PCB英语2016要点

AnembeddedsystemisundoubtedlythemostpopularoneofthemostpromisingfieldofITapplications.Embeddedsystemsusedincertainspecialequipment,thesedevicesusuallyhardwareresources(suchasCPU,memory,etc.)isverylimited,andthecostisverysensitive,sometimestothereal-timeresponserequirementsarehigher.Especiallytheintelligentasconsumerappliances,embeddedmoreimportant.Likeweusuallyseemobilephone,PDA,electronicdictionary,visualtelephone,VCD/DVD/MP3Player,digitalcamera(DC),digitalvideocamera(DV),UDisk,STB(SetTopBox),high-definitiontelevision(HDTV),gameconsoles,smarttoys,switches,routers,ncequipmentorinstrumentation,automotiveelectronics,homeappliances,medicalequipment,aerospaceequipment,controlsystemandsoon中英制基本单位换算1kg=2.2051磅=0.454kg1英尺=12英寸lb(磅)1OZ(盎1g=0.03527OZ1英寸inch=1000密尔mil司)=28.3527g1ft(英1m=3.281ft1mil=1000u”(uinmil)尺)=0.3048m1码=0.914m1m=1.094码1OZ=28.35克/平方英尺=35微米1in(英1mm=0.03937in1in=1000mil=25.4mm,1mil=25.4u寸)=25.4mmm1m2=10.76ft21ft2=0.0929m21ASD=1安培/平方分米=10.76安培/平方英尺1磅力=4.44841N=0.2248磅力1加仑美制=3.785升牛顿1psi=0.06895ba1bar=14.5psi=1.013kg/cm1bar=100000Par21马力=0.746千1品脱=568ml瓦1oC=1.8x1oF=(oF-32)/1.8oC1英尺=30.5cmoC+32oF基本英文词汇流程Boardcut开料Carbonprinting碳油印刷Innerdry内层干膜filmPeelableblue蓝胶maskInneretching内层蚀刻ENIG(Electrolessnickelimmersion沉镍金gold)Innerdryfilmstripping内层干膜退膜HAL(hotairleveling)喷锡AOI（AutomaticOpticalInspection）自动光学检测OSP（Organicsolderabilitypreservative）有机保焊Pressing压板Punching啤板Drilling钻孔Profiling外形加工Desmear除胶渣，去钻污E-Test电性测试PTH镀通孔，沉铜FQC(finalqualitycontrol)最终品质控制Panelplating整板电镀FQA(Finalqualityaudit)最终品质保证Outerdryfilm外层干膜Packing包装Etching蚀刻IPQA(In-processqualityaudit)流程QATinstripping退锡IPQC(In-processqualitycontrol)流程QCEQC（QCafteretching）蚀检QCIQC(Incomingqualitycontrol)来料检查Soldermask感阻MRB(materialreviewboard)材料评审委员会Componentmark字符QA(Qualityassurance)品质保证PhysicalLaboratory物理实验室QC(Qualitycontrol)品质控制ChemistryLaboratory化学实验室Documentcontrolcenter文件控制中心2ndDrilling二钻Routing锣板，铣板Brownoxidation棕化Wastewatertreatment污水处理V-cutV坑WIP（workinprocess）半成品Store/stock仓库F.G(Finishedgoods)成品概述PrintedCircuitBoard印制电路板FlexiblePrintedCircuit,FPC软板Double-SidePrintedBoard双面板IPC（TheInstituteforInterconnectingandPackingElectronicCircuits）电子电路互连与封装协会CPAR（Corrective&PreventiveActionRequest）要求纠正预防措施FlammabilityRate燃性等级Characteristicimpedance特性阻抗BUM（Build-upmultilayer）积层多层板DateCode周期代码CCL（Copper-cladlaminate）覆铜板Ioniccontamination离子性污染AcceptanceQualityLevel(AQL)允收水平HDI（Highdensityinterconnecting）高密度互连板BaseMaterial基材Radius半径Capacity生产能力Diameter直径Capability工艺能力PPM(PartsPerMillion)百万分之几CAM（computer-aidedmanufacturing)计算机辅助制造UnderwritersLaboratoriesInc.