3数据手册stm32中文stm32f107vc

STM32F105xxSTM32F107xxConnectivityline,ARM-based32-bitMCUwith64/256KBFlash,USBOTG,Ethernet,10timers,2CANs,2ADCs,14communicationinterfacesFeaturesICore:ARM32-bitCortex™-M3CPU–72MHzumfrequency,LQFP10014×14mm1.25DMIPS/MHz(Dhrystone2.1)LQFP6410×10mmperformanceat0waitstatememoryaccessIUpto10timerswithpinoutremapcapability–Single-cyclemultiplicationandhardware–Uptofour16-bittimers,eachwithupto4divisionIC/OC/orpulsecounterandIMemoriesquadrature(incremental)encoderinput–64to256KbytesofFlashmemory–1×16-bitmotorcontroltimerwith–upto64Kbytesofgeneral-purposeSRAMdead-timegenerationandemergencystopIClock,resetandsupplymanagement–2×watchdogtimers(IndependentandWindow)–2.0to3.6VapplicationsupplyandI/Os–SysTicktimer:a24-bitdowncounter–POR,PDR,andprogrammablevoltagedetector(PVD)–2×16-bitbasictimerstodrivetheDAC–3-to-25MHzcrystaloscillatorIUpto14communicationinterfaceswithpinout–Internal8MHzfactory-trimmedRCremapcapability–Internal40kHzRCwithcalibration–Upto2×I2Cinterfaces(SMBus/PMBus)–32kHzoscillatorforRTCwithcalibration–Upto5USARTs(ISO7816interface,LIN,ILowpowerIrDAcapability,modemcontrol)–Sleep,StopandStandbymodes–Upto3SPIs(18Mbit/s),2withamultiplexedI2Sinterfacethatoffersaudio–VsupplyforRTCandbackupregistersBATclassaccuracyviaadvancedPLLschemesI2×12-bit,1µsA/Dconverters(16channels)–2×CANinterfaces(2.0BActive)with–Conversionrange:0to3.6V512bytesofdedicatedSRAM–Sampleandholdcapability–USB2.0full-speeddevice/host/OTG–Temperaturesensorcontrollerwithon-chipPHYthatsupports–upto2MSPSininterleavedmodeHNP/SRP/IDwith1.25KbytesofdedicatedI2×12-bitD/AconvertersSRAM–10/100EthernetMACwithdedicatedDMAIDMA:12-channelDMAcontrollerandSRAM(4Kbytes):IEEE1588hardware–Supportedperipherals:timers,ADCs,DAC,support,MII/RMIIavailableonallpackagesI2Ss,SPIs,I2CsandUSARTsIDebugmodeTable1.Devicesummary–Serialwiredebug(SWD)&JTAGinterfacesReferencePartnumber–Cortex-M3EmbeddedTraceMacrocell™STM32F105R8,STM32F105V8IUpto80fastI/OportsSTM32F105xxSTM32F105RB,STM32F105VB–51/80I/Os,allmappableon16externalSTM32F105RC,STM32F105VCinterruptvectorsandalmostall5V-tolerantSTM32F107RB,STM32F107VBSTM32F107xxICRCcalculationunit,96-bituniqueIDSTM32F107RC,STM32F107VCSeptember2009DocID15274Rev41/95ContentsSTM32F105xx,STM32F107xxContents1Introduction................................................92Description.................................................92.1Deviceoverview............................................102.2Fullcompatibilitythroughoutthefamily..........................112.3Overview.................................................122.3.1ARM®Cortex™-M3corewithembeddedFlashandSRAM.........132.3.2EmbeddedFlashmemory...................................132.3.3CRC(cyclicredundancycheck)calculationunit..................132.3.4EmbeddedSRAM.........................................132.3.5Nestedvectoredinterruptcontroller(NVIC)......................132.3.6Externalinterrupt/eventcontroller(EXTI).......................142.3.7Clocksandstartup.........................................142.3.8Bootmodes..............................................142.3.9Powersupplyschemes.....................................152.3.10Powersupplysupervisor....................................152.3.11Voltageregulator..........................................152.3.12Low-powermodes.........................................152.3.13DMA....................................................162.3.14RTC(real-timeclock)andbackupregisters......................162.3.15Timersandwatchdogs......................................172.3.16I²Cbus..................................................182.3.17Universalsynchronous/asynchronousreceivertransmitters(USARTs)182.3.18Serialperipheralinterface(SPI)...............................192.3.19Inter-integratedsound(I2S)..................................192.3.20EthernetMACinterfacewithdedicatedDMAandIEEE1588support.192.3.21Controllerareanetwork(CAN)...............................202.3.22Universalserialbuson-the-gofull-speed(USBOTGFS)...........202.3.23GPIOs(general-purposeinputs/outputs)........................202.3.24Remapcapability..........................................212.3.25ADCs(analog-to-digitalconverters)............................212.3.26DAC(digital-to-analogconverter)..............................212.3.27Temperaturesensor........................................222.3.28SerialwireJTAGdebugport(SWJ-DP).........................222/95DocID15274Rev4STM32F105xx,STM32F107xxContents2.3.29EmbeddedTraceMacrocell™................................223Pinoutsandpindescription..................................234Memorymap..........................................305Electricalcharacteristics....................................315.1Parameterconditions........................................315.1.1Minimumandumvalues...............................315.1.2Typicalvalues.............................................315.1.3Typicalcurves............................................315.1.4Loadingcapacitor.........................................315.1.5Pininputvoltage..........