MC33794芯片静电感应应用(可编辑)MC33794芯片静电感应应用(可编辑)
MC33794芯片静电感应应用
Freescale Semiconductor
Document Number MC33794
Technical Data
Rev 9 112006
Electric Field Imaging Device
The MC33794 is intended for applications where noncontact sensing of MC33794
objects is desired When connected to e...
MC33794芯片静电感应应用(可编辑)
MC33794芯片静电感应应用
Freescale Semiconductor
Document Number MC33794
Technical Data
Rev 9 112006
Electric Field Imaging Device
The MC33794 is intended for applications where noncontact sensing of MC33794
objects is desired When connected to external electrodes an electric field is
createdThe MC33794 is intended for use in detecting objects in this electric
field The IC generates a low-frequency sine wave The frequency is adjustable
by using an external resistor and is optimized for 120 kHz The sine wave has
very low harmonic content to reduce harmonic interference
The MC33794 also contains support circuits for a microcontroller unit MCU ELECTRIC FIELD
to allow the construction of a two-chip E-field system
IMAGING DEVICE
Features
Supports up to 9 Electrodes and 2 References or Electrodes
Shield Driver for Driving Remote Electrodes Through Coaxial Cables
50 V Regulator to Power External Circuit
ISO-9141 Physical Layer Interface
Lamp Driver Output
Watchdog and Power-ON Reset Timer
Critical Internal Nodes Scaled and Selectable for Measurement
EK SUFFIX
High-Purity Sine Wave Generator Tunable with External Resistor
54-LEAD SOICW-EP
CASE 1390-02
Typical Applications
Occupant Detection Systems
Appliance Control Panels and Touch Sensors
Linear and Rotational Sliders
Spill Over Flow Sensing Measurement
Refrigeration Frost Sensing
Industrial Control and Safety Systems Security
Proximity Detection for Wake-Up Features
Touch Screens
Garage Door Safety Sensing
Liquid Level Sensing
ORDERING INFORMATION
Package
Device Name Temperature Range TA
Package
Drawing
MC33794EKR2 -40C to 85C 1390-02 54 SOICW-EP
Freescale Semiconductor Inc 2006 All rights reserved
INTERNAL BLOCK DIAGRAM
4
ABCD
CONTROL
LOGIC
TEST
22 k Nominal
28 k
CLK
OSC
R_OSC
7
0
0
E1E9 MUX
39 k
REF_A REF_B OUT
SHIELD_EN
28 k
150
SHIELD
7
0
0
300
REF_A and REF_B are
not switched to ground
when not selected
MUX
RECT
IN
LP_CAP
LPF
VDD
VCC
10 nF
GAIN AND
RST
OFFSET
WD_IN POR
WD
LEVEL
VCC
VPWR REG ATTN SIGNAL
VDD LAMP_SENSE
AGND
REG
GND and HEAT SINK LAMP_MON
PWR_MON
VDD MON
_
LAMP_GND
LAMP CKT LAMP_OUT
LAMP_CTRL
ISO_OUT
ISO-9141 ISO-9141
ISO_IN
Note All Resistor
Values are Nominal
Figure 1 Simplified
Functional Block Diagram
MC33794
Sensors
2 Freescale Semiconductor
SOICW-EP TERMINAL
CONNECTIONS
RST 1 54 LAMP_CTRL
WD_IN 2 53 ISO-9414
NC 3 52 NC
LAMP_GND 4 51 ISO_IN
NC 5 50 NC
LAMP_OUT 6
49 NC
NC 7 48 NC
LAMP_SENSE 8 47 ISO_OUT
LAMP_MON 9 46 REF_B
SHIELD_EN 10 45 REF_A
D 11 44 E9
C 12 43 E8
B 13 42 E7
A 14 41 E6
SIGNAL 15 40 E5
LEVEL 16 39 E4
PWR_MON 17 38 E3
LP_CAP 18 37 E2
R_OSC 19 36 E1
NC 20 35 TEST
NC 21 34 NC
NC 22 33 NC
NC 23 32 GND
CLK 24 31 NC
VDD MON 25 30 SHIELD
_
VDD 26 29 AGND
VPWR 27 28 VCC
Figure 2 SOICW-EP Terminal Connections
Table 1 SOICW-EP TERMINAL FUNCTION DESCRIPTION
Terminal
Terminal Formal Name
Definition
Name
1 RST Reset This output is intended to generate the reset function of a typical MCU It has a
delay for Power-ON Reset level detectors to force a reset when VCC REG is
out-of-range high or low and a watchdog timer that will force a reset if WD_IN
is not asserted at regular intervals Timing is derived from the oscillator and will
change with changes in the resistor attached to R_OSC
2 WD_IN Watchdog In This terminal must be asserted and deserted at regular interval in order to
prevent RST from being asserted By having the MCU program perform this
operation more often the allowed time a check that the MCU is running and
executing its program is assured If this doesnít occur the MCU will be
reset If
the watchdog function is not desired this terminal may be connected to CLK to
prevent a reset from being issued
3 5 7 NC No connect These terminals may be used at some future date and should be left open
2023 31
33 34
4850 52