美国保险商实验所CAD(computer-aideddesign)计算机辅助StatisticalProcessControl统计过程控制Specification规格，规范Via导通孔Dimension尺寸Buried/blindvia埋/盲孔Tolerance公差Toolinghole定位孔Oven焗炉Output/throughput产量湿流程PTH（platedthroughhole）镀通孔（俗称沉铜）Acidcleaning酸性除油PP(PanelPlating)板电Aciddip酸洗Patternplating图电Pre-dip预浸Linewidth线宽Alkalinecleaning碱性除油Spacing线隙Flux松香Deburring去毛刺（沉铜前磨板）Hotairleveling喷锡Carbontreatment碳处理Skipplating跳镀，漏镀Track/conductor导线Undercut侧蚀Aspectratio深径比Waterrinsing水洗EtchFactor蚀刻因子Transportation行车BackLightTest背光测试Rack挂架Pinkring粉红圈Maintenance保养干流程Holelocation孔位Annularring孔环ImageTransfer图象转移ComponentSide(C/S)元件面Artwork底片SolderSide(S/S)焊接面Mylar胶片MatteSolderMask哑绿油Silkscreen/legend/ComponentMark文字Holebreakout破孔Fiducialmark基点，对光点Scrubbing磨板Expose曝光Developing显影内层制作Corematerial内层芯板Thermalpad散热PADPre-pregPP片Resincontent树脂含量KraftPaper牛皮纸Brownoxidation棕化Layup排版BlackOxidation黑化Registration对位Basematerial板材Delamination分层其它Wicking灯芯效应Holesize孔径(尺寸)Yield良品率TouchUp修理WarpandTwist板曲度SolventTest溶剂测试Peeloff剥离CompanyLogo公司标识TapeTest胶纸试验ULMarkUL标记Cosmetic外观Function功能Tin/LeadRatio锡/铅比例ReliabilityTests可靠性试验HoleWallRoughness孔壁粗糙度BaseCopperThickness底铜厚度PCB专业英语(PCBSPECIALENGLISH)1.PCB=PrintedCircuitBoard电路板2.CAM=Computeraidedmanufacture计算机辅助3.Pad焊盘4.Annularring焊环5.AOI=automaticopticalinspection自动光学检测6.Chargeoffree免费7.WIP=workinprocess在线板8.DCC=documentcontrolcenter文控中心9.Legend字符10.CS=ComponentSide=TopSide（顶层）元件面11.SS=SolderSide=BottomSide（底层）焊锡面12.GoldPlated电金，镀金13.NickelPlated电镍，镀镍14.ImmersionGold沉金=沉镍金15.CarbonInkPrint印碳油16.MicrosectionReport切片，横切面报告17.X-out=Cross-out打"X"报告18.Panel（客户称）拼板，（生产线称）工作板19.Marking标记，UL标记20.Datecode生产周期21.Unit单元，单位22.Profile外形，轮廓23.ProfileByRouting锣(铣)外形24.WetFilm湿菲林,湿绿油,湿膜25.Slot槽,方坑26.BaseMaterial=BaseLaminate基材,板料27.V-out=V-scoreV形槽28.Finished成品29.Marketing市场部30.GerberFileGERBER文件31.ULLOGOUL标记32.E-Test=ElectricOpen/ShortTest电子测试33.PO=PurchaseOrder订单34.Tolerance公差35.Rigid,FlexibleBoard刚性,软性板36.Boardcut开料37.Boardbaking焗板38.Drill钻孔39