................................315.1.6Powersupplyscheme......................................325.1.7Currentconsumptionmeasurement...........................325.2Absoluteumratings....................................335.3Operatingconditions........................................345.3.1Generaloperatingconditions.................................345.3.2Operatingconditionsatpower-up/power-down..................355.3.3Embeddedresetandpowercontrolblockcharacteristics...........355.3.4Embeddedreferencevoltage.................................365.3.5Supplycurrentcharacteristics................................365.3.6Externalclocksourcecharacteristics...........................445.3.7Internalclocksourcecharacteristics...........................485.3.8PLL,PLL2andPLL3characteristics...........................495.3.9Memorycharacteristics.....................................505.3.10EMCcharacteristics........................................505.3.11Absoluteumratings(electricalsensitivity).................525.3.12I/Oportcharacteristics......................................535.3.13NRSTpincharacteristics....................................565.3.14TIMtimercharacteristics....................................575.3.15Communicationsinterfaces..................................585.3.1612-bitADCcharacteristics...................................685.3.17DACelectricalspecifications.................................735.3.18Temperaturesensorcharacteristics............................756Packagecharacteristics.....................................76DocID15274Rev43/95ContentsSTM32F105xx,STM32F107xx6.1Packagemechanicaldata....................................766.2Thermalcharacteristics......................................796.2.1Referencedocument.......................................796.2.2Selectingtheproducttemperaturerange........................807Partnumbering............................................82AppendixAApplicativeblockdiagrams...............................83A.1USBOTGFSinterfacesolutions................................83A.2Ethernetinterfacesolutions....................................85A.3Completeaudioplayersolutions................................88A.4USBOTGFSinterface+Ethernet/I2Sinterfacesolutions............89Revisionhistory....................................................924/95DocID15274Rev4STM32F105xx,STM32F107xxListoftablesListoftablesTable1.Devicesummary..........................................................1Table2.STM32F105xxandSTM32F107xxfeaturesandperipheralcounts..................10Table3.STM32F105xxandSTM32F107xxfamilyversusSTM32F103xxfamily..............11Table4.Timerfeaturecomparison..................................................17Table5.Pindefinitions...........................................................25Table6.Voltagecharacteristics....................................................33Table7.Currentcharacteristics....................................................33Table8.Thermalcharacteristics....................................................34Table9.Generaloperatingconditions...............................................34Table10.Operatingconditionsatpower-up/power-down................................35Table11.Embeddedresetandpowercontrolblockcharacteristics..........................35Table12.Embeddedinternalreferencevoltage.........................................36Table13.umcurrentconsumptioninRunmode,codewithdataprocessingrunningfromFlash.......................................................37Table14.umcurrentconsumptioninRunmode,codewithdataprocessingrunningfromRAM........................................................37Table15.umcurrentconsumptioninSleepmode,coderunningfromFlashorRAM.......38Table16.TypicalandumcurrentconsumptionsinStopandStandbymodes............38Table17.TypicalcurrentconsumptioninRunmode,codewithdataprocessingrunningfromFlash.......................................................41Table18.TypicalcurrentconsumptioninSleepmode,coderunningfromFlashorRAM..................................................................42Table19.Peripheralcurrentconsumption.............................................43Table20.High-speedexternaluserclockcharacteristics..................................44Table21.Low-speedexternaluserclockcharacteristics..................................44Table22.HSE3-25MHzoscillatorcharacteristics......................................46Table23.LSEoscillatorcharacteristics(fLSE=32.768kHz)...............................47Table24.HSIoscillatorcharacteristics...............................................48Table25.LSIoscillatorcharacteristics...............................................48Table26.Low-powermodewakeups...........................................49Table27.PLLcharacteristics.......................................................49Table28.PLL2andPLL3characteristics..............................................49Table29.Flashmemorycharacteristics...............................................50Table30.Flashmemoryenduranceanddataretention...................