SMTManufactureprocess（英文版）

SMTManufactureprocessWritebyMOEBG/SMTManufactureEngineer–YxlanTEL:3417DSC-MainboardMaincomponent--BGAchipsetDSC-FPCboardOpticalcomponent--CCDSMTIntroductionAutomaticSMTline:71linesLocation:Cbuild-Floor2~42Dbuild-Floor3,42Ebuild-Floor2,3,4Linechange：30minsProductionEfficiency：99.5%Throughrate:88%DefectPPM:50PPMLostrate:0.4%PCBAaverageoutput:400K/monthControlbyKPISMTprocessPCBAFlowChartS.M.T:SurfaceMountTechnologyWhatisSMT:GoodPrint,andMountGood!!DIPSONYSIP-950SONYSIP-300SONYSVP-2000SMTEquipment–Printer(SONY)Solderpastevendor(Lead-freetype)StencildesignruleSMT-Mounter(SONY)SMT實裝設備中高速機(SONY)SMT實裝設備汎用機(SONY)SMT-Mounter(SONY)MounterfunctionX-YDATA  CAM350editGerberfileCombinationX-YDataandGerberfilebyCPSNozzleArticle：Lead-FreeN2ReflowType：NIS-311TR/NIS-2082C/N30-122-RLFCharacteristic：1.TheconsistencyofN2islow-reduce，UsingN2byPSAtocontroloutputandcost2.PPMcontrolsystemtocontroltheconsistencyofO2in500PPM3.UniformheatconvectionmakeBGAandCSPheatcompletely.4.Moreheatingzonecouldofferbettertemperatureprofile(8zonesand12zones)SMT-Reflow(ETC)Method-Reflowprofile(example:Leadfree)25~150℃150~217℃Over217℃Over230℃below217℃Rampup:6℃/sec(max)Rampdown:6℃/sec(max)25℃150℃217℃230℃Pre-heatSoakingReflowCoolingPeaktemp=235~255℃TempTimeSMTprofile–Pre-heatzoneThisheatingzonecausetheuniform-temperatureinallpartofPCBA,thatcanreducePCBwarped,andavoidsolder-pasteheatingdisproportionallytocausesplashdowntogetanotherfailurePre-heatzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–25(roomtemp)~150℃:SMTprofile–SoakingzoneSolder-pasteincludesolderalloyandFlux.Commonly,FluxcontentincludeRosin,Activation,Solvent,andRchologicaladdition.Flux-heatingcancausethecontentofFluxdeoxidizesoldertoraisethesolderingofthejoint.Soakingzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecificationLead-free–150℃~220℃:SMTprofile–ReflowzoneIntheReflowzone,solder-jointcomesintobeingInterface-alloy,thatbecausemostofmetalbecomesbeingmelting.Peaktemperatureisinthiszone,thatisthehighesttemperatureintheprofile.Generally,inthiszone(230℃topeaktemp)meanssolderalloyisinthemeltingstatesanddifferentmetalsarebecominginterface-alloy.Sometimes,wecanraisetheofthiszonetoreducevoidoccurratio.Reflowzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–Over220℃Peaktemp:235~255℃InIPC610-D,solder-jointmusttobebright,shineandsmooth.Wheninterface-alloycoagulated,therampdownratio(coolingrate)ismorefast,thatcausealloyatomicbondbecomesmoretightly,thatcausesoldersurfaceismoreshineandsmooth.Coolingzonetemperaturesetting:(generallysetting,actuallyconstantfollowvendor’sdataspecification)Lead-free–Rampdownratio:≦6℃/secSMTprofile–CoolingzoneProfilelimitSolder-PasteMpt:217~220℃Reflowpeaktemp:235~255℃Reflowzone(over220℃):60~90secTemperatureprofileboardSixmeasurepoint(foractualPCBstates)Temppoint:criticalpartsExp:BGA,IC,SDConnectorConnectthethermalcoupletomeasureprofileProfilemeasurement(forDataPAQ)ReflowprofileAutomaticOpticInspection(AOI)Sampleimageinspectimage1.Adopt2DAOIinspecttechnique；2.InspectionItem：Missingparts/Polarity/Reverse/missingsolder/Bridge/Shift/etc;3.Inspecttheminimumpart：Angularchips0201；AutomaticInspectionCCCsystemFunction：ByRegionalnetwork,controlproductionlineandfeedbacktheNGphenomenonfromAOImachineinfactoryatonce.REPAIRsystemFunction：1.RecordtheNGdataforAOI.2.MarktheNGlocation.3.UsingthestatisticdatatocalculatetheNGratebySPC.AOI-CCC/RepairsystemApprovedocument-IPC-610DThanks!anyquestions?