.PTH=PlatedThroughHole镀通孔,沉铜40.Panelplating板面电镀,全板电镀41.PhotoImage图象,线路图形42.Patternplating线路电镀43.Etching蚀板,蚀刻44.SM=SolderMask防焊,阻焊,绿油45.SR=SolderResist防焊,阻焊,绿油46.Goldfinger金手指47.Silkscreen丝印字符48.HAL=HASL=Hotair(Solder)leveling热风整平喷锡49.Routing锣板,铣板50.Punching冲板,啤板51.FOC=finalqualitychecking终检,最后检查52.FOA=finalqualityaudit最后稽查(抽查)53.Shippment出货54.Flux松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Leadfree无铅57.COC=complianceofcertificate材料证明

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58.Microsection=crosssection微切片,横切片59.Chamicalgold沉镍金60.Mould=punchdie模具,啤模61.MI=manufactureinstruction制作批示62.QA=qualityassurance品质保证63.CAD=computeraideddesign计算机辅助设计64.Drillbitsize钻咀直径65.Bowandtwist板弯和板曲66.Hit击打,孔数67.Bonding邦定,点焊68.Testcoupon测试模块(科邦)69.Thievingcopper抢电流铜皮70.Rail-web71.Break-uptab工艺边72.Breakawaytab工艺边73.GND=ground地线,大铜皮74.Holeedge孔边,孔内75.Stamphole邮票孔76.Template天坯,型板,钻孔样板(首板)77.Dryfilm干菲林,干膜78.LPI=liquidphotoimage液态感光=湿绿油79.Multilayer多层板80.SMD=surfacemouteddevice贴片,表面贴装器件81.SMT=surfacemoutedtechnology表面贴装技术82.Peelablemask=bluegel蓝胶83.Toolinghole工艺孔,管位,定位孔,工具孔84.Fiducialmask测光点,光学对位点,对光点,电眼85.Copperfoil铜箔86.Dimension尺寸87.Nagative负的,positive正的88.Flashgold闪镀金,镀薄金89.Engineeringdepartment工程部90.Deliverydate交货期91.Bevelling斜边92.Spacing=gap间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。PCB的各层定义及描述：1、TOPLAYER（顶层布线层）：设计为顶层铜箔走线。如为单面板则没有该层。2、BOMTTOMLAYER（底层布线层）：设计为底层铜箔走线。3、TOP/BOTTOMSOLDER（顶层/底层阻焊绿油层）：顶层/底层敷设阻焊绿油，以防止铜箔上锡，保持绝缘。在焊盘、过孔及本层非电气走线处阻焊绿油开窗。焊盘在设计中默认会开窗（OVERRIDE：0.1016mm），即焊盘露铜箔，外扩0.1016mm，波峰焊时会上锡。建议不做设计变动，以保证可焊性；过孔在设计中默认会开窗（OVERRIDE：0.1016mm），即过孔露铜箔，外扩0.1016mm，波峰焊时会上锡。如果设计为防止过孔上锡，不要露铜，则必须将过孔的附加属性SOLDERMASK（阻焊开窗）中的PENTING选项打勾选中，则关闭过孔开窗。另外本层也可单独进行非电气走线，则阻焊绿油相应开窗。如果是在铜箔走线上面，则用于增强走线过电流能力，焊接时加锡处理；如果是在非铜箔走线上面，一般设计用于做标识和特殊字符丝印，可省掉制作字符丝印层。4、TOP/BOTTOMPASTE（顶层/底层锡膏层）：该层一般用于贴片元件的SMT回流焊过程时上锡膏，和印制板厂家制板没有关系，导出GERBER时可删除，PCB设计时保持默认即可。5、TOP/BOTTOMOVERLAY（顶层/底层丝印层）：设计为各种丝印标识，如元件位号、字符、商标等。6、MECHANICALLAYERS（机械层）：设计为PCB机械外形，默认LAYER1为外形层。其它LAYER2/3/4等可作为机械尺寸标注或者特殊用途，如某些板子需要制作导电碳油时可以使用LAYER2/3/4等，但是必须在同层标识清楚该层的用途。7、KEEPOUTLAYER（禁止布线层）：设计为禁止布线层，很多设计师也使用做PCB机械外形，如果PCB上同时有KEEPOUT和MECHANICALLAYER1，则主要看这两层的外形完整度，一般以MECHANICALLAYER1为准。建议设计时尽量使用MECHANICALLAYER1作为外形层，如果使用KEEPOUTLAYER作为外形，则不要再使用MECHANICALLAYER1，避免混淆！