渣SMT(surfacemounttechnology)表面黏著技術sodiumcarbonatemonohydrate結晶水碳酸鈉softtooling 軟性工具solder 焊錫;錫鉛solderbridge 錫橋solderbump錫突solderfloat 漂錫soldermaskadhesion 綠漆附著力solderonG/F 金手指沾錫solderontrace 線路沾錫solderplug 錫塞solderside 焊錫面solderability 焊錫性solidcarbide 實質碳化物spacing 間距spacingnonenough 間距不足SPC(StatisticalProcessControl) 統計生管 specification 規範specialconsiderations 特別考慮 spincoating 旋轉塗佈spindle 鑽軸spiralcontractometer 螺旋收縮儀spotface 銑靶spraycoating 噴塗Squeegee 刮刀stackingstructure 疊板結構stamping 沖壓standardhydrauliclamination 標準液壓法 standardizing 標準化starvation 缺膠steptablet 格片數stockoption 認股選擇權strain 應度strength 強度stressmeter 應力計subtractive 減除法surfaceconvex 表面突起surfaceexamination 表面檢查surfaceinsulationresistance(SIR) 表面絕緣電阻surfacemount表面黏著方式surfaceroughness 表面粗慥度surges 突波switchcircuit 開關線路tab 金手指tackfree 不黏tapedholegauge 錐形孔規targethole 靶孔taskforce任務編組tensilestrength 抗拉強度 tensilestress張性應力tent浮蓋termsanddefinitions 術語與定義terminationload 抗匹配負載testcircuit 測試線路testmethod 試驗方法testpoint 測試點thermalshock 熱震盪試驗thermalstress 熱應力試驗thermistor 熱電感應式thermocycling 熱循環試驗theoreticalcycletime 理論性週期時間thickness 厚度 timetomarket上市時機 thicknessdistribution 厚度分佈 thief 補助陰極 thincore 薄基板;內層板 throwingpower 分佈力 tolerance 公差;容差 toolinghole 工具孔 torqueload 扭力拒之負載totalqualityprogram 全面的品質計劃toughness 堅度traceerror 線路錯誤 tracenick&pinhole 線路缺口及針孔tracepeeling線路剝離tracepin-hole 線路針孔tracesurfaceroughness 線路表面粗糙tarnishandoxideresist 抗污抗氧化劑transmittance 透光度trimline 裁切線truelevelling 真平整trueposition 真正位置的孔;真位twist 板翹type 種類umbra 本影undercut 側蝕unevencoating 噴錫厚鍍不平整universal 萬用型universaltensiletester 萬用拉力試驗機universaltester 汎用型測試機uppercarrier 頂部承載鋼uptime 稼動時間vacuumdeposition 真空蒸鍍法vacuumhydrauliclamination 真空液壓法vaporizer 氣化室V-cut V形槽verticalmicrosection 垂直微切片viahole 導通孔visibleinventory 有形的庫存 visioninspection 目視檢查 Void 孔破 voidinhole 孔壁上的破洞voidinPTHhole 孔破walkman隨身聽warehouse 倉庫warp,warpage 板彎waterabsorption 吸水性wearresistance 耐磨度weaveexposure 纖紋顯露weavetexture 織紋隱現wedgeangle 契尖角week 週wetchemistry 濕式化學製程wetfilm 濕膜wetlamination濕膜壓膜法wetprocess 濕製程wetting 沾錫wettingbalance 沾錫平衡法wicking 滲銅;滲入;燈蕊效應width 寬度widthreduce 線細width-to-thicknessratio 寬度與厚度的比值window 操作範圍work-in-process 在製品workorder/runcard工單workingfilm 工作片workingmaster 工作母片yellow 金黃色yield 良率