BGA Fanout 0[1].8mm

©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out PTH ( through hole ), µvia and a mix of both are possible, depends on pcb density, other components, # layers ... HDIPTH ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm 1.PTH Class 6 DOG BONE DESIGN ONE LINE BY CHANEL Design of Selective NI/AU offers a better mask adhesion for BGA rework ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm 1.PTH Class 6, high number of layers Drill diameter 0.35 / Pad size 0.64 / Track & Gap 0.12 mm FPGA ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm PTH Class 8, PHD 0.25 / Pad size 0.5 / Track & Gap 0.1 mm High speed design request 2 LINES BY CHANNEL ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm 2.Mix 0.5+X+0.5 Class 8 PHD150µ FPGA ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm 2.Mix 0.5+X+0.5 Class 8 PCB final thickness constraint High speed FPGA design ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm 3.Only µvia: 1+X+1, 2+X+2 & buried PTH High density TOP/BOTTOM Interconnections of 1 mm BGA ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 1.0 mm Easy way to introduce impedance lines 1.5+X+1.5 Class 7 ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.8 mm Pitch 0.8 mm = on the edge of through hole technology Depends on pcb density, other components, BGA pad size,.. 0.5 mm 0.12 mm 0.73 mm 1.13 mm 0.4 mm 0.4 mm 0.8 mm 0.25 Class 8 Drill diameter 0.25 Pad size 0.5 Track & Gap 0.1 mm ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.8 mm PTH with 0 LINES / CHANNEL Class 7 Pin escape tracks on TOP : selective NI/AU is prefered for high reliability rework process TOP/BOTTOM I/O via design ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.8 mm PTH with 1 LINE CHANNEL Class 8 ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.8 mm µvia is a solution µvia dog bone is preferred Class 8 or Class 7 Drill diameter 0.15 Pad size 0.3 or 0.35 Track & Gap 0.1 mm ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.8 mm 0.5+X+0.5 Class 7 / 8 depending of the BGA pin escape 1 or 2 lines / µvia channel ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.8 mm 1.5+X+1.5 Class 8 High density of BGA / SMD components on TOP / BOTTOM design 1+X+1 µvia in SMD pads ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.5 mm 2.5+X+2.5 Class 9 Pitch 0.5 mm = NSMD / µvia in pad is needed Problem with voids in solder balls … ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.5 mm Pitch 0.5 mm = µvia with via in pad is needed Voids possibility 0.5+X+0.5 Class 9 ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.5 mm Don’t use “solder mask defined” pads Poor assembly connection especially with void Higher soldering reliability SMD design NSMD design ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.5 mm Pitch 0.5 mm = µvia with via offset in pad is preferred 1.5+X+1.5 Class 9 No more voids with µvias Offset ©ACB / sleroux@atlantec.fr / NPI 2005 FLIP-CHIP Fan out: 0.4 mm SBU 0.5+X+0.5 Classe 10 for FLIP-CHIP ©ACB / sleroux@atlantec.fr / NPI 2005 FLIP-CHIP Fan out: 0.4 mm SSBU DESIGN on 4 layers Classe 9 High reliability FLIP-SHIP pads design ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: 0.4 mm 6 Layers high speed SSBU DESIGN ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: SSBU or SBU SSBU design with no TOP / BOTTOM BURIED VIA SBU design with PTH buried vias ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out: O.4 mm EVALUATION Classe 10 DESIGN ©ACB / sleroux@atlantec.fr / NPI 2005 BGA Fan out Eyes on the future, Feet on the ground To start with a new technology, use early involvement of somebody with experience Our support is realistic and conservative, but you are sure to get pcb’s afterwards BGA Fan out BGA Fan out: 1.0 mm BGA Fan out: 1.0 mm BGA Fan out: 1.0 mm BGA Fan out: 1.0 mm BGA Fan out: 1.0 mm BGA Fan out: 1.0 mm BGA Fan out: 1.0 mm BGA Fan out: 0.8 mm BGA Fan out: 0.8 mm BGA Fan out: 0.8 mm BGA Fan out: 0.8 mm BGA Fan out: 0.8 mm BGA Fan out: 0.8 mm BGA Fan out: 0.5 mm BGA Fan out: 0.5 mm BGA Fan out: 0.5 mm BGA Fan out: 0.5 mm FLIP-CHIP Fan out: 0.4 mm FLIP-CHIP Fan out: 0.4 mm BGA Fan out: 0.4 mm BGA Fan out: SSBU or SBU BGA Fan out: O.4 mm BGA Fan out