................50Table31.EMScharacteristics......................................................51Table32.EMIcharacteristics.......................................................52Table33.ESDabsoluteumratings.............................................52Table34.Electricalsensitivities.....................................................52Table35.I/Ostaticcharacteristics...................................................53Table36.Outputvoltagecharacteristics..............................................54Table37.I/OACcharacteristics.....................................................55Table38.NRSTpincharacteristics..................................................56Table39.TIMxcharacteristics......................................................57Table40.I2Ccharacteristics........................................................58Table41.SCLfrequency(fPCLK1=36MHz.,VDD=3.3V).................................59Table42.SPIcharacteristics.......................................................60Table43.I2Scharacteristics.......................................................63Table44.USBOTGFSstartuptime.................................................65DocID15274Rev45/95ListoftablesSTM32F105xx,STM32F107xxTable45.USBOTGFSDCelectricalcharacteristics.....................................65Table46.USBOTGFSelectricalcharacteristics........................................66Table47.EthernetDCelectricalcharacteristics.........................................66Table48.Dynamicscharacteristics:EthernetMACsignalsforSMI..........................66Table49.Dynamicscharacteristics:EthernetMACsignalsforRMII.........................67Table50.Dynamicscharacteristics:EthernetMACsignalsforMII..........................68Table51.ADCcharacteristics......................................................68Table52.RAINmaxforfADC=14MHz................................................69Table53.ADCaccuracy-limitedtestconditions........................................70Table54.ADCaccuracy..........................................................70Table55.DACcharacteristics......................................................73Table56.TScharacteristics........................................................75Table57.LQPF100–100-pinlow-profilequadflatpackagemechanicaldata.................77Table58.LQFP64–64pinlow-profilequadflatpackagemechanicaldata....................78Table59.Packagethermalcharacteristics.............................................79Table60.Orderinginformationscheme...............................................82Table61.PLLconfigurations.......................................................90Table62.ApplicativecurrentconsumptioninRunmode,codewithdataprocessingrunningfromFlash..............................................91Table63.Documentrevisionhistory.................................................926/95DocID15274Rev4STM32F105xx,STM32F107xxListoffiguresListoffiguresFigure1.STM32F105xxandSTM32F107xxconnectivitylineblockdiagram.................12Figure2.STM32F105andSTM32F107connectivitylineLQFP100pinout..............23Figure3.STM32F105andSTM32F107connectivitylineLQFP64pinout...............24Figure4.Memorymap............................................................30Figure5.Pinloadingconditions.....................................................31Figure6.Pininputvoltage.........................................................31Figure7.Powersupplyscheme.....................................................32Figure8.Currentconsumptionmeasurementscheme...................................32Figure9.TypicalcurrentconsumptiononVBATwithRTConvs.temperatureatdifferentVBATvalues.....................................................39Figure10.TypicalcurrentconsumptioninStopmodewithregulatorinRunmodeversustemperatureatdifferentVDDvalues....................................39Figure11.TypicalcurrentconsumptioninStopmodewithregulatorinLow-powermodeversustemperatureatdifferentVDDvalues...............................40Figure12.TypicalcurrentconsumptioninStandbymodeversustemperatureatdifferentVDDvalues......................................................40Figure13.High-speedexternalclocksourceACdiagram............................45Figure14.Low-speedexternalclocksourceACdiagram.............................45Figure15.Typicalapplicationwithan8MHzcrystal......................................46Figure16.Typicalapplicationwitha32.768kHzcrystal...................................47Figure17.I/OACcharacteristicsdefinition.............................................56Figure18.RecommendedNRSTpin.........................................57Figure19.I2CbusACwaveformsandmeasurementcircuit................................59Figure20.SPIdiagram-slavemodeandCPHA=0................................61Figure21.SPIdiagram-slavemodeandCPHA=1(1)..............................61Figure22.SPIdiagram-mastermode(1).........................................62Figure23.I2Sslavediagram(Philipsprotocol)(1)...................................64Figure24.I2Smasterdiagram(Philipsprotocol)(1)..