4 LAMP_GND Lamp Ground This is the ground for the current from the lamp The current into LAMP_OUT
flows out through this terminal
6 LAMP_OUT Lamp Driver This is an active low output capable of sinking current of a typical indicator lamp
One end of the lamp should be connected to a positive supply for example
battery voltage and the other side to this terminal The current is limited to
prevent damage to the IC in the case of a short or surge during lamp turn-on or
burn-out
MC33794
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Freescale Semiconductor 3
Table 1 SOICW-EP TERMINAL FUNCTION DESCRIPTION continued
Terminal
Terminal Formal Name
Definition
Name
8 LAMP_SENSE Lamp Sense This terminal is normally connected to the LAMP_OUT terminal The voltage at
this terminal is reduced and sent to LAMP_MON so the voltage at the lamp
terminal is brought into the range of the analog-to-digital converter ADC in the
MCU
9 LAMP_MON Lamp Monitor This terminal is connected through a voltage divider to the LAMP_SENSE
terminal The voltage divider scales the voltage at this terminal so that battery
voltage present when the lamp is off is scaled to the range of the MCU ADC
With the lamp off this terminal will be very close to battery voltage if the lamp is
not burned out and the terminal is not shorted to ground This is useful as a lamp
check
10 SHIELD_EN Shield Driver This terminal is used to enable the shield signal The shield is disabled when
SHIELD_EN is a logic low ground
1114 A B C D Selector Inputs These input terminals control which electrode or reference is active Selection
values are shown in Table 5 Electrode Selection page 10 These are logic level
inputs
15 SIGNAL Undetected Signal This is the undetected signal being applied to the detector It has a DC level with
the low radio frequency signal superimposed on it Care must be taken to
minimize DC loading of this signal A shift of DC will change the center point of
the signal and adversely affect the detection of the signal
16 LEVEL Detected Level This is the detected amplified and offset representation of the signal voltage on
the selected electrode Filtering of the rectified signal is performed by a capacitor
attached to LP_CAP
17 PWR_MON Power Monitor This is connected through a voltage divider to VPWR It allows reduction of the
voltage so it will fall within the range of the ADC on the MCU
18 LP_CAP Low-Pass Filter Capacitor A capacitor on this terminal forms a low pass filter with the internal series
resistance from the detector to this terminal This terminal can be used to
determine the detected level before amplification or offset is applied A 10 nF
capacitor connected to this terminal will smooth the rectified signal More
capacitance will increase the response time
19 R_OSC Oscillator Resistor A resistor from this terminal to circuit ground determines the operating frequency
of the oscillator The MC33794 is optimized for operation around 120 kHz
24 CLK Clock This terminal provides a square wave output at the same frequency as the
internal oscillator The edges of the square wave coincide with the peaks
positive and negative of the sine wave
25 VDD MON VDD Monitor This is connected through an internal voltage divider to VDD REG It allows
_ reduction of the voltage so it will fall within the range of the ADC on the MCU
26 VDD VDD Capacitor A capacitor is connected to this terminal to filter the internal analog regulated
supply This supply is derived from VPWR through internal VDD REG
27 VPWR Positive Power Supply 12 V power applied to this terminal will be converted to the regulated voltages
needed to operate the part It is also converted to 50 V internal VCC REG and
85 V internal VDD REG to power the MCU and external devices
28 VCC 50 V Regulator Output This output terminal requires a 47 μF capacitor and internal VCC REG
provides
a regulated 50 V for the MCU and for internal needs of the MC33794
29 AGND Analog Ground This terminal is connected to the ground return of the analog circuitry This
ground should be kept free of transient electrical noise like that from logic