8、MIDLAYERS（中间信号层）：多用于多层板，我司设计很少使用。也可作为特殊用途层，但是必须在同层标识清楚该层的用途。9、INTERNALPLANES（内电层）：用于多层板，我司设计没有使用。10、MULTILAYER（通孔层）：通孔焊盘层。11、DRILLGUIDE（钻孔定位层）：焊盘及过孔的钻孔的中心定位坐标层。12、DRILLDRAWING（钻孔描述层）：焊盘及过孔的钻孔孔径尺寸描述层PCB常用英文词汇汇编AaA.O.I(AutomaticOpticalInspection)自动光学检查Acceptablequalitylevel(AQL)可接受质量水平Accuracy精确度Activating活化Activecarbontreatment活性碳处理AfterPressedThickness压板后之厚度Alignment校直，结盟Annularring锡圈Anti-StaticBag静电胶袋Apparatus设备，仪器Area面积Artwork菲林ArtworkDrawing菲林图形ArtworkFilm原装菲林ArtworkModification菲林修改ArtworkNo.菲林编号Assembly组装，装配Axis轴BbBackplane背板Back-up垫板Baking烘板BallGridArray(BGA)球栅阵列Bareboard裸板BaseCopper底铜Basematerial基材Bevelling斜边BlackOxide黑氧化Blindviahole盲孔Blistering起泡/水泡BoardCutting开料BoardThickness板厚Bottomside底层Breakawaytab打断点Brushing磨刷Build-up积层Bulletpad子弹盘Buriedhole埋孔CcC/M(ComponentMarking)元件字符Carbonink碳油Carrier带板Ceramicsubstrate陶瓷CertificateofCompliance合格证书Chamfer倒角Chemicalcleaning化学清洗Chemicalcorrosion化学腐蚀ChipScalePackage(CSP)晶片比例包装Circuit线路Clearance间距/间隙Color颜色ComponentSide(C/S)元件面Compositelayers复合层ComputerAidedDesign(CAD)电脑辅助设计ComputerAidedManufacturing(CAM)电脑辅助制作ComputerNumerialControl(CNC)数控Conductor导体Conductorwidth/space导体线宽/线隙Contact接点Copperarea铜面积Copperclad铜箔Copperfoil铜箔Copperplating电镀铜Corner角线Cornermark板角记号CornerREG.Hole角位对位孔Cracking裂缝Creasing皱折Criteria规格,标准Crossectionarea切面Cu/SnPlating镀铜锡Currentefficiency电流效率Customer客户CustomerDrillingFile客户钻孔资料CustomerP/N客户产品编号DdD/FRegistrationHole干菲林对位孔D/F(DryFilm)干膜DateCode日期代号Datumhole基准参考孔Daughterboard子板Deburring去毛刺Defect缺陷Definition定义Delamination分层Delay耽搁Delivery交货Densitomefer透光度计Density密度Department部门Description说明Designorigin设计原点Desmear去钻污,除胶Dessicant防潮珠Developer显影液,显影机Diamond钻石Diazofilm重氮片Dielectricbreakdown介电击穿Dielectricconstant介电常数DielectricThickness介电层厚度DielectricVoltageTest绝缘测试Dimension尺寸Dimensionalstability尺寸稳定性Direct/indirect直接/间接Distribution发放Documenttype文件种类DocumentationControl文件控制Doublesidedboard双面板Drillbit钻咀Drilling钻孔DrillingRoughness钻孔粗糙度DryFilm干菲林DryFilm-Pattern干膜线路Dynamic动态EeECN(EngineeringChangeNotification)工程更改通知Effectivedate有效期ElectricalTestFixture电测试针床Electromigration漏电Electroconductivepaste导电胶Electroless无电沉Electrolesscopper无电沉铜ElectrolessNi无电沉镍ElectrolessGold/Au无电沉金Engineeringdrawing工程图纸Entek有机涂覆Epoxyglasssubstrate环氧玻璃基板Epoxyresin环氧基树脂Etch蚀刻Etchback凹蚀Etching蚀刻E-TestMarking电测试标记E-Test(ElectricalTest)电测试Exposure曝光Externallayer外层FfFiducialmark基准点Filling填充FilmFabrication菲林制作FinalQC最终检查FinishOverallBoardThickness成品总板厚度Fixture夹具Flammability可燃性FlashGold薄金Flexible易曲的,能变形的Flux助焊剂GgGeneralinformation一般资料Ghostimage重影Glasstransitiontemperature玻璃化湿度GoldFinger(G/F)金手指Goldenboard金板Grid网格Groundplane地线层HhHAL(HotAirLeveling)热风整平HandRout手锣Hardness硬度HeatSealed热密封HeatShrink-warp热收缩Holdingtime停留时间Hole孔Holebreakout破环Holedensity孔的密度HoleDiameter孔径Holelocation孔位HoleLocationChart孔位座标表HolePositionTolerance孔位误差Holesize孔尺寸HotAirLeveling(HAL)热风整平Humidity湿度IiIdentification标识,指标Image影像Imagingtransfer图形转移Impedance阻抗ImpedanceTest阻抗测试Innercopperfoil内层铜箔Inspection检验InsulationresistanceTest绝缘测试InterPlaneSeparation内层分离InterleavePaper隔纸Internallayer内层Internalstress内应力Ioniccleanliness离子清洁度Isolation孤立IsolationResistance绝缘电阻Item项目KkKEYboard按键盘Keyslot槽孔Kraftpaper牛皮纸LlLaminate板材LaminateThickness材料厚度Laminationvoid层间空洞Landlesshole破孔Laserplotter激光绘图机Laserplotting激光绘图Laserviahole激光穿孔Layup层压配本Lay-upInstruction压板指示Legend字符LegendWidth字符宽度Length长度LiftedLands残铜LineWidth线宽Liquid液体Location位置Logicdiagram逻辑图形Logo唛头,标记Lotsize批卡MmMark标记Masterdrawing菲林图形MaterialThickness材料厚度MaterialType材料类型Max.X-out坏板上限Max.BoardThicknessAfterPlating电镀后总板厚度之上限Measling白斑MechDrawingNo.图纸编号Mechanicalcleaning机械清洗Metal金属Method方法MI(ManufacturingInstruction)生产制作指示Microstrip微条线MinConductorCopperThickness最小线路铜厚MinHoleWallCopperThickness最小孔壁铜厚Min.GoldPlatingThickness最小金厚Min.NickelThickness最小镍厚Min.Tin-LeadThickness(AfterHAL)（喷锡后）最小锡厚Min.AnnularRing最小环宽Min.SpacingbetweenLinetoLine线与线之间的最小距离Min.SpacingbetweenLinetoPad线与焊盘之间的最小距离Min.SpacingbetweenPadtoPad焊盘与焊盘之间的最小距离Minimum最小Mirroring镜像Missing缺少ModelNo.产品名称Molded模塑Motherboard主板Moulding模房Mountinghole安装孔Multilayer多层板Multi-layerLaminate多层板材料NnNegative反面的Netlist网络表Network网络Nick缺口No.ofholes孔数No.ofArray/Panel每个拼板套板数No.ofPanelperStack每叠板数No.ofPanel/Sheet每张大料拼板数No.ofPcsPerBag每包数量No.ofUnit/Array每套单元数Normalvalue标准值OoOblong椭圆形的Offset偏移Open/short开路/短路Optimization(design)最佳化(设计)OrganicSolerabilityPeservatives(OSP)有机保护剂Originator原作者Outercopperfoil外层铜箔Outline外形PpPacking包装Packing包装Pad焊盘PanelArea拼板面积PanelPlatedCrack板镀缺口Panelplating整板电镀PanelSize拼板尺寸PanelSizeAfterOuterlayerCutting外层切板后拼板尺寸PanelUtilization拼板利用率Passrate通过率Passivation钝化Pattern线路PatternInspection线路检查Patternplating图形电镀PCB(PrintedCircuitBoard)印制线路板Peckdrilling啄钻Peelstrength剥离强度Peelable可剥性Peelable剥离强度PeelableMask可脱油Peeling剥离Permanent永久性PHvaluePH值Photoplotting图形输出Photoviahole菲林过孔Photographers照片靶标Photoplotler光绘机Physical物理的Pinhole销定孔Pinkring粉红环Pinninghole钻孔管位Pitch间距Placement放置PlatedThoughHole(PTH)沉铜Plating电镀PlatingCrack电镀裂缝Platingline电镀线Platingrack电镀架PlatingVoid电镀针孔PlugHole塞孔Polymer聚合体Porosity孔隙率Positive绝对的Powerplane电源层Prepreg半固化片Primaryside首面Print印刷Probepoint针床测点Process工序Processflow工序流程ProductPlanningDept.生产计划部Production生产板Profile外形Profiling外形加工ProfilingProcess外形加工ProjectNo.产品编号PTHThermalSeressTestPTH热冲击测试PTH(PlatingThroughHole)沉铜Pullaway拉离Punch啤模Punching冲切PunchingMouldDrawing啤模图形QqQAAudit品质审计QA(QuanlityAssurance)品质部QuadPaltPack(QFP)四边扁平林整器件Quality质量Quantity数量RrRawMaterialUtilization原材料利用率Recall回收Rectifier整流器Registermark对位点Registration重合点Remark备注Resin树脂ResinRecession流胶Resist抗蚀剂Resolution分辨率Rigid精密的Rollercoating涂覆Roughening粗化Roundpad圆盘Routing外形加工,铣板SsS/MMaterial绿油物料S/M(SolderMask)阻焊Sales销售Sample样板Samplinginspection抽样检验Scalingfactor缩放比例因素Scope范围Scoring刻槽Scratch划痕Secondaryside第二面SectionCode组别代号SectionCodeChange组别代号更改Segment部分,片段Separated分离Sequence顺序Sets套SheetSize大料尺寸Shematicdiagram原理图Shiny有光泽的,发光的Silkscreen丝印Silverfilm银盐片Single/double单层/双面Slot槽,坑Smear污点SolderMask阻焊Soldermaskonbarecopper(smobc)裸铜覆盖阻焊膜Solderside焊接面SolderSideC/M阻焊面字符SolderSideCir.焊接面线路SolderSideCircuit焊接面SolderSideS/M焊接面阻焊Solderability可焊性SolventTest可溶性测试Spacing线距Specialrequirement特殊要求Specification详细说明，规范Spindle主轴Split裂片Squarepad方块Standard标准值Static静态Stencial网版Stepdrilling分布钻Stepscale光梯尺Store货仓Supplier供应商Supportedhole支撑点Surface表面Surfacemounttechnology表面组装技术Swimming滑移TtTack堆起TapeProgramming铬带制作TapeTest胶带测试TargetHole目标孔Teardrop泪珠Template天平Tenting封孔Test测试Testcoupon图样TestParameter测试参数TestPattern测试孔TestingVoltage电压Thermalshock热冲击Thermalstress热应力Thickness厚度TinContent锡含量Tin/LeadStripping退铅锡Tin-leadplating电镀铅锡Tolerance公差Topside板面Touchup修理(执漏)Training训练Transmission传输线Transmittance传送Trimline修剪UuUltrasoniccleaning超声波清洗Undercut侧蚀UnitArrangement单元排版UnitLayoutPerPanel单元拼板图Uv-blocking阻挡紫外线VvVacunmPack真空包装Vacuumlamination真空压制V-CutV-坑ViewFrom…观察方向由…Visual&Warpage可视性和翘曲度Visualinspection目检Voltage电压WwW/F(WetFilm)湿膜Warp&Twist翘曲和弯曲Width宽度Wiring线路