IC封装制程英语

磨划英文中文bending扭曲bluetape蓝膜Bluetapebubble蓝膜气泡Bluetapecrinkle蓝膜起皱Bluetapedisrepair蓝膜破损Chipscratch晶粒刮伤chucktable磨盘cleaner清洗机CO2bubblerCO2气泡机Cuttingburr蓝膜毛边detaping揭膜Diechipout芯片破碎﹑崩角、崩碎、裂角diecontamination芯片污染diecrack破裂﹑裂痕、开裂DIELIFT-OFF芯片脱落diescratch芯片擦伤、芯片刮伤doubletape双层蓝膜磨划dryspinning甩干feedspeed进刀速度Filmmounter贴膜机flange法兰、凸缘foreignmaterial外来物grindingmachine磨片机Grindingtape磨片膜Grindingwheel磨轮Hardblade硬刀Incompletesawing未切完inkdie色点芯片Inkpeeling墨点脱落inksplatter墨点溅散kerfwidth切割宽度metalcorrosion腐蚀metaldiscolor金屬電路層变色non-contactsetup(N.C.S.)非接触测高offsetsawing切割偏移overcoatcrazing玻璃层龟裂overcoatdamage保护层受损partialdie不完全片probingmark針测印SMT英文中文Capacitance电容Cleaningmachine清洗机Coldjoint冷焊Damage损傷Excessparts多件Floating浮動HeelOverparts侧件Inductance电感Insufficientsolder锡不足Missingparts缺件Mounting贴片MountingM/C贴片机MV-boat载板Solderpasteprinting锡膏印刷IRReflowMachine紅外線回流焊机Resistance电阻Shift偏移SurfaceMountTechnical(SMT)表面貼裝技術SMTCleaningSMT清洗SMTReflowSMT回流SMTSMTCleaningSMT清洗SMTReflowSMT回流Solderball锡珠/錫球Solderpaste锡膏SolderPasteAbnormality锡膏量异常SolderPasteOffset锡膏偏移SolderPasteOpen锡膏開路SolderpasteprintM/C锡膏印刷机SolderPasteShort锡膏短路SolderPasteThicknessAbnormality锡膏厚度异常SolderpastethicknesstestM/C锡膏测厚仪Solderpastewhisker锡膏搅拌机Stencil印刷用钢板Substrateexchanger基板排片交換机Temperaturerecorder测温仪Tombstone立碑TurnOverparts零件反向Wrongparts错件WrongSolderPaste锡膏用错D/B英文中文Anisotropicconductivepaste(film)异方性导电胶(膜)bakelitetip胶木吸嘴bondingdelay装片延时Delaminationofbetweenepoxyanddiepad黏膠與引線框基島之間的分層Delaminationofbetweenepoxyanddicebackside黏膠與芯片背面之間的分層DieBondforce装片压力DieBonndWrongOrientation装片错方向diebonder装片机Diebonding装片DieCrack芯片裂缝CoatingMaterial點膠材料DieCoating芯片表面點膠Diedisorientation装片反向Diescratch晶片刮伤Dieshear推晶Diesheartester推晶机Diesheartool推晶刀Dieshift晶片偏移Dietilt晶片歪斜DispensingTool点胶头Doublechip雙晶片EdgeDie晶圓边沿芯片Epoxy粘胶ConductiveEpoxy導電膠/銀膠W/B英文中文2ndbondOffcenter点斜偏(偏離設定值)2ndbondpower第二点球焊功率Ag-Alintermetalliccompound金球底部金铝结合层Alpadpeel失铝或是鋁層脫層Aluminumlayer铝层Aluminumpeeling铝脱Ballbondshort球體短路Balldeformation球體变形ballheight球體厚度ballneckbroken球颈断裂Balloffcenter球偏ballshear推球Ballsheartester推球测试机bondhead焊头Bondoffset球偏(偏離設定值)bondpaddamage鋁墊/压区受损bondpadpitch鋁墊與鋁墊的中心距離bondpower超音波功率bondingarea(bondingpad)焊接压区(鋁墊/壓區)bondingareatemperature键合区温度capillary劈刀Clampper压板copperwire铜丝cratering弹坑Molding英文中文Automold自动包封机AutoFrameLoadingSystem(AFLS)自動排片机AirGun气枪airvent排气槽/排气孔airventclog排气不畅Bodycontamination塑封體胶污染Bodydiscolor塑封體变色Bodyflowmark塑封體水痕印Bodyscratch塑封體刮伤brassbar铜棒Bubble/blister气泡cavity型腔clampingpressure合模压力cleaningcompound清模饼clipforstackmagazine盘扣(stackmagazine中的夹子)Componentexposure元件外露CompoundPreheater塑封料预热机compoundstorage料饼存放compoundtype料饼型号constringencyvoid缩孔copperexposure露铜curetime固化时间degate去浇口digimite点温计切割英文中文Punchdie冲压治具SawingBlade切割刀Bodychip-out胶体崩碎Bodycrack胶体裂痕Bodyscratch胶体刮伤Cuttingunthrough未切穿Cuttingshift切割偏移Cuttingsize切割尺寸Garnetgrindingsand石榴砂PackageCleaner塑封體清洗机PackagedryingM/C塑封體烘烤烘箱Packagemounter塑封體贴片机PackagepunchingM/C塑封體冲压机PackagesawingM/C塑封體切割机PickandplaceM/C塑封體取放机Substratechip-out基板崩碎Substratecrack基板裂痕Substratedelamination基板分层TrayTray盘WaterjetM/C水刀切割机Test英文中文Loadboard负载测试板anti-staticplastictube抗静电塑料管BendLead彎脚Bin檔位CarrierTape载带covertape盖带DUTboardDUT板EmptyPocket空包O.G.I.Yield外次率Open开路Short短路Pack-in-Tube管装PeelBackForce拉力Peelingoff分離/脫離PIN1identification第一腳标示reel卷盘rubberpickhead橡膠材取放头SampleSize(SS)樣品數sealingtemperature封合温度Socket插座TestSocket測試用插座Tape&Reel编带Tape&Reelmachine编带机tapping编带作業TestProgram测试程序tester测试机Package英文中文Antistaticrubberband防静电橡皮圈barcodlabel条形码標籤Desiccantpouch干燥剂drypackingbag干燥包装袋Humidityindicatorcard湿度指示卡Outlinescanner尺寸检验机packingbox包装箱packingmaterial包装材料Pisabox/Innerbox包装内箱QAstamp出厂检验合格章Shippingbox包装外箱Labelofshipping出货标签Vacuumbag真空包装袋VacuumpackM/C真空包装机WrappingM/C包装机