©2004 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. A
IGBT
FG
L60N
100B
N
TD
FGL60N100BNTD
NPT-Trench IGBT
General Description
Trench insulated gate bipolar transistors (IGBTs) with NPT
technology show outstanding performance in conduction
and switching characteristics as well as enhanced
avalanche ruggedness. These devices are well suited for
Induction Heating ( I-H ) applications
Features
• High Speed Switching
• Low Saturation Voltage : VCE(sat) = 2.5 V @ IC = 60A
• High Input Impedance
• Built-in Fast Recovery Diode
Absolute Maximum Ratings TC = 25°C unless otherwise noted
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Thermal Characteristics
Symbol Description FGL60N100BNTD Units
VCES Collector-Emitter Voltage 1000 V
VGES Gate-Emitter Voltage ± 25 V
IC
Collector Current @ TC = 25°C 60 A
Collector Current @ TC = 100°C 42 A
ICM (1) Pulsed Collector Current 120 A
IF Diode Continuous Forward Current @ TC = 100°C 15 A
PD Maximum Power Dissipation @ TC = 25°C 180 W
Maximum Power Dissipation @ TC = 100°C 72 W
TJ Operating Junction Temperature -55 to +150 °C
Tstg Storage Temperature Range -55 to +150 °C
TL
Maximum Lead Temp. for soldering
Purposes, 1/8” from case for 5 seconds 300 °C
Symbol Parameter Typ. Max. Units
RθJC(IGBT) Thermal Resistance, Junction-to-Case -- 0.69 °C/W
RθJC(DIODE) Thermal Resistance, Junction-to-Case -- 2.08 °C/W
RθJA Thermal Resistance, Junction-to-Ambient -- 25 °C/W
Application
Micro- Wave Oven, I-H Cooker, I-H Jar, Induction Heater, Home Appliance
G C E
TO-264
G
C
E
G
C
E
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FGL60N100BNTD Rev. A
FG
L60N
100B
N
TD
©2004 Fairchild Semiconductor Corporation
Electrical Characteristics of IGBT TC = 25°C unless otherwise noted
Electrical Characteristics of DIODE TC = 25°C unless otherwise noted
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BVCES Collector Emitter Breakdown Voltage VGE = 0V, IC = 1mA 1000 -- -- V
ICES Collector Cut-Off Current VCE = 1000V, VGE = 0V -- -- 1.0 mA
IGES G-E Leakage Current VGE = ± 25, VCE = 0V -- -- ± 500 nA
On Characteristics
VGE(th) G-E Threshold Voltage IC = 60mA, VCE = VGE 4.0 5.0 7.0 V
VCE(sat)
Collector to Emitter
Saturation Voltage
IC = 10A, VGE = 15V -- 1.5 1.8 V
IC = 60A, VGE = 15V -- 2.5 2.9 V
Dynamic Characteristics
Cies Input Capacitance VCE=10V, VGE = 0V,
f = 1MHz
-- 6000 -- pF
Coes Output Capacitance -- 260 -- pF
Cres Reverse Transfer Capacitance -- 200 -- pF
Switching Characteristics
td(on) Turn-On Delay Time VCC = 600 V, IC = 60A,
RG = 51Ω, VGE=15V,
Resistive Load, TC = 25°C
-- 140 -- ns
tr Rise Time -- 320 -- ns
td(off) Turn-Off Delay Time -- 630 -- ns
tf Fall Time -- 130 250 ns
Qg Total Gate Charge VCE = 600 V, IC = 60A,
VGE = 15V , , TC = 25°C
-- 275 350 nC
Qge Gate-Emitter Charge -- 45 -- nC
Qgc Gate-Collector Charge -- 95 -- nC
Symbol Parameter Test Conditions Min. Typ. Max. Units
VFM Diode Forward Voltage
IF = 15A -- 1.2 1.7 V
IF = 60A -- 1.8 2.1 V
trr Diode Reverse Recovery Time IF = 60A di/dt = 20 A/us 1.2 1.5 us
IR Instantaneous Reverse Current VRRM = 1000V -- 0.05 2 uA
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FGL60N100BNTD Rev. A
FG
L60N
100B
N
TD
©2004 Fairchild Semiconductor Corporation
0 1 2 3 4 5
0
20
40
60
80
100
20V
15V
10V
9V
8V
7V
V
GE
= 6V
Common Emitter
TC = 25℃
C
ol
le
ct
or
C
ur
re
nt
, I
C
[A
]
Collector-Emitter Voltage, VCE [V]
0 1 2 3 4
0
10
20
30
40
50
60
70
80
90
TC = 125℃
TC = 25℃
Common Emitter
VGE = 15V
TC = 25 ℃━━
TC = 125 ------℃
C
ol
le
ct
or
C
ur
re
nt
, I
C
[A
]
Collector-Emitter Voltage, VCE [V]
-50 0 50 100 150
1
2
3
IC=10A
30A
60A
80A
Common Emitter
VGE=15V
C
ol
le
ct
or
-E
m
itt
er
V
ol
ta
ge
, V
C
E [
V]
Case Temperature, TC [ ]℃
4 8 12 16 20
0
2
4
6
8
10
Common Emitter
TC= - 40
OC
IC=10A
80A
60A
30A
C
ol
le
ct
or
-E
m
itt
er
V
ol
ta
ge
, V
C
E[V
]
Gate-Emitter Voltage, VGE [V]
4 8 12 16 20
0
2
4
6
8
10
Common Emitter
TC = 25℃
80A
60A
30A
IC = 10AC