switching Its path to the electrical current return point should be kept separate
from the return for GND
30 SHIELD Shield Driver This terminal connects to cable shields to cancel cable capacitance
MC33794
Sensors
4
Freescale Semiconductor
Table 1 SOICW-EP TERMINAL FUNCTION DESCRIPTION continued
Terminal
Terminal Formal Name
Definition
Name
32 GND Ground This terminal and metal backing is the IC power return and thermal radiator
conductor
35 TEST Test Mode Control This terminal is normally connected to circuit ground There are special
operating modes associated with this terminal when it is not at ground
3644 E1E9 Electrode Connections These are the electrode terminals They are connected either directly or through
coaxial cables to the electrodes for measurements When not selected these
outputs are grounded through the internal resistance
45 46 REF_A Reference Connections These terminals can be individually selected to measure a known capacitance
REF_B Or as additional electrodes value Unlike E1-E9 these two inputs are not grounded when not selected
E10 E11
47 ISO_OUT ISO-9141 Output This terminal translates ISO-9141 receive levels to 50 V logic levels for the
MCU
51 ISO_IN ISO-9141 Input This terminal accepts data from the MCU to be sent over the ISO-9141
communications interface It translates the 50 V logic levels from the MCU to
transmit levels on the ISO-9141 bus
53 ISO-9141 ISO-9141 Bus This terminal connects to the ISO-9141 bus It provides the drive and detects
signaling on the bus and translates it from the bus level to logic levels for the
MCU
54 LAMP_CTRL Lamp Control This signal is used to control the lamp driver A high logic level turns on the lamp
MC33794
Sensors
Freescale Semiconductor
5
IMUM
RATINGS
Table 2 imum Ratings
All voltages are with respect to ground unless otherwise noted Exceeding these ratings may cause a malfunction or
permanent damage to the device
Rating Symbol Value Unit
Peak VPWR Voltage VPWRPK 40 V
Double Battery VDBLBAT V
1 Minute imum TA 30?C 265
ESD Voltage V
Human Body Model 1 VESD1 ?2000
Machine Model 2 VESD2 ?200
Storage Temperature TSTG -55 to 150 ?C
Operating Ambient Temperature
TA -40 to 85 ?C
Operating Junction Temperature TJ -40 to 150 ?C
Thermal
Resistance
?CW
Junction-to-Ambient 3 RθJA 41
Junction-to-Case 4 RθJC 02
Junction-to-Board 5 RθJB 30
Lead Soldering Temperature for 10 Seconds TSOLDER 260 ?C
Notes
1 ESD1 performed in accordance with the Human Body Model CZAP 100 pF RZAP 1500
2 ESD2 performed in accordance with the Machine Model CZAP 200 pF RZAP 0
3 Junction temperature is a function of on-chip power dissipation package thermal resistance mounting site board temperature
ambient temperature air flow power dissipation of other components on the board and board thermal resistance In accordance with
SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal
4 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
MILSPEC 883 Method 10121 with the cold plate temperature used for the case temperature
5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8 Board temperature is measured on the top
surface of the board near the package
MC33794
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6
Freescale Semiconductor
STATIC ELECTRICAL CHARACTERISTICS
Table 3 Static Electrical Characteristics
Characteristics noted under conditions 90 V ? VPWR ? 18 V -40?
C ? TA ? 85?C unless otherwise noted Typical values noted
reflect the approximate parameter means at TA 25C under normal conditions unless otherwise noted Voltages are relative
to GND unless otherwise noted
Characteristic Symbol Min Typ Unit
Voltage Regulators
50 V Regulator Voltage VCC V
70 V ? VPWR ? 18 V 10 mA ? IL ? 75 mA CFILT 47 μF 475 50 525
Analog Regulator Voltage VANALOG V
90 V ? VPWR ? 18 V CFILT 47 μF
8075 85 8925
Out-of-Range Voltage Detector Terminal name VCC
50 V Low Voltage Detector VLV5 40 452 472 V
50 V High Voltage Detector VHV5 526 555 583 V
50 V Out-of-Range Voltage Detector Hysteresis VHYS5 005 V
ISO-9141 Communications Interface
Input Low Level 6 VIFINLO 030 033 VV
Input High Level 6 VIFINHI 053 07 VV
Input Hysteresis 6 VIFINHYS 02 VV