................................64Figure25.USBOTGFSs:definitionofdatasignalriseandfalltime....................65Figure26.EthernetSMIdiagram...............................................66Figure27.EthernetRMIIdiagram...............................................67Figure28.EthernetMIIdiagram................................................67Figure29.ADCaccuracycharacteristics...............................................71Figure30.TypicalconnectiondiagramusingtheADC....................................71Figure31.Powersupplyandreferencedecoupling(VREF+notconnectedtoVDDA)..............72Figure32.Powersupplyandreferencedecoupling(VREF+connectedtoVDDA).................72Figure33.12-bitbuffered/non-bufferedDAC...........................................74Figure34.LQFP100,100-pinlow-profilequadflatpackageoutline..........................77Figure35.Recommendedfootprint(1).................................................77Figure36.LQFP64–64pinlow-profilequadflatpackageoutline...........................78Figure37.Recommendedfootprint(1).................................................78Figure38.LQFP100PDmaxvs.TA..................................................81Figure39.USBOTGFSdevicemode.................................................83Figure40.Hostconnection.........................................................84Figure41.OTGconnection(anyprotocol)..............................................85Figure42.MIImodeusinga25MHzcrystal............................................85Figure43.RMIIwitha50MHzoscillator...............................................86Figure44.RMIIwitha25MHzcrystalandPHYwithPLL..................................86DocID15274Rev47/95ListoffiguresSTM32F105xx,STM32F107xxFigure45.RMIIwitha25MHzcrystal.................................................87Figure46.Completeaudioplayersolution1............................................88Figure47.Completeaudioplayersolution2............................................88Figure48.USBOTGFS+Ethernetsolution............................................89Figure49.USBOTGFS+I2S(Audio)solution..........................................898/95DocID15274Rev4STM32F105xx,STM32F107xxIntroduction1IntroductionThisdatasheetprovidesthedescriptionoftheSTM32F105xxandSTM32F107xxconnectivitylinemicrocontrollers.FormoresonthewholeSTMicroelectronicsSTM32F10family,pleaserefertoSection2.2:Fullcompatibilitythroughoutthefamily.TheSTM32F105xxandSTM32F107xxdatasheetshouldbeinconjunctionwiththeSTM32F10referencemanual.Forinformationonprogram,erasingandoftheinternalFlashmemorypleaserefertotheSTM32F10Flashprogrammanual.ThereferenceandFlashprogrammanualsarebothavailablefromtheSTMicroelectronicswebsite.ForinformationontheCortex™-M3corepleaserefertotheCortex™-M3TechnicalReferenceManual,availablefromthewebsiteatthefollowingaddress:.2DescriptionTheSTM32F105xxandSTM32F107xxconnectivitylinefamilyincorporatesthehigh-performanceARM®Cortex™-M332-bitRISCcoreoperatingata72MHzfrequency,high-speedembeddedmemories(Flashmemoryupto256KbytesandSRAMupto64Kbytes),andanextensiverangeofenhancedI/OsandperipheralsconnectedtotwoAPBbuses.Alldevicesoffertwo12-bitADCs,fourgeneral-purpose16-bittimersplusatimer,aswellasstandardandadvancedcommunicationinterfaces:uptotwoI2Cs,threeSPIs,twoI2Ss,fiveUSARTs,anUSBOTGFSandtwoCANs.EthernetisavailableontheSTM32F107xxonly.TheSTM32F105xxandSTM32F107xxconnectivitylinefamilyoperatesinthe–40to+105°Ctemperaturerange,froma2.0to3.6Vpowersupply.Acompensivesetofpower-savingmodeallowsthedesignoflow-powerapplications.TheSTM32F105xxandSTM32F107xxconnectivitylinefamilyoffersdevicesintwodifferentpackagetypes:from64pinsto100pins.Dependingonthedevicechosen,differentsetsofperipheralsareincluded,thedescriptionbelowgivesanoverviewofthecompleterangeofperipheralsproposedinthisfamily.DocID15274Rev49/95DescriptionSTM32F105xx,STM32F107xxThesefeaturesmaketheSTM32F105xxandSTM32F107xxconnectivitylinemicrocontrollerfamilysuitableforawiderangeofapplications:GMotordriveandapplicationcontrolGMedicalandhandheldequipmentGIndustrialapplications:PLC,inverters,printers,andscannersGAlarmsystems,intercom,andHVACGHomeaudioequipmentFigure1showsteralblockdiagramofthedevicefamily.2.1DeviceoverviewTable2.STM32F105xxandSTM32F107xxfeaturesandperipheralcountsPeripherals(1)STM32F105RxSTM32F107RxSTM32F105VxSTM32F107VxFlashmemoryinKbytes6412825612825664128256128256SRAMinKbytes20326448642032644864EthernetNoYesNoYesGeneral-purpose4TimersAdvanced-control1Basic2SPI(I2S)(2)3(2)3(2)3(2)3(2)I2C2121CommunicationUSART5interfacesUSBOTGFSYesCAN2GPIOs518012-bitADC2Numberofchannels1612-bitDAC2Numberofchannels2CPUfrequency72MHzOperatingvoltage2.0to3.6VAmbienttemperatures:–40to+85°C/–40to+105°COperatingtemperaturesJunctiontemperature:–40to+125°CPackageLQFP64LQFP1001.PleaserefertoTable5:PindefinitionsforperipheralavailabilitywhentheI/Opinsaresharedbytheperipheralsrequiredbytheapplication.2.TheSPI2andSPI3interfacesgivetheflexibilitytoworkineithertheSPImodeortheI2Saudiomode.10/95DocID15274Rev4STM32F105xx,STM32F107xxDescription2.2Fullcompatibilitythrough