ol
le
ct
or
-E
m
itt
er
V
ol
ta
ge
, V
C
E [
V]
Gate-Emitter Voltage, VGE [V]
4 8 12 16 20
0
2
4
6
8
10
Common Emitter
TC = 125℃
80A
60A
30A
IC = 10AC
ol
le
ct
or
-E
m
itt
er
V
ol
ta
ge
, V
C
E [
V]
Gate-Emitter Voltage, VGE [V]
Fig 1. Typical Output Characteristics Fig 2. Typical Saturation Voltage Characteristics
Fig 4. Saturation Voltage vs. VGE Fig 3. Saturation Voltage vs. Case
Temperature at Varient Current Level
Fig 5. Saturation Voltage vs. VGE Fig 6. Saturation Voltage vs. VGE
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FGL60N100BNTD Rev. A
FG
L60N
100B
N
TD
©2004 Fairchild Semiconductor Corporation
0 5 10 15 20 25 30
100
1000
10000
Common Emitter
V
GE
= 0V, f = 1MHz
T
C
= 25℃
Cres
Coes
Cies
C
ap
ac
ita
nc
e
[p
F]
Collector-Emitter Voltage, VCE [V]
0 50 100 150 200
10
100
1000
10000
VCC=600V, IC=60A
VGE=± 15V
TC=25
oC
Tdoff
Tdon
Tr
Tf
Sw
itc
hi
ng
T
im
e
[n
s]
Gate Resistance, RG [Ω ]
10 20 30 40 50 60
100
1000
V C C=600V , R g =51Ω
V G E=± 15V , TC=25℃
Tdon
T r
T f
Tdo ff
Sw
itc
hi
ng
T
im
e
[n
s]
C o llec to r C urren t, IC [A ]
0 50 100 150 200 250 300
0
5
10
15
20
Common Emitter
VCC=600V, RL=10 Ω
TC=25 ℃
G
at
e-
Em
itt
er
V
ol
ta
ge
,V
G
E [
V]
Gate Charge, Qg [nC]
1 10 100 1000
0.1
1
10
100
Single Nonrepetitive Pulse
TC = 25℃
Curve must be darated
linearly with increase
in temperature
50us
100us
1ms
DC Operation
IC MAX. (Pulsed)
IC MAX. (Continuous)
C
ol
le
ct
or
C
ur
re
nt
,
I C
[A
]
Collector-Emitter Voltage, VCE [V]
10-4 10-3 10-2 10-1 100 101
1E-3
0.01
0.1
1
10
0.1
0.5
0.2
0.05
0.02
0.01
single pulse
Th
er
m
al
R
es
po
ns
e,
Z
TH
JC
[
/W
]
℃
Rectangular Pulse Duration [sec]
Fig 7. Capacitance Characteristics Fig 8. Switching Characteristics vs.
Gate Resistance
Fig 9. Switching Characteristics vs.
Collector Current
Fig 10. Gate Charge Characteristics
Fig 11. SOA Characteristics Fig 12. Transient Thermal Impedance of IGBT
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FGL60N100BNTD Rev. A
FG
L60N
100B
N
TD
©2004 Fairchild Semiconductor Corporation
Fig 17. Junction capacitance
0.1
1
10
100
0.0 0.5 1.0 1.5 2.0 2.5
TC = 25 ℃
TC = 100 ℃
Forward Voltage, VFM [V]
Fo
rw
ar
d
C
ur
re
nt
, I
F[A
]
0 40 80 120 160 200 240
0.0
0.2
0.4
0.6
0.8
1.0
1.2
Irr
trr
IF=60A
TC=25℃
di/dt [A/ ]㎲
R
ev
er
se
R
ec
ov
er
y
Ti
m
e,
t r
r [
]
㎲
0
20
40
60
80
100
120
R
everse R
ecovery C
urrent Irr [A]
10 20 30 40 50 60
0.4
0.6
0.8
1.0
1.2
Irr
trr
Forward Current, IF [A]
R
ev
er
se
R
ec
ov
er
y
Ti
m
e,
t
rr [
]
㎲
4
6
8
10
12
di/dt=-20A/㎲
TC=25℃ Reverse R
ecovery C
urrent Irr [A]
0 300 600 900
1E-3
0.01
0.1
1
10
100
1000
TC = 150 ℃
TC= 25 ℃R
ev
er
se
C
ur
re
nt
, I
R
[u
A]
Reverse Voltage, VR [V]
0.1 1 10 100
0
50
100
150
200
250
TC = 25 ℃
C
ap
ac
ita
nc
e,
C
j [p
F]
Reverse Voltage, VR [V]
Fig 14. Reverse Recovery Characteristics
vs. di/dt
Fig 13. Forward Characteristics
Fig 15. Reverse Recovery Characteristics vs.
Forward Current
Fig 16. Reverse Current vs. Reverse Voltage
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©2004 Fairchild Semiconductor Corporation FGL60N100BNTD Rev. A
FG
L60N
100B
N
TD
Package Dimension
5.45TYP
[5.45 ±0.30]
5.45TYP
[5.45 ±0.30]
4.90 ±0.20
20.00 ±0.20
(8.30) (8.30) (1.00)
(0.50)
(2.00)
(7.00)
(R1.00)
(R2.00)
ø3.30 ±0.20
(7.00)
(1.50)
(1.50) (1.50)
2.50 ±0.20 3.00 ±0.20
2.80 ±0.30
1.00 +0.25
–0.10
0.60 +0.25
–0.10
1.
50
±0
.2
0
6.
00
±0
.2
0
20
.0
0
±0
.2
0
20
.0
0
±0
.5
0
5.
00
±0
.2
0
3.
50
±0
.2
0
2.
50
±0
.1
0
(9.
00
)
(9.
00
)
(2.
00
)
(1.
50
)
(0.
15
)
(2.
80
)
(4.
00
)
(11
.00
)
TO-264
Dimensions in Millimeters
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PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
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CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
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that has been discontinued by Fairchild semiconductor.
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