PCB工艺术语

PCB工艺术语A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料发料(Panel)(ShearmaterialtoSize)B.钻孔(Drilling)b-1内钻(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射钻孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)C.乾膜制程(PhotoProcess(D/F))c-1前处理(Pretreatment)c-2压膜(DryFilmLamination)c-3曝光(Exposure)c-4显影(Developing)c-5蚀铜(Etching)c-6去膜(Stripping)c-7初检(Touch-up)c-8化学前处理,化学研磨(ChemicalMilling)c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)c-10显影(Developing)c-11去膜(Stripping)D.压合Laminationd-1黑化(BlackOxideTreatment)d-2微蚀(Microetching)d-3铆钉组合(eyelet)d-4叠板(Layup)d-5压合(Lamination)d-6后处理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)e-1薄化铜(CopperReduction)F.电镀(HorizontalElectrolyticPlating)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)f-3低於1mil(Lessthan1milThickness)f-4高於1mil(Morethan1milThickness)f-5砂带研磨(BeltSanding)f-6剥锡铅(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2预烤(Precure)g-3面刷磨(Scrub)g-4后烘烤(Postcure)H.防焊(绿漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3静电喷涂(SprayCoating)h-4前处理(Pretreatment)h-5预烤(Precure)h-6曝光(Exposure)h-7显影(Develop)h-8后烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11喷砂(Pumice)(WetBlasting)h-12印可剥离防焊(PeelableSolderMask)I.镀金Goldplatingi-1金手指镀镍金(GoldFinger)i-2电镀软金(SoftNi/AuPlating)i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)J.喷锡(HotAirSolderLeveling)j-1水平喷锡(HorizontalHotAirSolderLeveling)j-2垂直喷锡(VerticalHotAirSolderLeveling)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.短断路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸取(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(试验).Acceleration速化反应.Accelerator加速剂,速化剂.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy准确度.AcidNumber(AcidValue)酸值.AcousticMicroscope(AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化剂.ActiveCarbon活性炭.ActiveParts(Devices)主动零件.Acutance解像锐利度.AdditionAgent添加剂.AdditiveProcess加成法.Adhesion附着力.AdhesionPromotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.AirInclusion气泡夹杂.AirKnife风刀.Algorithm算法.AliphaticSolvent脂肪族溶剂.AluminiumNitride(AlN)氮化铝.AmbientTamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.AnalogCircuit/AnalogSignal模拟电路/模拟讯号.AnchoringSpurs着力爪.Angleof Contack接触角.AngleofAttack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal韧化(退火).AnnularRing孔环.Anode阳极.AnodeSludge阳极泥.Anodizing阳极化.ANSI美国协会.Anti-FoamingAgent消泡剂.Anti-pitAgent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(AcceptableQualityLevel)允收品质水准.AramidFiber聚醯胺纤维.ArcResistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.AspectRatio纵横比.Assembly组装装配.A-stageA时期.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.                      *****B*****BackLight(BackLighting)背光法.BackTaper反锥斜角.Backpanels,Backplanes支撑板.Back-up垫板.BalancedTransmissionLines平稳式传输线.BallGridArray球脚数组(封装).Bandability弯曲性.BankingAgent护岸剂.BareChipAssembly裸体芯片组装.Barrel孔壁,滚镀.BaseMaterial基材.BasicGrid差不多方格.Batch批.Baume波美度(凡液体比重比水重那么 Be=145-(145÷Sp.Gr)凡液体比重比水轻那么 Be=140÷(Sp.Gr-130)*Sp.Gr为比重即同体绩物质对"纯水"1g/cm的比值).Beamlead光芒式的平行密集引脚.Bed-of-NailTesting针床测试.BellowsConact弹片式接触.BetaRayBackscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-LevelStencil]双阶式钢板.Binder粘结剂.Bits头(DrillBits).BlackOxide黑氧化层.Blanking冲空断开.Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分层或起泡.BlockDiagram电路系统块图.Blockout封纲.Blotting干印.BlottingPaper吸水纸.BlowHole吹孔.BluePlaque蓝纹(锡面钝化层).BlurEdge(Circle)模糊边带(圈).BombSight弹标.BondStrength结合强度.Bondability结合性.BondingLayer结合层接着层.BondingSheet(Layer)接合片.BondingWire结合线.Bow,Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425℃~870℃下进行熔接的方式).BreakPoint显像点.Break-awayPanel可断开板.BreakdownVoltage崩溃电压.Break-out破出.Bridging搭桥.BrightDip光泽浸渍处理.Brightener光泽剂.BrownOxide棕氧化.BrushPlating刷镀.B-stageB时期.BuildUpProcess增层法制程.Build-up堆积.Bulge鼓起.Bump突块.BumpingProcess凸块制程.Buoyancy浮力.BuriedViaHole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.BusBar汇电杆.ButterCoat外表树脂层.                       *****C*****C4ChipJointC4芯片焊接.Cable电缆.CAD运算机辅助设计.CalenderedFabric轧平式纲布.CapLamination帽式压合法.Capacitance电容.CapacitiveCoupling电容耦合.CapillaryAction毛细作用.Carbide碳化物.CarbonArcLamp碳弧灯.CarbonTreatment,Active活化炭处理.Card卡板.CardCages/CardRacks电路板构装箱.CarlsonPin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.CatalyzedBoard,CatalyzedSubstrate催化板材.Catalyzing催化.Cathode阴极.Cation阴向离子,阳离子.CaulPlate隔板.Cavitation空泡化 半真空.Center-to-CenterSpacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.CharacteristicImpedance特性阻抗.Chase纲框.CheckList检查清单.Chelate螯合.ChemicalMilling化学研磨.ChemicalResistance抗化性.Chemisorption化学吸附.Chip芯片(粒).ChipInterconnection芯片互连.ChiponBoard芯片粘着板.ChipOnGlass晶玻接装(COG).Chisel钻针的尖部.ChlorinatedSolvent含氯溶剂,氯化溶剂.CircumferentialSeparation环状断孔.Clad/Cladding披覆.CleanRoom无尘室.Cleanliness清洁度.Clearance余地,余环.ClinchedLeadTerminal紧箝式引脚.Clinched-wireThroughConnection通孔弯线连接法.ClipTerminal绕线端接.Coat,Coating皮膜表层.CoaxialCable同轴缆线.CoefficientofThermalExpansion热膨胀系数.Co-Firing共绕.ColdFlow冷流.ColdSolderJoint冷焊点.CollimatedLight平行光.Colloid胶体.ColumnarStructure柱状组织.CombPattern梳型电路.ComplexIon错离子.ComponentHole零件孔.ComponentOrientation零件方向.ComponentSide组件面.Composites,(CEM-1,CEM-3)复合板材.CondensationSoldering凝热焊接,液化放热焊接.Conditioning整孔.Conductance导电.ConductiveSalt导电盐.Conductivity导电度.ConductorSpacing导体间距.ConformalCoating贴护层.Conformity吻合性,服贴性.Connector连接器.ContactAngle接触角.ContactArea接触区.ContactResistance接触电阻.Continuity连通性.ContractService协力厂,分包厂.ControlledDepthDrilling定深钻孔.ConversionCoating转化皮膜.Coplanarity共面性.Copolymer共聚物.CopperFoil铜皮.CopperMirrorTest铜镜试验.CopperPaste铜膏.Copper-Invar-Copper(CIC)综合夹心板.CoreMaterial内层板材,核材.CornerCrack通孔断角.CornerMark板角标记.Counterboring方型扩孔.Countersinking锥型扩孔.CouplingAgent偶合剂.Coupon,TestCoupon板边试样.Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.CrossectionArea截面积.CrosshatchTesting十字割痕试验.Crosshatching十字交叉区.Crosslinking,Crosslinkage交联,架桥.Crossover越交,搭交.Crosstalk噪声,串讯.CrystallineMeltingPoint晶体熔点.C-StageC时期.Cure硬化,熟化.CurrentDensity电流密度.Current-CarryingCapability载流能力.CurtainCoating濂涂法.                       *****D*****DaisyChainedDesign菊瓣设计.DatumReference基准参考.DaughterBoard子板.Debris碎屑,残材.Deburring去毛头.DeclinationAngle斜射角.Definition边缘逼真度.Degradation劣化.Degrasing脱脂.DeionizedWater去离子水.Delamination分离.DendriticGrowth枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)).Densitomer透光度计.Dent凹陷.Deposition皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像.Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.DiazeFilm偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die冲模.DieAttach晶粒安装.DieBonding晶粒接着.DieStamping冲压.Dielectric介质.DielectricBreakdownVoltage介质崩溃电压.DielectricConstant介质常数.DielectricStrength介质强度.DifferentialScanningCalorimetry(DSC)微差扫瞄热卡分析法.DiffusionLayer扩散层.Digitizing数字化.DihedralAngle双反斜角.DimensionalStability尺度安定性.Diode二极管.DipCoating浸涂法.DipSoldering浸焊法.DIP(DualInlinePackage)双排脚封装体.Dipole偶极,双极.Direct/IndirectStencil直截了当/间接版膜.DirectEmulsion直截了当乳胶.DirectPlating直截了当电镀.DiscreteCompenent散装零件.DiscreteWiringBoard散线电路板,复线板.DishDown碟型下陷.Dispersant分散剂.DissipationFactor散失因素.DisspationFactor散逸因子.DisturbedJoint受扰焊点.DoctorBlade修平刀,刮平刀.DogEar狗耳.Doping掺杂.DoubleLayer双电层.DoubleTreatedFoil双面处理铜箔.DragIn/DragOut带[进/带出.DragSoldering拖焊.Drawbridging吊桥效应.Drift漂移.DrillFacet钻尖切削面.DrillPointer钻针重磨机.DrilledBlank已钻孔的裸板.Dross浮渣.DrumSide铜箔光面.DryFilm干膜.DualWaveSoldering双波焊接.Ductility展性.DummyLand假焊垫.Dummy,Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.DynamicFlex(FPC)动态软板.                       *****E*****E-Beam(ElectronBeam)电子束.EddyCurrent涡电流.EdgeSpacing板边空地.Edge-BoardConnector板边(金手指)承接器.Edge-BoardContact板边金手指.Edge-DipSolderabilityTest板边焊锡性测试.EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.ElectricStrength(耐)电性强度.Electrodeposition电镀.Electro-depositionPhotoresist电着光阻,电泳光阻.Electroforming电铸.Electroless-Deposition无电镀.ElectrolyticToughPitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动,电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation延伸性,延伸率.Embossing凸出性压花.EMF(ElectromotiveForce)电动势.EMI(ElectromagneticInterference)电磁干扰.Emulsion乳化.EmulsionSide药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.EndTap封头.Entek有机护铜处理.Entrapment夹杂物.EntryMaterial盖板.EpoxyResin环氧树脂.EtchFactor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.EtchingIndicator蚀刻指针.EtchingResist蚀刻阻剂.EuteticComposition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.                       *****F*****Fabric纲布.FaceBonding反面朝下结合.Failure故障.FanOutWiring/FanInWiring扇出布线/扇入布线.Farad法拉.Farady法拉第.FatigueStrength抗疲劳强度.Fault缺陷.FaultPlane断层面.FeedThroughHole导通孔.Feeder进料器.FiberExposure玻纤显露.FiducialMark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.FilmAdhesive接着膜,粘合膜.Filter过滤器.FineLine细线.FinePitch密脚距,密线距,密垫距.Fineness粒度,纯度.Finger手指.Finishing终修(饰).FiniteElementMethod有限要素分析法.FirstArticle首产品.FirstPass-Yield初检良品率.Fixture夹具.Flair刃角变形.FlamePoint自燃点.FlameResistant耐燃性.FlammabilityRate燃性等级.Flare扇形崩口.FlashPlating闪镀.Flashover闪络.FlatCable扁平排线.FlatPack扁平封装(之零件).Flatness平坦度.FlexiblePrintedCircuit(FPC)软板.FlexuralFailure挠曲损坏.FlexuralModule弯曲模数,抗挠性模数.FlexuralStrength抗挠强度.FlipChip覆晶,扣晶.Flocculation絮凝.FloodStrokePrint覆墨冲程印刷.FlowSoldering(WaveSoldering)流焊.Fluorescence荧光.FlurocarbonResin碳氟树脂.FlushConductor嵌入式线路 ,贴平式导体.FlushPoint闪火点.Flute退屑槽.Flux助焊剂.FoilBurr铜箔毛边.FoilLamination铜箔压板法.Foot残足(干膜残余物).FootPrint(LandPattern)脚垫.ForeignMaterial外来物,异物.Form-to-List布线说明清单.FourPointTwisting四点扭曲法.FreeRadical自由基.Freeboard干舷.Frequency频率.Frit玻璃熔料.Fully-AdditiveProcess全加成法.FungusResistance抗霉性.FusedCoating熔锡层.Fusing熔合.FusingFluid助熔液.                       *****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage,Gauge量规.GalliumArsenide(GaAs)砷化镓.GalvanicCorrosion贾凡尼式腐蚀(电解式腐蚀).GalvanicSeries贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.GateArray闸列,闸极数组.GelTime胶化时刻.GelationParticle胶凝点.GerberData,GerberFile格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所进展一系列完整的软件档案).GhostImage阴影.Gilding镀金(现为:GlodPlating).GlassFiber玻纤.GlassFiberProtrusion/Gouging,Groove玻纤突出/挖破.GlassTransitionTemperature,Tg玻璃态转化温度.Glaze釉面,釉料.GlobTop圆顶封装体.GloubleTest球状测试法.Glycol(EthyleneGlycol)乙二醇.GoldenBoard测试用标准板.GrainSize结晶粒度.GrassLeak大漏.Grid标准格.GroundPlane/EarthPlane接地层.GroundPlaneClearance接地空环.GuidePin导针.Gull/WingLead鸥翼引脚.                       *****H*****Halation环晕.HalfAngle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.HardAnodizing硬阳极化.HardChromePlating镀硬铬.HardSoldering硬焊.Hardener(CuringAgent)硬化剂(或CuringAgent).Hardness硬度.Haring-BlumCell海固槽.Harness电缆组合.HayWire跳线.HeatCleaning烧洁.HeatDissipation散热.HeatDistortionPoint(Temp)热变形点(温度).HeatSealing热封.HeatSinkPlane散热层.HeatTransferPaste导热膏.HeatsinkTool散热工具.Hertz(Hz)赫.HighEfficiencyParticulateAirFilter(HEPA)高效空气尘粒过泸机.HipotTest高压电测.Hi-Rel高度靠度.Hit击(钻孔时钻针每一次"刺下"的动作).HoldingTime停置时刻.HoleBreakout孔位破出.HoleCounter数孔机.HoleDensity孔数密度.HolePreparation通孔预备.HolePullStrength孔壁强度.HoleVoid破洞.Hook切削刀缘外凸.HotAirLevelling喷锡.HotBarSoldering热把焊接.HotGasSoldering热风手焊.HTE(HighTemperatureElongation)高温延伸性.HullCell哈氏槽.HybridIntegratedCircuit混成电路.HydraulicBulgeTest液压鼓起试验.HydrogenEmbrittlement氢脆.HydrogenOvervoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.                        *****I*****I.C.Socket绩体电路器插座.Icicle锡尖.Illuminance照度.ImageTransfer影像转移.ImmersionPlating浸镀.Impedance阻抗.ImpedanceMatch阻抗匹配.Impregnate含浸.In-CircuitTesting组装板电测.Inclusion异物,夹杂物.IndexingHole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert,Insertion插接.InspectionOverlay套检底片.InsulationResistance绝缘电阻.IntegratedCircuit(IC)绩体电路器.InterFace接口.Interconnection互连.IntermetallicCompound(IMC)接口共化物.InternalStress内应力.Interposer互边导电物.InterstitialVia-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).IonCleanliness离子清洁度.IonExchangeResins离子交换树脂.IonMigration离子迁移.Ionizable(Ionic)Contaimination离子性污染.Ionization游离,电离.IonizationVoltage(CoronaLevel)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.                        *****J*****JEDEC(JointElectronicDevice 联合电子组件工程委员会.EngineeringCouncil)J-LeadJ型接脚.JobShop专业工厂.Joule焦耳.JumperWire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时显现.                       *****K*****Kapton聚亚醯胺软板.Karat克拉   (1克拉(钻石)=0.2g  纯金那么24k金为100%的钝金.Kauri-ButanolValue考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键KeyBoard键盘.KissPressure吻压,低压.KnoopHardness努普硬度.KnownGoodDie(KGD)之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).KraftPaper牛皮纸.                       *****L*****LamdaWave延伸平波.LaminarFlow平流.LaminarStructure片状结构.LaminateVoid板材空泛.Laminate(s)基板.LaminationVoid压合空泛.Laminator压膜机.Land孔环焊垫,表面焊垫.LandlessHole无环通孔.LaserDirectImaging(LDI)雷射直截了当成像.LaserMaching雷射加工法.LaserPhotogenerator(LPG),LaserPhotoplotter雷射曝光机.LaserSoldering雷射焊接法.LayBack刃角磨损.LayOut布线,布局.LayUp叠合.LayertoLayerSpacing层间距离Leaching焊散漂出,熔出.Lead引脚.LeadFrame脚架.LeadPitch脚距.LeakageCurrent漏电电流.Legend文字标记.Leveling整平.LiftedLand孔环(焊垫)浮起.Ligand错离子附属体.LightEmittingDiodes(LED)发光二极管.LightIntegrator光能累积器.LightIntensity光强度.LimitingCurrentDensity极限电流密度.LiquidCrystalDisplay(LCD)液晶显示器.LiquidDielectrics液态介质.LiquidPhotoimagibleSolderMask,(LPSM)液态感光防焊绿漆.LocalAreaNetwork区域性网络.Logic逻辑.LogicCircuit逻辑电路.LossFactor缺失因素.LossTangent(TanδDK)缺失正切.LotSize批量.Luminance发光强度.Lyophilic亲水性胶体.                      *****M*****Macro-ThrowingPower巨观分布力.MajorDefect要紧(严峻)缺点.MajorWeaveDirection要紧织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.MassFinishing大量整面(拋光).MassLamination大型压板.MassTransport质量输送.MasterDrawing主图.Mat席(用于CEM-3(CompositeEpoxyMaterial)的复合材料.)MatteSide毛面(电镀铜皮(EDFoil)之粗糙面).Mealing泡点.MeanTimeToFailure(MTTF)故障前可用之平均时数.Measling白点.MechanicalStretcher机械式张网机.MechanicalWarp机械式缠绕.Mechanism机理.MembraneSwitch薄膜开关.MeniscographTest弧面状沾锡试验.Meniscus弯月面.MercuryVaperLamp汞气灯.MeshCount纲目数.MetalHalideLamp金属卤素灯.Metallization金属化.MetallizedFabric金属化纲布.Micelle微胞.MicroWireBoard微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip微条.MicrostripLine微条线,微带线.MicrothrowingPower微分布力.Microwave微波.Migration迁移.MigrationRate迁移率.Mil英丝.MinimumAnnularRing孔环下限.MinimumElectricalSpacing电性间距下限.MinorWeaveDirection次要织向.Misregistration对不准度.MixedComponmtMountingTechnology混合零件之组装技术.Modem调变及解调器.Modification修改.Module模块.ModulusofElasticity弹性系数.MoistureandInsulationResistanceTest湿气与绝缘电阻试验.MoldRelease脱模剂,离型剂.Mole摩尔.Monofilament单丝.MotherBoard主机板,母板.MouldedCircuit模造立体电路机.MountingHole安装孔.MountingHole组装孔,机装孔.MouseBite鼠齿(蚀刻后线路边缘显现不规那么缺口).Multi-Chip-Module(MCM)多芯片芯片模块.MultiwiringBoard(orDiscreteWiringBoard)复线板.                       *****N*****N.C.数值操纵.NailHead钉头.NearIR近红外线.Negative负片,钻尖的第一面外缘变窄.NegativeEtch-back反回蚀.NegativeStencil负性感光膜.Negative-ActingResist负性作用之阻剂.Network纲状元件.Newton牛顿.NewtonRing牛顿环.NewtonianLiquid牛顿流体.Nick缺口.N-MethylPyrrolidine(NMP)N-甲基四氢哔咯.NobleMetalPaste贵金属印膏.Node节点.Nodule节瘤.Nomencleature标示文字符号.NominalCuredThickness标示厚度.Non-CircularLand非圆形孔环焊垫.Non-flammable非燃性.Non-wetting不沾锡.NormalConcentration (Strength)标准浓度,当量浓度.NormalDistribution常态分布.Novolac酯醛树脂.Nucleation,Nucleating核化.NumericalControl数值操纵.Nylon尼龙.                       *****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(OxyenFreeHighConductivity)无氧高导电铜.Ohm欧姆.Oilcanning盖板弹动.OLB(OuterLeadBond)外引脚结合.Oligomer寡聚物.OmegaMeter离子污染检测仪.OmegaWave振荡波.On-ContactPrinting密贴式印刷.Opaquer不透亮剂,遮光剂.OpenCircuits断线.OpticalComparater光学对比器(光学放大器.)OpticalDensity光密度.OpticalInspection光学检验.OpticalInstrument光学仪器.OrganicSolderabilityPreservatives(OSP)有机保焊剂.Osmosis渗透.Outgassing出气,吹气.Outgrowth悬出,横出,侧出.Output产出,输出.Overflow溢流.Overhang总悬空.Overlap钻尖点分离.Overpotantial(Overvoltage)过电位,过电压.Oxidation氧化.OxygenInhibitor氧化抑制剂.OzoneDepletion臭氧层耗损.                        *****P*****Packaging封装,构装.Pad焊垫,圆垫.PadMaster圆垫底片.PadsOnlyBoard唯垫板.Palladium钯.Panel制程板.PanelPlating全板镀铜.PanelProcess全板电镀法.PaperPhenolic纸质酚醛树脂(板材).PartingAgent脱膜剂.Passivation钝化,钝化外理.PassiveDevice(Component)被动组件(零件)Paste膏,糊.Pattern板面图形.PatternPlating线路电镀.PatternProcess线路电镀法.PeakVoltage峰值电压.PeelStrength抗撕强度.PeriodicReverse(PR)Current周期性反电流.Peripheral周边附属设备.Permeability透气性,导磁率.Permittivity诱电率,透电率.pHValue酸碱值.Phase相.PhaseDiagram相图.Phenolic酚醛树脂.Photofugitive感光褪色.Photographicfilm感光成像之底片.Photoinitiator感光启始剂.Photomask光罩.Photoplotter,Plotter光学绘图机.Photoresist光阻.PhotoresistChemicalMachinning(Milling)光阻式化学(铣刻)加工.Phototool底片.Pickand Place拾取与放置.Piezoelectric压电性.Pin插脚,插梢,插针.PinGridArray(PGA)矩阵式针脚对装.Pinhole针孔.PinkRing粉红圈.Pitch跨距,脚距,垫距,线距.Pits凹点.PlainWeave平织.Plasma电浆.Plasticizers可塑剂,增塑剂.PlatedThroughHole镀通孔.Platen热盘.Plating镀.Plotting标绘.Plowing犁沟.Plug插脚,塞柱.Ply层,股.PneumaticStretcher气动拉伸器.PogoPin伸缩探针.Point钻尖.PointAngle钻尖面.PointSourceLight点状光源.Poise泊."粘滞度"单位=1dyne*sec/cm2.PolarSolvent极性溶剂.Polarity电极性.Polarization分极,极化.PolarizingSlot偏槽.PolyesterFilms聚酯类薄片.PolymerThickFilm(PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亚醯胺.PopcornEffect爆米花效应.Porcelain瓷材,瓷面.PorosityTest疏孔度试验.PositiveActingResist正性光阻剂.PostCure后续硬化,后烤.PostSeparation后期分离,事后公离.PotLife运用期,锅中寿命.Potting铸封,模封.PowerSupply电源供应器.Preform预制品.Preheat预热.Prepreg胶片,树脂片.PressPlate钢板.Press-FitContact挤入式接触.PressureFoot压力脚.Pre-tinning预先沾锡.PrimaryImage线路成像.PrintThrough压透,过度挤压..Probe探针.ProcessCamera制程用照像机.ProcessWindow操作范畴.ProductionMaster生产底片.Profile轮廓,部面图,升温曲线图棱线.Propagation传播.PropagationDelay传播延迟.PuddleEffect水坑效应.PullAway拉离.PulsePlating脉冲电镀法.PumicePowder浮石粉.Punch冲切.Purge,Purging净空,净洗.PurplePlague紫疫(金与铝的共化物层).Pyrolysis热裂解,高温分解.                       *****Q*****QuadFlatPack(QFP)方扁形封装体.QualificationAgency资格认证机构.QualificationInspection资格检验.QualifiedProductsList合格产品(供应者)名单.QualitativeAnalysis定性分析.QualityConformanceTestCircuitry(Coupon)品质符合之试验线路(样板).QuantitativeAnalysis定量分析.Quench淬火,骤冷.QuickDisconnect快速接头.Quill纬纱绕轴.                       *****R*****Rack挂架.RadialLead放射状引脚.RadioFrequencyInterference(RFI)射频干扰.RakeAngle抠角,耙角.RatedTemperature,Voltage额定温度,额定电压.Reactance电抗.RealEstate底材面,基板面.RealTimeSystem实时系统.Reclaiming再生,再制.Rediometer辐射计,光度计.ReeltoReel卷轮(盘)式操作.ReferenceDimension参考尺度.ReferenceEdge参考边缘.Reflection反射.ReflowSoldering重熔焊接,熔焊.Refraction折射.RefractiveIndex折射率.RegisterMark对准用标记.Registration对准度.Reinforcement补强物.Rejection剔退,拒收.Relamination(Re-Lam)多层板压合.Relaxation放松.缓和.Relay继电器.ReleaseAgent, ReleaseSheets脱模剂,离模剂.Reliability可靠度,可信度.ReliefAngle浮角.Repair修理.ResinCoatedCopperFoil背胶铜箔.ResinContent胶含量,树脂含量.ResinFlow胶流量,树脂流量.ResinRecession树脂下陷.ResinRichArea多胶区,树脂丰富区.ResinSmear胶(糊)渣.ResinStarveArea缺胶区,树脂缺乏区.Resist阻膜,阻剂.Resistivity电阻系数,电阻率.Resistor电阻器,电阻.ResistorDrift电阻漂移.ResistorPaste电阻印膏.Resolution解像,解像度,辨论率.ResolvingPower解析(像)力,辨论力.ReverseCurrentCleaning反电流(电解)清洗.ReverseEtchback反回蚀.ReverseImage负片影像(阻剂).ReverseOsmosis(RO)反(逆渗透).Reversion反转,还原.Revision修正版.改订版.Rework(ing)重工,再加工.Rhology流变学,流变性质.RibbonCable圆线缆带.Rigid-FlexPrintedBoard硬软合板.Ring套环.Rinsing水洗,冲洗.Ripple纹波(指整流器所输出电流中不稳固成分).RiseTime上升时刻.Roadmap线路与零件之布局图.Robber辅助阴极.RollerCoating辊轮涂布.RollerCoating滚动涂布法.RollerCutter辊切机.RollerTinning辊锡法,滚锡法.Rosin松香.RotaryDipTest摆动沾锡试验.Routing切外型.Runout偏转,累绩距差.Rupture迸裂.                        *****S*****SacrificialProtection牺牲性爱护层.SaltSprayTest盐雾试验.SandBlast喷砂.Saponification皂化作用.Saponifier皂化剂.SatinFinish缎面处理.ScaledFlowTest比例流量实验.SchemeticDiagram电路概略图.ScoringV型刻槽.Scratch刮痕.ScreenPrinting纲版印刷.Screenability纲印能力.Scrubber磨刷机,磨刷器.Scum透亮残膜.Sealing封孔.SecondarySide第二面.Seeding下种.SelectivePlating选择性电镀.Self-Extinguishing自熄性.Selvage布边.Semi-AdditiveProcess半加成制程.Semi-Conductor半导体.Sensitizing敏化.SeparableComponentPart可分离式零件.SeparatorPlate隔板,钢板.SequentialLamination接续性压合法.SequesteringAgent螯合剂.Shadowing阴影,回蚀死角.Shank钻针柄部.ShearStrength抗剪强度.ShelfLife储龄.Shield遮挡.ShoreHardness萧氏硬度.Short短路.ShoulderAngle肩斜角.Shunt分路.SideWall侧壁.Siemens电阻值.Sigma(StandardDeviation)标准差.Signal讯号.Silane硅烷.SilicaGel硅胶砂.Silicon硅.Silicone硅铜.SilkScreen纲版印刷,丝纲印刷.SilverMigration银迁移.SilverPaste银膏.Single-In-LinePackage(SIP)单边插脚封装体.Sintering烧结.Sizing上胶,上浆.Sizing上浆处理.Skin Effect集肤效应(高频下,电流在传递时多集中在导体  表面,使得道线内部通过电流甚少,造成内部导体白费,并也使得表面导体部分电阻升高.SkipPrinting,SkipPlating漏印,漏镀.SkipSolder缺锡,漏焊.Slashing浆经.SleeveJint套接.Sliver边丝,边余.Slot,Slotting槽口.Sludge于泥.Slump塌散.Slurry稠浆,悬浮浆.SmallHole小孔.Smear胶渣.Smudging锡点沾污.Snap-off弹回高度.Socket插座.SoftContact轻触.SoftGlass软质玻璃(铅玻璃).Solder焊锡.SolderBall锡球.SolderBridging锡桥.SolderBump焊锡凸块.SolderColumnPackage锡柱脚封装法.SolderConnection焊接.SolderCost焊锡着层.SolderDam锡堤.SolderFillet