磨片工艺原理 Backgrind process

BackgrindprocessZhuXin12July2005BackgrindprocessBackendprocessflow:TapingBackgrindingDetapingThicknessmeasuringMountingSawingSEZBackmetalTapingBackgrindingThicknessmeasuringStressreliefDetapingBacksidecleanBackmetalBackgrindprocessBackgrindprocessBackgrindTape:Non–UVTapeUVTapeBackgrindprocessGRINDDFG8508”wafercapability2spindles3chuckstableBackgrindprocessTHICKNESSMEASURINGHighAccuracyHeightGaugeandcompletelyclosedloopZ-axiscontrolsystemMinimizingwafertowaferthicknessvariationTwoprobegaugeisstandardizedonDFG850BackgrindprocessWheelRecipe(grindingconditions)TapeselectionMachinespecificationOptimalconditionBackgrindprocessWheelBaseBacksideBackgrindprocessWheelBasicElementsIF-01-1-4/6-B-K04GritSizeMeshSizeGritSize(um)MeshSizeGritSize(um)#320　#14005/12#36040/60#15005/10#40030/40#17004/8#60020/30#20004/6#80010/20#30002/6#10008/20#40002/4#12008/16　　BackgrindprocessBackgrindprocessBackgrindprocessBackgrindquality:1.ThicknessandTTV2.Edgechipping3.Roughness4.Warpage5.DiestrengthBackgrindprocessDiestrengthtestmethodBasejigChipφ7R5GroundsurfacedownsideDiestrengthtestjigCross-sectionviewTopsideview-Placeachipdiced20x20mmonajigwith7mmhole.(Groundsurfacedownside)-Breakachipwith5mmballtypepushjigBackgrindprocessBackgrindprocess