Output Low 6 VIFOLO 02 VV
Output High 6 VIFOHI 08 VV
Output Breakdown VIFZ V
IOUT 20 mA 40
Output Resistance RIFON
IOUT 40 mA 58
Current Limit IIFLIM mA
Sinking Current with VOUT 03 VPWR IN
60 90 120
Output Propagation Delay
TIFDLY μs
Out to ISO-9141 CLOAD 20 pF
80
ISO In
Logic Output Low
VIFOLO V
ISINK 10 mA
10
Logic Output Pull-Up Current IIFPU μA
VOUT 0 V 100
Input to Output Propagation Delay TIFDLY μs
ISO-9141 to ISO_IN R 10 k C 470 pF 70 V ? VPWR ? 54
L L
18 V
Notes
6 Ratio to VPWR
MC33794
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Freescale Semiconductor
7
Table 3 Static Electrical Characteristics continued
Characteristics noted under conditions 90 V ? VPWR ? 18 V
-40?C ? TA ? 85?C unless otherwise noted Typical values noted
reflect the approximate parameter means at TA 25C under normal conditions unless otherwise noted Voltages are relative
to GND unless otherwise noted
Characteristic Symbol Min Typ Unit
Electrode Signals
Total Variance Between Electrode Measurements 7 ELVVAR
All CLOAD 15 pF
30
Electrode imum Harmonic Level Below Fundamental 8
ELHARM dB
50 pF ? CLOAD ? 100 pF -20
Electrode Transmit Output Range
ELTXV V
50 pF ? CLOAD ? 100 pF 10 80
Receive Input Voltage Range
RXV 0 90 V
Grounding Switch on Voltage
SWVON V
ISW 10 mA
50
Shield Driver
Shield Driver Output Level SDTXV V
0 pF ? CLOAD ? 500 pF
10 80
Shield Driver Input Range SDIN 0 90 V
Grounding Switch on Voltage 9 SWVON 15 V
Logic IO
CMOS Logic Input Low Threshold VTHL 03 VCC
Logic Input High Threshold VTHH 07 VCC
Voltage Hysteresis VHYS 006 VCC
Input Current IIN μA
VIN VCC
10 50
VIN 0 V
-50 50
Signal Detector
Detector Output Resistance DETRO 50 k
LP_CAP to LEVEL Gain AREC 36 40 44 AV
LP_CAP to LEVEL Offset VRECOFF -33 -30 -27 V
Notes
7 Verified by design Not tested in production
8 Verified by design and characterization Not tested in production
9 Current into grounded terminal under test 10 mA
MC33794
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8
Freescale Semiconductor
Table 3 Static Electrical Characteristics continued
Characteristics noted under conditions 90 V ? VPWR ? 18 V
-40?C ? TA ? 85?C unless otherwise noted Typical values noted
reflect the approximate parameter means at TA 25C under normal
conditions unless otherwise noted Voltages are relative
to GND unless otherwise noted
Characteristic Symbol Min Typ Unit
Lamp Driver
On Resistance RLDDSON
IIN 400 mA
175 35
Current Limit ILDLIM A
VOUT 10 V
07 17
On-Voltage
VLDON V
IOUT 400 mA
14
Breakdown Voltage VLDZ V
IOUT 100 μA Lamp Off
40
Voltage Monitors
LAMP_MON to LAMP_SENSE Ratio LMPMON 01950 020524 02155 VV
PWR_MON to VPWR Ratio PWRMON 02200 02444 02688 VV
VDD MON to VDD Ratio V 045 05 055 VV
_ DD_MON
Supply
Quiescent supply current 11 Ipwr _ 70 _ mA
VPWR 14 V 10
Notes
10 Verified by design and characterization Not tested in production
11 No external devices connected to internal voltage regulators
MC33794
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Freescale Semiconductor
9
DYNAMIC ELECTRICAL
CHARACTERISTICS
Table 4 Dynamic Electrical Characteristics
Characteristics noted under conditions 90 V ? VPWR ? 18 V
-40?C ? TA ? 85?C unless otherwise noted Typical values noted
reflect the approximate parameter means at TA 25C under normal conditions unless otherwise noted Voltages are relative
to GND unless otherwise noted
Characteristic Symbol Min Typ Unit
OSC
OSC Frequency Stability 12 13
f STAB 10
OSC Center Frequency
f OSC kHz
R_OSC 39 k 120
Harmonic Content 12
OSCHARM dB
2nd through 4th Harmonic Level -20
5th and Higher -60
Shield Driver
Shield Driver imum Harmonic level below Fundamental 12
SDHARM dB
10 pF ? CLOAD ? 500 pF
-20
Shield Driver Gain Bandwidth Product 12 SDGBW MHz
Measured at 120 kHz
45
POR
POR Time-Out Period t PER 90 50 ms
Watchdog
Watchdog Time-Out Period tWDPER 50 68 250 ms
Watchdog Reset Hold Time tWDHLD 90 50 ms
Lamp Driver
Short Circuit to Battery Survival Time t SCB 30 ms
Notes
12 Verified by design and characterization Not tested in
production
13 Does not include errors in external reference parts
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